DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µPC7073 µPC7073 ANALOG SUBSCRIBER LINE LSI (BS-SLIC) The µPC7073 is a BS-SLIC that can be used in analog subscriber circuits such as private branch exchangers (PBXs) and switching equipment for central offices. It features two of the functions required for analog subscriber circuits: subscriber line feed control and subscriber line supervision. Use of the µPC7073 in combination with a digital CODEC (µPD9903) can reduce the number of components required in analog subscriber circuits. FEATURES • Single-chip, monolithic LSI (bipolar) • Constant-resistance feed or semi constant-current feed Note • 200-Ω feed, 400-Ω feed, or Tip-to-Ring pin feedout status (HIGH and WET) • On-chip metering signal superposing circuit • On-hook sending and receiving • Loop detection Note • Ground detection and ground-fault/power contact protection Note • Three on-chip relay drivers (flyback prevention diode must be externally provided) • Two power supply voltages (–48 V and +5 V) • Low power consumption: 110 mW (TYP., when on hook) Note Requires µPD9903. ORDERING INFORMATION Part Number Package µPC7073GT 48-pin plastic shrink SOP (375 mil) The information in this document is subject to change without notice. Document No. S10896EJ2V0DS00 (2nd edition) (Previous No. ID-3576) Date Published June 1996 P Printed in Japan © 1996 µPC7073 PIN CONFIGURATION 48-pin plastic shrink SOP (375 mil) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 µ PD7073GT DCOUT3 DCOUT2 DCOUT1 DCIN1 DCIN2 BBOUT ASCN AGDT BIAS RX ACOM NC NC NC GND1 NC PD ALM BCUT RC1 RC2 RC3 VBB TEF 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 VCC TTXIN CPSR RB RE NC RS NC TS NC TE TB CDC TX OPIN– OPIN+ REF GND2 NC RY3 NC RY2 NC RY1 ACOM : ANALOG COMMON VOLTAGE RB AGDT : ANALOG GROUND DETECTION SIGNAL OUT RC1 -RC3 : : RING BASE RELAY CONTROL IN ALM : ALARM IN RE : RING EMITTER ASCN : ANALOG LOOP DETECTION SIGNAL OUT R EF : RING EMITTER PROTECT FEED BBOUT : V BB VOLTAGE INFORMATION OUT RS : RING SENSE BCUT : BATTERY FEED CUT SIGNAL IN RX : SIGNAL RECEPTION IN BIAS : BIAS LEVEL RY 1-RY 3 : CDC : DC FEEDBACK CAPACITOR TB : TIP BASE CPSR : POWER SUPPLY REJECTION CAPACITOR TE : TIP EMITTER DC IN1, DC IN2 : DC FEEDBACK CONTROL IN T EF : TIP EMITTER PROJECT FEED DC OUT1-DC OUT3 : DC FEEDBACK CONTROL OUT TS : TIP SENSE GND1, GND2 : GROUND TTXIN : TELETAX SIGNAL IN RELAY DRIVER OUT NC : NO CONNECTION TX : TRANSSMISSION OUTPUT OP IN+ : TELETAX SIGNAL CANCEL IN (+) VBB : NEGATIVE POWER SUPPLY (–48 V) OP IN– : TELETAX SINGAL CANCEL IN (–) VCC : POSITIVE POWER SUPPLY (+5 V) PD : POWER DOWN CONTROL IN 2 µPC7073 BLOCK DIAGRAM GND1 VCC GND2 RY1 RY2 RY3 RC 1 Relay drivers T EF RC 2 RC 3 DC OUT2 AGDT Σ TB ASCN TE DC OUT3 DC OUT1 TX DC IN1 TS Tip + RS Ring DC IN2 + L.P.F CDC + RX BIAS RE ACOM Bias circuit RB BB OUT V BB R EF CPSR VBB Logic circuits TTXIN OP IN+ OP IN– PD ALM BCUT V BB 3 µPC7073 CONTENTS 1. PIN FUNCTIONS ............................................................................................................................. 