POWEREX PP300B120-ND

PP300B120-ND
Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 (724) 925-7272
www.pwrx.com
H-Bridge POW-R-PAK™
IGBT Assembly
300 Amperes/1200 Volts
J
R
N (4 PLACES)
+DC
H
M (6 PLACES)
PIN 1
L
E
K
F
H
–DC
G
P
B
A
S
Q
C
D
T
+DC
C1
C1
G1
G1
E1
E1
1
2
G2
G2
E2
E2
E2
E2
-DC
Gate Driver Board
P1
Customer Interface (See Table 1)
Outline Drawing and Circuit Diagram
Dim.
A
B
C
D
E
F
G
H
J
01/14 Rev. 0
Inches
14.9
14.25
7.6
5.43
10.15
7.2
2.01
0.79
0.3
mm
378.4
362.0
193.0
138.0
257.8
183.0
51.0
20.0
7.7
Dim.
Inches
K
5.91
L
8.0
M
M6 Metric
N
0.256 Dia.
P
1.0
Q
0.32
R
14.32
S
2.05
T
5.4
mm
150.0
203.2
M6
6.5 Dia.
25.4
8.2
363.6
52.0
137.1
Description:
The Powerex POW-R-PAK™ is a configurable IGBT
based power assembly that may be used as a converter,
chopper, half or full bridge, or three phase inverter for
motor control, power supply, UPS or other power
conversion applications.
The power assembly is mounted on a forced air-cooled
heatsink and features state-of-the-art Powerex IGBTs
with low conduction and low switching losses for high
efficiency operation. The POW-R-PAK™ includes a low
inductance laminated bus structure, optically isolated
gate drive interfaces, isolated gate drive power supplies,
and a DC-link capacitor bank. The control board
provides a simple user interface along with built-in
protection features including overvoltage, undervoltage
lockout, overcurrent, overtemperature, and short circuit
detection.
Depending on application characteristics, the POW-RPAK™ is suitable for operation with DC bus voltages up
to 800VDC and switching frequencies below 20kHz.
Features:
£ High performance IGBT inverter bridge
£ Integrated gate drive with fault monitoring and
protection
£ System status / troubleshooting LEDs to verify
or monitor proper operation
£ Isolated gate drive power supplies
£ Low inductance laminated bus
£ Output current measurement and feedback
£ Superior short circuit detection & shoot through
prevention
1
Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 (724) 925-7272 www.pwrx.com
PP300B120-ND
H-Bridge POW-R-PAK™ IGBT Assembly
300 Amperes/1200 Volts
Absolute Maximum Ratings, Tj = 25°C unless otherwise specified
Module
Characteristics
IGBT Junction Temperature
SymbolRating Units
Tj
-40 to +150
°C
Storage Temperature
Tstg
-40 to +65
°C
Operating Temperature
Top
-20 to +60
°C
Voltage Applied to DC Terminals
VCC 800Volts
Isolation Voltage, Main Terminals to Heatsink
Viso 2500Volts
IGBT Part
Characteristics
Collector Current (DC, TC' = 90°C)
Peak Collector Current
Emitter Current (TC = 25°C)
SymbolRating Units
IC
300Amperes
ICM
600Amperes
IE
300Amperes
Peak Emitter Current
IEM
600Amperes
Maximum Collector Dissipation (Tj < 150°C per Module)
PC 1890Watts
Interface Board
Characteristics
2
SymbolRating Units
Unregulated +24V Power Supply Input
—
30
Volts
IGBT Command Signal Input Voltage
—
20
Volts
Fault Output Supply Voltage
—
30
Volts
Fault Output Current
—
50
mA
01/14 Rev. 0
Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 (724) 925-7272 www.pwrx.com
PP300B120-ND
H-Bridge POW-R-PAK™ IGBT Assembly
300 Amperes/1200 Volts
Electrical Characteristics, Tj = 25°C unless otherwise specified
IGBT Part
Characteristics
Collector Cutoff Current
Collector-Emitter Saturation Voltage
Symbol
Test Conditions
ICES
VCE = VCES, VGE = 0V
—
—
1.0
mA
VCE(sat)
IC = 300A, Tj = 25°C
—
1.8
2.4
Volts
IC = 300A, Tj = 125°C
—
1.9
—
Volts
IE = 300A
—
—
3.2
Volts
—
—
300
Ns
tr
VCC = 600V, IC = 300A, VGE = ±15V,
—
—
80
Ns
td(off)
RG = 1.0Ω, Inductive Load
—
—
500
Ns
—
—
300
Ns
Emitter-Collector Voltage
VEC
Turn-on Delay Time
td(on)
Rise Time
Turn-off Delay Time
Fall Time
tf
Min.
Typ.
Max.
Units
Diode Reverse Recovery Time
trr
IE = 300A
—
—
250
Ns
Diode Reverse Recovery Charge
Qrr
IE = 300A
—
17.6
—
μC
Min.
Typ.
Max.
Units
Unregulated +24V Power Supply Input
20
24
30
Volts
Power Supply Current Consumption
—
—
800
mA
IGBT Command Signal ON Threshold
12
15
—
Volts
IGBT Command Signal OFF Threshold
—
0
2
Volts
IGBT Command Signal Input Impedance
—
10
—
kΩ
IGBT Command Signal Input Capacitance
—
1
—
nF
Dead Time
—
3.0
—
μs
Min.
Typ.
Max.
