PRELIMINARY DATA SHEET GaAs INTEGRATED CIRCUIT µPG175TA L-Band PA DRIVER AMPLIFIER DESCRIPTION µPG175TA is a GaAs MMIC for PA driver amplifier with variable gain function which was developed for PDC (Personal Digital Cellular in Japan) and another L-band application. The device can operate with 3.0 V, having the high gain and low distortion. FEATURES • Low Operation Voltage: VDD1 = VDD2 = 3.0 V • fRF: 925 to 960 MHz@ Pout = +9 dBm • Low distortion: Padj1 = –60 dBc typ. @ VDD = 3.0 V, Pout = +9 dBm, VAGC = 2.5 V External input and output matching • Low operation Current: IDD = 20 mA typ. @ VDD = 3.0 V, Pout = +9 dBm, VAGC = 2.5 V External input and output matching • Variable gain control function: ∆G = 35 dB typ. @ VAGC = 0.5 to 2.5 V • 6 pin mini-mold package APPLICATION • Digital Cellular: PDC800M, etc. ORDERING INFORMATION (PLAN) PART NUMBER µPG175TA-E3 PACKAGE 6 pin Mini-mold PACKING FORM Carrier tape width is 8 mm, Quantity is 3 kpcs per reel. Remark For sample order, please contact your local NEC sales office. (Part number for sample order: µPG175TA) Caution The IC must be handled with care to prevent static discharge because its circuit composed of GaAs HJ-FET. The information in this document is subject to change without notice. Document No. P13470EJ1V0DS00 (1st edition) Date Published May 1998 N CP(K) Printed in Japan © 1998 µPG175TA ABSOLUTE MAXIMUM RATINGS (TA = 25°C) PARAMETERS SYMBOL RATINGS UNIT VDD1, VDD2 6.0 V VAGC 6.0 V Input Power Pin –8 dBm Total Power Dissipation Ptot 200Note mW Operating Temperature TA –30 to +90 °C Storage Temperature Tstg –35 to +150 °C Supply Voltage AGC Control Voltage Note Mounted on a 50 × 50 × 1.6 mm double copper clad epoxy glass PWB, TA = +85°C PIN CONNECTION AND INTERNAL BLOCK DIAGRAM PIN NO. CONNECTION PIN NO. CONNECTION 1 VDD1 4 VAGC 2 GND 5 GND 3 VDD2 & OUT 6 IN 3 2 1 G1E Top View Bottom View Top View 4 4 3 3 4 5 5 2 2 5 6 6 1 1 6 RECOMMENDED OPERATING CONDITIONS (TA = 25°C) PARAMETERS Supply Voltage AGC Control Voltage Input Power 2 SYMBOL MIN. TYP. MAX. UNIT VDD1, VDD2 +2.7 +3.0 +3.3 V VAGC 0.5 2.5 V –17 dBm Pin –21 Preliminary Data Sheet µPG175TA ELECTRICAL CHARACTERISTICS (Unless otherwise specified, TA = 25°C, VDD1 = VDD2 = +3.0 V, π/4DQPSK modulated signal input, External input and output matching) PARAMETERS Operating Frequency SYMBOL TEST CONDITIONS f MIN. TYP. 925 MAX. UNIT 960 MHz Total Current IDD Pin = –21 dBm, VAGC = 2.5 V 20 30 mA AGC Control Current IAGC VAGC = 0.5 to 2.5 V 200 500 µA Power Gain Gp Pin = –21 dBm, VAGC = 2.5 V 27 30 dB Variable Gain Range ∆G Pin = –21 dBm, VAGC = 0.5 to 2.5 V 30 35 dB Adjacent Channel Power Leakage 1 Padj1 Pout = +9 dBm, VAGC = 2.5 V ∆f = ±50 kHz, 21 kHz Band Width –60 –55 dBc Adjacent Channel Power Leakage 2 Padj2 Pout = +9 dBm, VAGC = 2.5 V ∆f = ±100 kHz, 21 kHz Band Width –70 –65 dBc Input Return Loss RLin External matching 10 dB Output Return Loss RLout External matching 10 dB Preliminary Data Sheet 3 µPG175TA EVALUATION CIRCUIT (Preliminary) VDD1 = VDD2 = +3.0 V, f = 950 MHz VDD2 VDD1 C2 C3 L4 L5 OUT L3 1 2 C1 3 G1E 6 5 4 L1 IN VAGC L2 Using the NEC Evaluation board C1 C2, C3 4 2.0 pF 1000 pF L1 22 nH L2 27 nH L3 12 nH L4 47 nH L5 10 nH Preliminary Data Sheet µPG175TA EVALUATION BOARD (Epoxy Glass, ε = 4.6, 0.4 mm thickness) VDD1 OUT C1 L3 C3 C2 L4 L5 VDD2 38 mm L2 L1 IN VAGC 40 mm 6 PIN MINI-MOLD PACKAGE DIMENSIONS (UNIT: mm) 0.13 ± 0.1 +0.1 0.3–0.0 3 +0.2 2 1.5 –0.1 2.8 –0.3 +0.2 1 0 to 0.1 6 5 4 0.95 0.95 1.9 0.8 +0.2 –0.1 1.1 2.9 ± 0.2 Preliminary Data Sheet 5 µPG175TA RECOMMENDED SOLDERING CONDITIONS This Product should be soldered in the following recommended conditions. Other soldering methods and conditions than the recommended conditions are to be consulted with our sales representatives. Soldering process Soldering conditions Recommended condition symbol Infrared ray reflow Package peak temperature: 235°C Hour: within 30 s. (more than 210°C) Note Time: 3 times, Limited days: no. IR35-00-3 VPS Package peak temperature: 215°C Hour: within 40 s. (more than 200°C) Note Time: 3 times, Limited days: no. VP15-00-3 Wave Soldering Soldering tub temperature: less than 260°C, Hour: within 10 s. Note Time: 1 time, Limited days: no. WS60-00-1 Pin part heating Pin area temperature: less than 300°C, Hour: within 3 s. Note Limited days: no. Note It is the storage days after opening a dry pack, the storage conditions are 25°C, less than 65%, RH. Caution The combined use of soldering method is to be avoided (However, except the pin area heating method). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). 6 Preliminary Data Sheet µPG175TA [MEMO] Preliminary Data Sheet 7 µPG175TA Caution The Great Care must be taken in dealing with the devices in this guide. The reason is that the material of the devices is GaAs (Gallium Arsenide), which is designated as harmful substance according to the law concerned. Keep the law concerned and so on, especially in case of removal. The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96. 5