5 2. USE CAUTIONS .............................................................................................................................. 7 3. ELECTRICAL SPECIFICATIONS ................................................................................................... 8 3.1 Discrete unit ratings ............................................................................................................................... 8 3.2 Combined specifications with µPD9903 .............................................................................................. 10 4. SYSTEM APPLICATION EXAMPLE USING µPC7073 AND µPD9903 .................................... 14 5. PACKAGE DRAWING ..................................................................................................................... 15 6. RECOMMENDED SOLDERING CONDITIONS ............................................................................ 4 16 µPC7073 1. PIN FUNCTIONS Number Pin Name I/O Function 1-3 DCOUT1-DCOUT3 O DC feedback control output [to the µPD9903’s pin 48-46] 4, 5 DCIN1, DCIN2 I DC feedback control input [to the µPD9903’s pin 45, 44] 6 BBOUT O VBB voltage information output [to the µPD9903’s pin 43] 7 ASCN O Tip-Ring difference current detection signal output [to the µPD9903’s pin 42] 8 AGDT O Tip-Ring sum current detection signal output [to the µPD9903’s pin 41] 9 BIAS I Bias level input. Connect to µPD9903’s AIN pin [to the µPD9903’s pin 40] 10 RX I Receiving input for 4W side [to the µPD9903’s pin 39] 11 ACOM I Signal reference voltage (2.4 V TYP) input for 4W side [to the µPD9903’s pin 37, 38] 12-14, 16, 26, 28, 30, 39, 41, 43 NC – No-connection pins. Leave these pins unconnected. 15 GND1 – Ground pin 1, for circuit grounding 17 PD I Power-down control H: Power-up TTL level L: Power-down [to the µPD9903’s pin 32] 18 ALM I Ground-fault/power line contact protection mode select input H: Protect mode TTL level L: Normal feed [to the µPD9903’s pin 31] 19 BCUT I Feed-out select input H: Feed-out TTL level L: Normal feed [to the µPD9903’s pin 30] 20 RC1 I Relay control for ringer transmission, high active [to the µPD9903’s pin 29] 21 RC2 I Relay control for line test, high active [to the µPD9903’s pin 28] 22 RC3 I Relay control for network test, high active [to the µPD9903’s pin 27] 23 VBB – Negative power supply (–48 V) 24 TEF O Feed resistor pin connection for Tip side during ground-fault/power line contact detection 25 RY1 O Relay control for ringer transmission, open collector 27 RY2 O Relay control for line testing, open collector 29 RY3 O Relay control for network testing, open collector 31 GND2 – Ground pin 2, relay driver 32 REF O Ring feed resistor pin connection for ground-fault/power line contact detection 33 OPIN+ I TTX (Teletax) signal cancel circuit input pin (+) 34 OPIN– I TTX signal cancel circuit input pin (–) 35 TX O Transmission output for 4W side. Connect with BIAS pin via CAC capacitor. 36 CDC – Connect to DC feedback capacitor Connect CDC capacitor to this pin 37 TB O Tip-side auxiliary power transistor base connection pin 38 TE O Tip-side feed amplifier output pin. Connect with TS pin via RFT resistor. 