Units
Output Over Current Trip
—
400
—
Amperes
Heatsink Over Temperature Trip
—
95
—
°C
Bus Over Voltage Trip
—
920
—
Volts
Power Supply Under Voltage Trip
—
18.9
—
Volts
Fault Reset Time
—
9
—
μs
Heatsink Temperature Feedback
—
0.1 V/°C
—
Volts
Output Current Feedback (Bipolar)
— ±0.025 V/Amp —
Volts
DC Link Feedback
—
Volts
Interface Board
Characteristics
Feedback Signal and Fault Characteristics
Characteristics
01/14 Rev. 0
0.01 V/V
—
3
Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 (724) 925-7272 www.pwrx.com
PP300B120-ND
H-Bridge POW-R-PAK™ IGBT Assembly
300 Amperes/1200 Volts
Electrical Characteristics, Tj = 25°C unless otherwise specified
Other Electrical Component Specifications
Characteristics
Min.
Typ.
Max.
Units
Total Nominal Capacitance
—
3450
—
μF
Nominal Ripple Current Rating per Capacitor (@ 85°C, 120Hz)
—
11.6
—
ARMS
Nominal Total Voltage Rating
—
500
—
Volts
Minimum Life @ Nominal Ripple Current (80°C)
—
10
—
khrs
—
±400
—
Amperes
DC Link Capacitor Bank
Output Current Sensor
Primary Current Measuring Range
Accuracy (@ IPN, 25°C)
—
< ±1
—
%
Linearity Error
—
< ±1
—
%
Response Time
—
<5
—
μs
Bandwidth (-3 dB)
DC
—
25
kHz
Thermal Characteristics, Tj = 25°C unless otherwise specified
Characteristics
Symbol
Test Conditions
Min.
Typ.
Max.
Units
IGBT Thermal Resistance, Junction-to-Case
Rth(j-c)Q
Per IGBT, 1/2 Module
—
—
0.05
°C/W
FWD Thermal Resistance, Junction-to-Case
Rth(j-c)D
Per FWD, 1/2 Module
—
—
0.08
°C/W
Contact Thermal Resistance
Rth(c-f)
Per 1/2 Module
—
0.02
—
°C/W
Heatsink Thermal Resistance
Rth(f-a)
286 CFM Airflow
—
0.037
—
°C/W
Min.
Typ.
Max.
Units
Mounting Torque, Output Power Terminals
—
75
90
in-lb
Mounting Torque, DC Bus Terminals
—
130
150
in-lb
Weight
—
39
—
lb
Mechanical Characteristics, Tj = 25°C unless otherwise specified
Characteristics
Relevant Standards
UL508C: Power Conversion Equipment
EN50178: Electronic Equipment for Use in Power Installations
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01/14 Rev. 0
Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 (724) 925-7272 www.pwrx.com
PP300B120-ND
H-Bridge POW-R-PAK™ IGBT Assembly
300 Amperes/1200 Volts
Interface Board Signal Defintions (Table 1)
Pin
Signal Name
Description
1
Shield
Internally Conected to PGND
2
Gate 1 Neg.
0-15V Signal Controlling, Lower IGBT, HIGH = IGBT on
3
Leg 1 Error1
Open Collector Output, External Pull-up Resistor Required
LOW = No Error; HIGH = Phase A Over Current or Short Circuit OR Power Supply UV
4
Gate 1 Pos.
0-15V Signal Controlling, Upper IGBT, HIGH = IGBT on
5
Gate 2 Neg.
0-15V Signal Controlling, Lower IGBT, HIGH = IGBT on
6
Leg 2 Error1
Open Collector Output, External Pull-up Resistor Required
LOW = No Error; HIGH = Phase A Over Current or Short Circuit OR Power Supply UV
7
Gate 2 Pos.
0-15V Signal Controlling, Upper IGBT, HIGH = IGBT on
8
N/C
No Connect - Do Not Ground
9
N/C
No Connect - Do Not Ground
10
N/C
No Connect - Do Not Ground
11
Over Temperature1
Open Collector Output, External Pull-up Resistor Required
LOW = No Error; HIGH = Heatsink OT
12
External Fault Reset
Active Low: Must be High for Operation; Low for 10microseconds to Reset Faults3
13
DC Link Voltage
Analog Voltage Feedback of DC Link Voltage
14
24 VDC Input Power
20-30 VDC Input Power Supply
15
24 VDC Input Power
20-30 VDC Input Power Supply
16
N/C
No Connect - Do Not Ground
17
N/C
No Connect - Do Not Ground
18
PGND
Ground Reference for 24 VDC Power Supply
19
PGND
Ground Reference for 24 VDC Power Supply
20
Heatsink Temperature
Analog Voltage Representation of Heatsink Temperature
21
AGND2
Tied to Pins 10 and 11
22
IOUT Phase A
Analog Voltage Representation of Output Current
23
AGND2
Tied to Pins 10 and 11
24
IOUT Phase B
Analog Voltage Representation of Output Current
25
AGND2
Tied to Pins 10 and 11
N/C
No Connect - Do Not Ground
25
1. Open collectors can be pulled up to 30V max. and sink 50mA continuous.
2. AGND signals to be used for analog feedback signals (i.e. twisted pair with IOUT Phase A).
3. On the board is a jumper that enables fault reset by bringing all leg control signals low for 10 microseconds (default).
Interface Board Connector
Description
Symbol
Type
Gate Drive Board Interface Header
P1
0.100" x 0.100" Latching Header, 26 Pin
3M# 3429-6002 or Equivalent
Recommended Mating Socket
—
0.100" x 0.100" IDC Socket, 26 Pin
3M# 3499-7600 or Equivalent
Recommended Strain Relief
—
Plastic Strain Relief
3M# 3448-3026 or Equivalent
01/14 Rev. 0
Manufacturer
5