ORISTER RS432EP

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RS432 Adjustable Precision Shunt Regulator
General Description The RS432 series are three‐terminal adjustable regulators with guaranteed thermal stability over applicable temperature ranges. The output voltage may be set to any value between VREF (approximately 1.24 or 1.25 volts) and 18 volts with two external resistors. These devices have a typical dynamic output impedance of 0.2Ω. Active output circuitry provides a very sharp turn‐on characteristic, making these devices excellent replacement for zener diodes in many applications. Features ●
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Programmable Precise Output Voltage from 1.24V or 1.25V to 16V High Stability under Capacitive Load Low Dynamic Output Resistance: 0.2Ω Typical Fast turn on response Low Output Noise Wide Operating Range of ‐40 to 125oC Low Equivalent Full‐range Temperature Coefficient with 50ppm/oC Typical SOT‐23, SOT‐89 and TO‐92 Packages ● RoHS Compliant and 100% Lead (Pb)‐Freeand Green (Halogen Free with CommercialStandard) Application Circuits Fig 1. VK=VREF Fig 2. VK>VREF II
II
VK
IN
VK
IN
R1
I REF
Fig 3. Off‐State Current IK
R2
VK
I REF
IK
VREF
IN
I OFF
VREF
Note: VK=VREF (1+R1/R2)+IREFxR1
This integrated circuit can be damaged by ESD. Orister Corporation recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. DS‐RS432‐07 September, 2009 www.Orister.com
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Pin Assignments SOT‐23 SOT‐89 TO‐92 TO‐92 (STRAIGHT LEAD OPTION) (FORMED LEAD OPTION) PACKAGE SOT‐23 PIN 1 2 3 DESCRIPTION REFERENCE CATHODE ANODE PIN 1 2 3 DESCRIPTION REFERENCE ANODE CATHODE
PIN 1 2 3 DESCRIPTION REFERENCE ANODE CATHODE
PACKAGE SOT‐89 PACKAGE TO‐92 Ordering Information DEVICE RS432 X YY Z DEVICE CODE X is Reference voltage precision designator: A: 1.24V ±2.0% B: 1.24V ±1.0% C: 1.24V ±0.5% D: 1.25V ±2.0% E: 1.25V ±1.0% F: 1.25V ±0..5% YY is package designator : N: SOT‐23 M: SOT‐89 A: TO‐92 (Straight lead option) AT: TO‐92 (Formed lead option) Z is Lead Free designator : P: Commercial Standard, Lead (Pb) Free and Phosphorous (P) Free Package G: Green (Halogen Free with Commercial Standard) DS‐RS432‐07 September, 2009 www.Orister.com
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Block Diagram Functional Block Diagram
Symbol
Cathode
Reference
Anode
Absolute Maximum Ratings (Operating temperature range applies unless otherwise specified) Characteristics Cathode Voltage Cathode Current Range (Continuous) Reference Input Current Range Symbol VKA IK IREF Power Dissipation PD Operating Temperature Range (Max.) Storage Temperature Range TOPR TSTG Value 18 20 10 Unit
V mA mA SOT‐23 SOT‐89 TO‐92 ‐‐ 370 770 770 ‐‐ mW
o
‐40 ‐ +125 ‐65 ‐ +150 o
C C Operating Conditions Characteristics Cathode Voltage Cathode Current Range (Continuous) Operating Ambient Temperature Range Symbol VKA IK TOPR Min. VREF 0.1 ‐40 Max. 16 20 125 Unit
V mA o
C Electrical Characteristics (TA=25°C, unless otherwise specified) Characteristics 1.24V ±2.0% 1.24V ±1.0% 1.24V ±0.5% Reference Input Voltage (Fig1) 1.25V ±2.0% 1.25V ±1.0% 1.25V ±0.5% Ratio of Change in Reference Input Voltage to the Change in Cathode Voltage (Fig2) Reference Input Current (Fig2) Minimum Cathode Current for Regulation (Fig1) Off‐State Cathode Current (Fig3) Dynamic Output Impedance (Fig1) Symbol VREF Test Conditions VK=VREF, IK=10mA ΔVREF/ΔVK IK=10mA,, ΔVK=18V to VREF IREF IK(min) IK(off) ZK IK=10mA, R1=10KΩ, R2=∞ VK=VREF VK=6V, VREF=0 VK=16V, VREF=0 VK=VREF, f≤1kHz, IK=100uA to 20mA Min 1.215 1.228 1.234 1.225 1.238 1.244 Typ 1.24 1.24 1.24 1.25 1.25 1.25 Max 1.265
1.252
1.246
1.275
1.262
1.256
Unit