40 TS I/O Tip pin for 2W side 42 RS I/O Ring pin for 2W side 5 µPC7073 Number 6 Pin Name I/O Function 44 RE O Ring-side feed amplifier output pin. Connect with RS pin via RFR resistor. 45 RB O Ring-side auxiliary power transistor base connection pin 46 CPSR – Connect a capacitor for power supply noise eliminator 47 TTXIN I TTX signal input pin 48 VCC – Positive power supply (+5 V) µPC7073 2. USE CAUTIONS (1) Combined characteristics of µPC7073 and µPD9903 • The µPC7073 is designed to be used in combination with the µPD9903. Therefore, first half of the electrical characteristics described below are ratings for the µPC7073 as a discrete unit while the second half are combined ratings that include the µPD9903. • Subscriber circuit constants that are determined by factors such as termination impedance are configured to enable setting by external order parameters. Consequently, input of an order that is not suitable for the target impedance may result in failure to obtain the required characteristics. (2) Absolute maximum ratings Application of voltage or current in excess of the absolute maximum ratings may result in damage. Be especially cautious about surges, etc. (3) Load of by-pass capacitor Because the µ PC7073 and µ PD9903 use several internal high-frequency operational amplifiers, high power supply impedance can cause instability (such as oscillation) in these internal operational amplifiers. To suppress such instability and eliminate power supply noise, connect by-pass capacitors (CACOM = approx. 0.1 µ F) having superior high frequency characteristics as close as possible to the µ PC7073’s power supply pins (V BB and V CC) and the µ PD9903’s power supply pins (AVDD and DV DD). (4) Addition of ACOM pin connection capacitor The voltage of the ACOM pin between the µ PC7073 and µ PD9903 is the signal source reference voltage for the µ PC7073. Superposition of noise on this pin may have adverse effects on transmission characteristics. Therefore, make the wires between the ACOM pin and the two LSIs as short as possible, and connect capacitors (C ACOM = approx. 0.1 µ F) having superior high frequency characteristics as close as possible to the pins. (5) Overcurrent prevention measures Due to its structure, power to the µ PC7073 must first be supplied to a low-voltage potential (VBB). Accordingly, if power is supplied first to a power supply pin other than VBB, an overcurrent will flow within the µ PC7073 (an overcurrent will not flow if power is input to all power supply pins). Therefore, if feeding to a power supply pin other than VBB first, connect an external diode and limiting resistor (rated at several Ω) in the directions described below. • Reverse-bias direction between VBB pin and VCC pin. • Reverse-bias direction between VBB pin and GND. • Reverse-bias direction between VCC pin and GND. 7 µPC7073 3. ELECTRICAL SPECIFICATIONS 3.1 Discrete unit ratings Absolute maximum ratings (TA = +25 °C) Parameter Power supply voltage Symbol Conditions Rating Units V VBB Including