GaAs-IR-Lumineszenzdiode GaAs Infrared Emitter Lead (Pb) Free Product - RoHS Compliant SFH 409 Wesentliche Merkmale Features • • • • GaAs-LED mit sehr hohem Wirkungsgrad Hohe Zuverlässigkeit Hohe Impulsbelastbarkeit Gute spektrale Anpassung an Si-Fotoempfänger • Gehäusegleich mit SFH 309, SFH 487 • • • • • Anwendungen Applications • IR-Fernsteuerungen von Fernseh-, Rundfunkund Videogeräten, Lichtdimmern • Lichtschranken bis 500 kHz • Münzzähler • Sensorik • Diskrete Optokoppler • IR remote control for hifi and TV sets, video tape recorders, dimmers • Light-reflection switches (max. 500 kHz) • Coin counters • Sensor technology • Discrete optocouplers Very highly efficient GaAs-LED High reliability High pulse handling capability Good spectral match to silicon photodetectors Same package as SFH 309, SFH 487 Typ Type Bestellnummer Ordering Code Gehäuse Package SFH 409 Q62702P0860 SFH 409-2 Q62702P1002 3-mm-LED-Gehäuse (T 1), grau eingefärbt, Anschlüsse im 2.54-mm-Raster (1/10’’), Kathodenkennzeichnung: kürzerer Anschluß 3 mm LED package (T 1), grey-colored epoxy resin, solder tabs lead spacing 2.54 mm (1/10’’), cathode marking: short lead 2011-03-14 1 SFH 409 Grenzwerte (TA = 25 °C) Maximum Ratings Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Betriebs- und Lagertemperatur Operating and storage temperature range Top; Tstg – 40 … + 100 °C Sperrspannung Reverse voltage VR 5 V Durchlaßstrom Forward current IF 100 mA Stoßstrom, τ ≤ 10 μs, D = 0 Surge current IFSM 3 A Verlustleistung Power dissipation Ptot 165 mW Wärmewiderstand Thermal resistance RthJA 450 K/W Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Wellenlänge der Strahlung Wavelength at peak emission IF = 100 mA, tp = 20 ms λpeak 950 nm Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 100 mA, tp = 20 ms Δλ 55 nm Abstrahlwinkel Half angle ϕ ± 20 Grad deg. Aktive Chipfläche Active chip area A 0.09 mm2 Abmessungen der aktiven Chipfläche Dimensions of the active chip area L×B L×W 0.3 × 0.3 mm Abstand Chipoberfläche bis Linsenscheitel Distance chip surface to lens top H 2.6 mm Kapazität, VR = 0 V Capacitance Co 25 pF Kennwerte (TA = 25 °C) Characteristics 2011-03-14 2 SFH 409 Kennwerte (TA = 25 °C) Characteristics (cont’d) Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, bei IF = 100 mA, RL = 50 Ω Switching times, Ιe from 10% to 90% and from 90% to10%, IF = 100 mA, RL = 50 Ω tr , tf 0.5 μs VF VF 1.30 (≤ 1.5) 1.9 (≤ 2.5) V V Sperrstrom, Reverse current, VR = 5 V IR 0.01 (≤ 1) μA Gesamtstrahlungsfluß, Total radiant flux IF = 100 mA, tp = 20 ms Φe 18 mW Temperaturkoeffizient von Ie bzw. Φe, IF = 100 mA Temperature coefficient of Ie or Φe, IF = 100 mA TCI – 0.55 %/K Temperaturkoeffizient von VF, IF = 100 mA Temperature coefficient of VF, IF = 100 mA TCV – 1.5 mV/K Temperaturkoeffizient von λpeak, IF = 100 mA Temperature coefficient of λpeak, IF = 100 mA TCλ + 0.3 nm/K Durchlaßspannung, Forward voltage IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 μs Gruppierung der Strahlstärke Ie in Achsrichtung gemessen bei einem Raumwinkel Ω = 0.01 sr Grouping of Radiant Intensity Ie in Axial Direction at a solid angle of Ω = 0.01 sr Bezeichnung Parameter Strahlstärke Radiant intensity IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 μs Symbol Ie Ie typ. 1) Nicht bestellbar als Einzelgruppe. 1) Can not be ordered as single group. 2011-03-14 Werte Values Einheit Unit SFH 409 SFH 409-11) SFH 409-2 SFH 409-31) ≥ 6.3 – 6.3 … 12.5 75 > 10 120 16 … 32 – 3 mW/sr mW/sr SFH 409 Relative Spectral Emission Irel = f (λ) Single pulse, tp = 20 μs OHR01938 100 OHR00864 Ιe Ι e (100 mA) 10 1 % Ι rel Ιe = f (IF) Ιe 100 mA Radiant Intensity Max. Permissible Forward Current IF = f (TA) OHR00883 120 Ι F mA 100 80 80 60 R thjA = 450 K/W 60 10 0 40 40 20 20 0 880 920 960 1000 nm λ 10 -1 10 -2 1060 Forward Current IF = f (VF), Single pulse, tp = 20 μs ΙF 10 0 10 4 OHR00865 Ι F mA 5 D= τ τ T ΙF T D = 0.005 10 typ. 0 10 1 A ΙF Permissible Pulse Handling Capability IF = f (τ), TA = 25 °C duty cycle D = parameter OHR01041 10 1 A 10 -1 max. 0.01 0.02 10 5 10 -1 0.05 3 0.1 0.2 0.5 10 -2 1 1.5 2 2.5 3 3.5 DC 10 2 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1 s 10 2 τ 4 V 4.5 VF Radiation Characteristics Ιrel = f (ϕ) 40 30 20 10 0 ϕ OHR01887 1.0 50 0.8 60 0.6 70 0.4 0.2 80 0 90 100 1.0 2011-03-14 0.8 0.6 0.4 0 20 40 60 80 4 100 120 0 0 20 40 60 80 100 ˚C 120 TA SFH 409 Maßzeichnung Package Outlines Area not flat 5.2 4.5 1.8 1.2 (3.5) 29 27 4.1 3.9 4.0 3.6 ø3.1 ø2.9 0.7 0.4 0.8 0.4 2.54 mm spacing 0.6 0.4 6.3 5.9 Cathode (SFH 409) Anode (SFH 487) 0.6 0.4 Chip position GEX06250 Maße in mm / Dimensions in mm. Wellenlöten (TTW) Recommended Solder Pad TTW Soldering 4.8 (0.189) Empfohlenes Lötpaddesign 4 (0.157) OHLPY985 Maße in mm (inch) / Dimensions in mm (inch) 2011-03-14 5 SFH 409 Lötbedingungen Soldering Conditions Wellenlöten (TTW) TTW Soldering (nach CECC 00802) (acc. to CECC 00802) OHLY0598 300 C T 10 s 250 Normalkurve standard curve 235 C ... 260 C Grenzkurven limit curves 2. Welle 2. wave 200 1. Welle 1. wave 150 ca 200 K/s 2 K/s 5 K/s 100 C ... 130 C 100 2 K/s 50 Zwangskühlung forced cooling 0 0 50 100 150 200 s 250 t Published by OSRAM Opto Semiconductors GmbH Leibnizstrasse 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2011-03-14 6 Mouser Electronics Related Product Links 720-SFH409 - Osram Opto Semiconductor SFH 409 720-SFH409-2 - Osram Opto Semiconductor SFH 409-2