‐ 1.0 2.7 mV/V
‐ ‐ ‐ 0.15 20 0.01 0.04 0.5 80 0.05 0.15 uA uA ‐ 0.2 0.4 Ω V uA DS‐RS432‐07 September, 2009 www.Orister.com
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Typical Performance Characteristics DS‐RS432‐07 September, 2009 www.Orister.com
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DS‐RS432‐07 September, 2009 www.Orister.com
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SOT‐23 Dimension NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.15 per side. DS‐RS432‐07 September, 2009 www.Orister.com
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SOT‐89 Dimension NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. The center lead is in electrical contact with the tab. D. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.15 per side. E. Thermal pad contour optional within these dimensions. F. Falls within JEDEC TO‐243 variation AA, except minimum lead length, pin 2 minimum lead width, minimum tab width. DS‐RS432‐07 September, 2009 www.Orister.com
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TO‐92 Dimension NOTES: G. All linear dimensions are in inches (millimeters). H. This drawing is subject to change without notice. I. Lead dimensions are not controlled within this area. J. Falls within JEDEC TO‐226 variation AA (TO‐226 replaces TO‐92) K. Shipping Method: Straight lead option available in bulk pack only. Formed lead option available in tape & reel or ammo pack. DS‐RS432‐07 September, 2009 www.Orister.com
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Soldering Methods for Orister’s Products 1. Storage environment: Temperature=10oC~35oC Humidity=65%±15% 2. Reflow soldering of surface‐mount devices Figure 1: Temperature profile tP
Critical Zone
TL to TP
TP
Ramp-up
TL
tL
Temperature
Tsmax
Tsmin
tS
Preheat
25
Ramp-down
t 25oC to Peak
Time
Profile Feature Average ramp‐up rate (TL to TP) Sn‐Pb Eutectic Assembly o
<3 C/sec Preheat Pb‐Free Assembly <3oC/sec ‐ Temperature Min (Tsmin) 100oC 150oC ‐ Temperature Max (Tsmax) 150oC 200oC 60~120 sec 60~180 sec ‐ Time (min to max) (ts) Tsmax to TL ‐ Ramp‐up Rate o
<3 C/sec <3 C/sec Time maintained above: ‐ Temperature (TL) ‐ Time (tL) o
217oC 183 C 60~150 sec Peak Temperature (TP) Time within 5oC of actual Peak Temperature (tP) Ramp‐down Rate Time 25oC to Peak Temperature o
o
o
60~150 sec 240 C +0/‐5 C 260oC +0/‐5oC 10~30 sec 20~40 sec <6oC/sec <6oC/sec <6 minutes <8 minutes Peak temperature Dipping time 3. Flow (wave) soldering (solder dipping) Products Pb devices. Pb‐Free devices. o
o
245 C ±5 C o
o
260 C +0/‐5 C 5sec ±1sec 5sec ±1sec DS‐RS432‐07 September, 2009 www.Orister.com
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Important Notice: © Orister Corporation Orister cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in an Orister product. No circuit patent licenses, copyrights, mask work rights, or other intellectual property rights are implied. Orister reserves the right to make changes to their products or specifications or to discontinue any product or service without notice. Except as provided in Orister’s terms and conditions of sale, Orister assumes no liability whatsoever, and Orister disclaims any express or implied warranty relating to the sale and/or use of Orister products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. Testing and other quality control techniques are utilized to the extent Orister deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed. Orister and the Orister logo are trademarks of Orister Corporation. All other brand and product names appearing in this document are registered trademarks or trademarks of their respective holders. DS‐RS432‐07 September, 2009 www.Orister.com