spike voltage –63 to +0.3 VCC Including spike voltage –0.3 to +7.0 VACOM ACOM pin –0.3 to VCC + 0.3 VIN0 RX pin –0.3 to VCC + 0.3 VIN1 TS, RS, TE, and RE pins VIN2 TTXIN pin Logic input voltage VIN3 BCUT, ALM, PD, RC1, RC2, and RC3 pins Relay driver output current IOL RY1, RY2, and RY3 pins 40 mA Power consumption PT Thermal resistance: 160 °C/W, TA = 70 °C 1 W Ambient operating temperature TA 0 to 70 ˚C Storage temperature Tstg –65 to +150 Input voltage Caution VBB – 0.3 to VCC + 0.3 To be defined –0.3 to VCC + 0.3 If the absolute maximum rating for any of the above parameters is exceeded even momentarily, it may adversely affect the quality of this product. In other words, these absolute maximum ratings have been set to prevent physical damage to the product. Do not use the product in such a way as to exceed any of these ratings. Recommended operating conditions Parameter Power supply voltage Symbol MIN. TYP. MAX. Units VBB –58 –48 –42 V VCC 4.75 5.0 5.25 2.38 2.4 2.42 0 25 70 ˚C 2.0 VCC V 0 0.8 VACOM Ambient operating temperature TA High level input voltage VIH Low level input voltage VIL Digital input rise and fall times tR Conditions ACOM pin BCUT, ALM, PD, RC1, RC2, and RC3 pins BCUT, ALM, PD, RC1, RC2, and RC3 pins 200 tF 200 0 50 Ω –0.1 +0.1 V 200 Ω × 2 feeding modes 1900 Ω 400 Ω × 2 feeding modes 1500 RX drive impedance RX-ACOM offset voltage Loop resistance (line resistance RL VBB = –51 V + termination resistance) Terminal leakage current during on-hook transmission ION-LEAK AC inductive current Ilong Note 8 ns 0 f = 60 Hz, 2Pw-Tr Note During loop detection (one line), during ground detection (one line) Pw-Tr is a power transistor for feeding. 8 mA 5.0 mArms µPC7073 DC Characteristics (V BB = –42 to –58 V, VCC = 5 V ± 0.25 V, T A = 0 to 70 ˚C, combined characteristics with µ PD9903) Parameter On-hook supply current 1 Symbol IBB1 ICC1 Conditions On-hook, including IPw-Tr Note Ilong = 0 mA, MIN. IL = 0 mA TYP. MAX. 1.9 VBB = –48 V Units mA 1 VCC = +5 V Off-hook supply current 1 IBB2 ICC2 Off-hook, not including IPw-Tr Note IL = 20 mA Ilong = 0 mA, VBB = –48 V 4.3 2.0 VCC = +5 V On-hook supply current 2 IBB3 ICC3 On-hook, including IPw-Tr Note IL = 0 mA Ilong = 0 mA, VBB = –58 V 2.3 2.9 1.3 1.7 4.4 5.5 2.2 2.8 3 3.9 2.1 2.7 VCC = +5.25 V Off-hook supply current 2 IBB4 ICC4 Off-hook, not including IPw-Tr Note IL = 20 mA Ilong = 0 mA, VBB = –58 V VCC = +5.25 V Power current during IBB6 on-hook transmission ICC6 On-hook, including IPw-Tr Note IL = 0 mA Ilong = 0 mA, VBB = –58 V VCC = +5.25 V ACOM input current IACOM ACOM pin µA On-hook –100 –16 +100 Off-hook –100 0 +100 8 12 16 1.0 1.5 mA RX input current IRX RX, VRX = 2.4 V Relay driver input current IIH VI = 5.0 V For each RC1, RC2, and RC3 pins Relay driver output VOL IOL = 35 mA For each RY1, RY2, and RY3 pins +1.1 V Digital pin high level input current IIH VI = 2.0 V For each BCUT, ALM, PD, RC1, RC2, and RC3 pins 0.5 mA Digital pin low level input current IIL VI = 0.0 V For each BCUT, ALM, PD, RC1, RC2, and RC3 pins voltage BCUT : IL = 50 mA → | IL | ≤ 1 mA Control input voltage µA 50 2.0 V : IL = 50 mA → – IL × 90 % : IL = 50 mA → | IL | ≤ 20 mA BCUT, IL = 50 mA → – IL × 90 % 0.8 DC feed resistance RBF 200 Ω feed 400 Ω feed 180 360 High and wet impedance RH&W RL = 1900 Ω AC/DC 100 VBB = –48 V RTE5K/RRE5K = 3.6 kΩ 12.1 Ground-fault/power contact drooping current Note 200 400 220 440 Ω kΩ 13.1 14.1 mA IPw-Tr is the current to the power transistor for feeding. 9 µPC7073 3.2 Combined specifications with µPD9903 DC characteristics µ PC7073 (V BB = –42 to –58 V, V CC = 5 V ± 0.25 V, T A = 0 to 70 ˚C, 18 ≤ I L ≤ I LMAX (mA)) µ PD9903 (T A = 0 to 70 ˚C, V DD = 5 V ± 0.25 V, VDD = VAG = 0 V, f DCLK = 2048 kHz) Parameter DC feed resistance Minimum loop unit Maximum current setting Pin voltage during on-hook Voltage between lines Symbol RBF ILMIN ILMAX Conditions MIN. TYP. MAX. Units 200 Ω feed 180 200 220 Ω 400 Ω feed 360 400 440 VBB = –51 V 200 Ω feed 21.7 22.2 22.6 RL = 1900 Ω 400 Ω feed 18.2 18.8 19.3 ILMAX = 76 mA setting 200 Ω feed 70 76 82 400 Ω feed 50 55 60 ILMAX = 45 mA setting 40 45 50 ILMAX = 35 mA setting 31 35 39 VTS Normally on-hook, between Tip and GND, VBB = –48 V 2.25 2.55 2.85 VRS Normally on-hook, between Ring and VBB, VBB = –48 V 3.05 3.35 3.65 VTS On-hook transmission, between Tip and GND, VBB = –48 V 2.25 2.55 2.85 VRS On-hook transmission, between Ring and VBB, VBB = –48 V 3.05 3.35 3.65 VTS VBB = –48 V VBB – 7.0 VBB – 5.9 VBB – 5.0 mA mA V V during on-hook Supervisory control – VBB fault voltage 10 VBBF 32 35 38 V µPC7073 Parameter Loop detection operating resistance (during normal transmission) Symbol RON1 Conditions Includes termination resistance Loop detection operating resistance (during on-hook transmission) RON2 Includes termination resistance RON3 Includes termination resistance 200 Ω feed 400 Ω feed 200 Ω feed 4540 resistance 400 Ω feed 4140 RON4 Includes termination resistance Ground detection 1 (C/O) non-operating resistance Ground-fault/power line contact detection operating resistance RON6 2500 2100 Ω 1900 1500 Ω 2960 2560 Ω 5.2 kΩ Ω Includes termination resistance Off-hook stage ILMAX = 45/76 mA 340 ILMAX = 35 mA 480 Includes termination resistance ILMAX = 45/76 mA 870 ILMAX = 35 mA 1130 operating resistance RON7 Includes termination resistance Ground-fault/power line contact release operating resistance Note Units 20 Ground-fault/power line contact detection non- Ground-fault/power line contact release nonoperating resistance MAX. 2840 2440 Loop release operating Ground detection 1 (C/O) operating resistance TYP. 3900 3500 200 Ω feed 400 Ω feed 200 Ω feed 400 Ω feed Loop detection non-operating resistance (during on-hook transmission) Loop release non-operating resistance 200 Ω feed 400 Ω feed 200 Ω feed 400 Ω feed Loop detection non-operating resistance (during normal transmission) MIN. Ω 1.4 kΩ 10 The above values are resistance-converted values. 11 µPC7073 Transmission Characteristics µPC7073 (VBB = –42 to –58 V, VCC = 5 V ± 0.25 V, TA = 0 to 70 ˚C, 18 ≤ IL ≤ ILMAX (mA)) µPD9903 (TA = 0 to 70 ˚C, VDD = 5 V ± 0.25 V, VDG= VAG = 0 V, fDCLK = 2048 kHz) Parameter Insertion loss Transfer loss frequency characteristics Gain tracking (tone method) Return loss Symbol IL Conditions MIN. TYP. MAX. Units A-D input signal 0 dBm0 1 kHz –0.45 0.0 +0.45 dB D-A input signal 0 dBm0 1 kHz –0.45 0.0 +0.45 FRX A-D Reference input signal 1015 Hz 0 dBm0 60 200 300 400 to 3000 3200 3400 Hz Hz Hz Hz Hz Hz 24.0 0.6 –0.15 –0.15 –0.15 0.2 – 2.0 +0.21 +0.15 +0.65 0.8 FRR D-A Reference input signal 1015 Hz 0 dBm0 60 200 300 400 to 3000 3200 3400 Hz Hz Hz Hz Hz Hz 0.2 0.1 –0.15 –0.15 –0.15 0.2 4.0 1.0 +0.25 +0.15 +0.65 0.8 GTX A-D Reference input signal –10 dBm0 f = 700 to 1100 Hz +3 to –40 dBm0 –50 dBm0 –55 dBm0 –0.2 –0.5 –1.0 +0.2 +0.5 +1.0 GTR D-A Reference input signal –10 dBm0 f = 700 to 1100 Hz +3 to –40 dBm0 –50 dBm0 –55 dBm0 –0.2 –0.4 –0.8 +0.2 +0.4 +0.8 RL Input signal 0 dBm0 300 Hz 500 to 2000 Hz 16 20 2000 to 3400 Hz 16 300 Hz 500 to 2500 Hz 18 22 3400 Hz 18 36 30 25 ZT = 600 Ω + 2.16 µF Echo attenuation TBRL Input signal 0 dBm0 ZT = 600 Ω + 2.16 µF Transmit channel total power distortion ratio (tone method) 12 SDX A-D Input signal f = 700 to 1100 Hz +3 to –30 dBm0 –40 dBm0 –45 dBm0 SD R D-A +3 to –30 dBm0 36 Input signal –40 dBm0 30 f = 700 to 1100 Hz –45 dBm0 25 dB dB dB dB dB µPC7073 Parameter Symbol Conditions MIN. Absolute delay characteristics DA A-A input signal 0 dBm0 Absolute delay distortion frequency characteristics DO A-A Intermodulation (2 Tone) IMD A-D input signal f1, f2: 300 to 3400 Hz –4 to –21 dBm0 Measured signal: 2 × f1 – f2 level (2 × f1 – f2) vs level (f1, f2) 44.0 D-A input signal f1, f2: 300 to 3400 Hz –4 to –21 dBm0 Measured signal: 2 × f1 – f2 44.0 500 Hz 600 HZ 1000 to 2600 Hz 2800 Hz TYP. MAX. Units 540 µs 1400 700 200 1400 dB level (2 × f1 – f2) vs level (f1, f2) Single frequency noise NSF D-A PAD level set at 0 dB Measured signal up to f = 256 kHz Deviation in gain setting for transmit channel ∆DGSX Difference from A-D reference set value Setting value: +7.5 to +3.0 dB +3.0 to –3.5 dB Gain setting deviation for receive chanel ∆DGSR Idle circuit noise ICN24 ICN42 Difference from D-A reference set value Setting value: 0.0 to –5.0 dB –5.0 to –8.5 dB 2W-4W 4W-2W –54 dB –0.2 +0.2 –0.1 +0.1 –0.1 –0.2 +0.1 +0.2 A-law Psophometric weighted –67 dBm0p µ-law 23 dBrnc0 A-law Psophometric weighted –76 dBm0p µ-law 14 dBrnc0 C message weighted C message weighted Line to ground balance attenuation LB f = 300 to 600 Hz RF = 50 Ω Relative accuracy = 0.5 % f = 600 to 3400 Hz VBB-PSRR (tone method) PSRRB IL = 20 mA 42 48 dB dB f = 60 to 3400 Hz 30 f = 100 kHz –5 25 5 VCC-PSRR (tone method) PSRRC IL = 20 mA f = 60 to 3400 Hz f = 100 kHz AC induction noise LFI IL = 0 mA VIN = 6 Vrms 43 IL = 20 mA VIN = 15 Vrms 20 resistance dBm0 dBrnc 13 4. 14 TS 37 T B 38 Q1 R FT R TE 50 Ω Z1(0.5 %, 1 W) D2 D1 24 40 3.6 kΩ (1 %, 1 W) 42 TEST0 R RE D4 32 3.6 kΩ (1 %, 1 W) 50 Ω (0.5 %, 1 W) Q4 T2 44 45 TE T EF TS RS R EF RE RB µPC7073 (BS-LSI) 23 47 31 15 46 36 33 34 TEST1 TEST2 TEST3 GG VBB (–48 V) CVBB – C PSR 0.1 µF + (100 V) 0.68 µF (50 V) – + + C DC – 0.68 µF (10 V) 2 kΩ RPULL BSY SUS TX BIAS RX DC OUT3 DC OUT2 DC OUT1 DC IN1 DC IN2 BCUT ALM PD RC 1 RC 2 RC 3 BB OUT ASCN AGDT DVDD1 ACOM VBB TTXIN GND2 GND1 CPSR C DC OP IN+ OP IN– Z2 RS D3 R FR 29 RTIN0 RTIN1 R 27 + T1 T2 AVDD DVDD2 V CC RY1 48 25 T1 RY3 R RY2 1 µF + (6 V) – CVDD – + C COM RSUS RBSY 0.1 µF 0.1 µF 1 kΩ 1 kΩ (5 V) (6 V) 11 12 13 16 15 37 11 CAC 38 ACOM IN 350.68 µ F (50 V)40 ACOM OUT AIN 9– 39 10 HW X A OUT 1 48 CD IN3 TYPE 2 47 CD IN2 FS 3 46 CD IN1 4 45 DCLK DC OUT1 µPC9903 5 44 DC OUT2 HW R 19 30 (HCS-LSI) BCUT EXD 18 31 ALM 17 32 EXS PD 20 29 RC 1 RST 21 28 RC 2 AUX/MODE 22 27 RC 3 6 43 BB IN 7 42 ASCN 8 41 AGDT CGDT + 36 35 34 33 26 25 – 0.68 µ F (10 V) AGND SUB DGND1 DGND2 C VCC VDD (+5 V) 23 24 22 21 20 19 18 17 14 HW X TYPE FS DCLK HW R EXD EXS RST AUX/MODE SYSTEM APPLICATION EXAMPLE USING µPC7073 AND µPD9903 VCC (+5 V) Ring-Trip detector CR µPC7073 µPC7073 5. PACKAGE DRAWING 48 PIN PLASTIC SHRINK SOP (375 mil) 48 25 3°+7° –3° detail of lead end 1 24 A G H I K F J N E C D M M L B P48GT-65-375B-1 NOTE Each lead centerline is located within 0.10 mm (0.004 inch) of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS INCHES A 16.21 MAX. 0.639 MAX. B 0.63 MAX. 0.025 MAX. C 0.65 (T.P.) 0.026 (T.P.) D 0.30 ± 0.10 0.012+0.004 –0.005 E 0.125 ± 0.075 0.005 ± 0.003 F 2.0 MAX. 0.079 MAX. G 1.7 ± 0.1 0.067 ± 0.004 H 10.0 ± 0.3 0.394 +0.012 –0.013 I 8.0 ± 0.2 0.315 ± 0.008 J 1.0 ± 0.2 0.039+0.009 –0.008 K 0.15+0.10 –0.05 0.006+0.004 –0.002 L 0.5 ± 0.2 0.020+0.008 –0.009 M 0.10 0.004 N 0.10 0.004 15 µPC7073 6. RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the conditions recommended below. For details of recommended soldering conditions, refer to the information document Semiconductor Device Mounting Technology Manual (C10535E). For soldering methods and conditions other than those recommended, please contact your NEC sales representative. SURFACE MOUNT TYPE µPC7073GT: 48-pin plastic shrink SOP (375 mil) Soldering Method Soldering Conditions Recommended Condition Symbol Infrared reflow Package peak temperature: 235 ˚C Duration: 30 sec. max. (210 ˚C or above) Number of times: 1 IR35-00-1 Pin heating Pin temperature: 300 ˚C max. Duration: 3 sec. max. (per side of device) – Note 16 For the storage period after unpacking from the dry-pack, storage conditions are max. 25 ˚C, 65 % RH. µPC7073 Notes on Handling Devices against Electrostatic Discharge Caution When handling this device, special care against electrostatic discharge (ESD) must be taken. If a strong ESD is applied to this device, the junction parts of the internal transistors may be destroyed. Therefore, when transporting or storing this device, be sure to use the conductive tray or magazine case in the packing provided by NEC, or use a conductive buffer material or metal case. Also be sure to ground the operator's body and any tools that may enter in contact with the device during assembly processes. Never put or leave the device on a plastic board or table, and do not touch the device pins directly by hand. 17 µPC7073 [MEMO] 18 µPC7073 [MEMO] 19 µPC7073 [MEMO] The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96.5