ADS6425 www.ti.com SLWS197 – MARCH 2007 QUAD CHANNEL, 12-BIT, 125-MSPS ADC WITH SERIAL LVDS INTERFACE FEATURES APPLICATIONS • • • • • • • • • • • • • • • • • • • Maximum Sample Rate: 125 MSPS 12-Bit Resolution with No Missing Codes 1.65-W Total Power Simultaneous Sample and Hold 70.3 dBFS SNR at Fin = 50 MHz 83 dBc SFDR at Fin = 50 MHz, 0 dB Gain 79 dBc SFDR at Fin = 170 MHz, 3.5 dB Gain 3.5 dB Coarse Gain and up to 6 dB Programmable Fine Gain for SFDR/SNR Trade-Off Serialized LVDS Outputs with Programmable Internal Termination Option Supports Sine, LVCMOS, LVPECL, LVDS Clock Inputs and Amplitude Down to 400 mVpp differential Internal Reference with External Reference Support No External Decoupling Required for References 3.3-V Analog and Digital Supply 64 QFN Package (9 mm × 9 mm) Pin Compatible 14-Bit Family (ADS644X) Base-station IF Receivers Diversity Receivers Medical Imaging Test Equipment DESCRIPTION The ADS6425 is a high performance 12-bit, 125-MSPS quad channel ADC. Serial LVDS data outputs reduce the number of interface lines, resulting in a compact 64-pin QFN package (9 mm × 9 mm) that allows for high system integration density. The device includes 3.5 dB coarse gain option that can be used to improve SFDR performance with little degradation in SNR. In addition to the coarse gain, fine gain options also exist, programmable in 1dB steps up to 6dB. The output interface is 2-wire, where each ADC's data is serialized and output over two LVDS pairs. This makes it possible to halve the serial data rate (compared to a 1-wire interface) and restrict it to less than 1Gbps easing receiver design. The ADS6425 also includes the traditional 1-wire interface that can be used at lower sampling frequencies. An internal phase locked loop (PLL) multiplies the incoming ADC sampling clock to derive the bit clock. The bit clock is used to serialize the 12-bit data from each channel. In addition to the serial data streams, the frame and bit clocks are also transmitted as LVDS outputs. The LVDS output buffers have features such as programmable LVDS currents, current doubling modes and internal termination options. These can be used to widen eye-openings and improve signal integrity, easing capture by the receiver. The ADC channel outputs can be transmitted either as MSB or LSB first and 2s complement or straight binary. ADS6425 has internal references, but can also support an external reference mode. The device is specified over the industrial temperature range (–40°C to 85°C). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2007, Texas Instruments Incorporated ADS6425 www.ti.com SLWS197 – MARCH 2007 LVDD LGND CAP AVDD AGND These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. CLKP CLKM BIT Clock DCLKP DCLKM FRAME Clock FCLKP FCLKM PLL 12-Bit ADC Digital Encoder and Serializer 12-Bit ADC Digital Encoder and Serializer SHA 12-Bit ADC Digital Encoder and Serializer SHA 12-Bit ADC Digital Encoder and Serializer INA_P SHA INA_M INB_P SHA INB_M INC_P INC_M IND_P VCM DA1_P DA1_M DB0_P DB0_M DB1_P DB1_M DC0_P DC0_M DC1_P DC1_M DD0_P DD0_M DD1_P DD1_M REFM REFP IND_M DA0_P DA0_M Reference Parallel Interface Serial Interface SCLK RESET SEN SDATA CFG4 CFG3 CFG1 CFG2 PDN ADS6425 B0199-02 PACKAGE/ORDERING INFORMATION (1) PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR SPECIFIED TEMPERATURE RANGE PACKAGE MARKING ADS6425 QFN-64 (2) RGC –40°C to 85°C AZ6425 (1) (2) 2 ORDERING NUMBER TRANSPORT MEDIA, QUANTITY ADS6425IRGCT 250, Tape/reel ADS6425IRGCR 2000, Tape/reel For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. For thermal pad size on the package, see the mechanical drawings at the end of this data sheet. θJA = 23.17 °C/W (0 LFM air flow), θJC = 22.1 °C/W when used with 2 oz. copper trace and pad soldered directly to a JEDEC standard four layer 3 in. x 3 in. PCB. Submit Documentation Feedback ADS6425 www.ti.com SLWS197 – MARCH 2007 ABSOLUTE MAXIMUM RATINGS (1) VALUE UNIT AVDD Supply voltage range –0.3 to 3.9 V LVDD Supply voltage range –0.3 to 3.9 V Voltage between AGND and DGND –0.3 to 0.3 V Voltage between AVDD to LVDD –0.3 to 3.3 V Voltage applied to external pin, VCM –0.3 to 2.0 V Voltage applied to analog input pins – 0.3V to minimum ( 3.6, AVDD + 0.3V) V TA Operating free-air temperature range –40 to 85 °C TJ Operating junction temperature range 125 °C Tstg Storage temperature range –65 to 150 °C 220 °C Lead temperature 1,6 mm (1/16") from the case for 10 seconds (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT AVDD Analog supply voltage 3.0 3.3 3.6 V LVDD 3.0 3.3 3.6 V SUPPLIES LVDS Buffer supply voltage ANALOG INPUTS Differential input voltage range 2 Vpp 1.5 ±0.1 Input common-mode voltage Voltage applied on VCM in external reference mode 1.45 1.50 V 1.55 V 125 MSPS CLOCK INPUT Input clock sample rate 5 Sine wave, ac-coupled Input clock amplitude differential (VCLKP– VCLKM) 0.4 ± 0.8 LVPECL, ac-coupled Vpp ± 0.35 LVDS, ac-coupled LVCMOS, ac-coupled Input Clock duty cycle 1.5 3.3 35% 50% 65% DIGITAL OUTPUTS CLOAD Maximum external load capacitance from each output pin to DGND Without internal termination 5 With internal termination RLOAD Differential load resistance (external) between the LVDS output pairs TA Operating free-air temperature Ω 100 –40 Submit Documentation Feedback pF 10 85 °C 3 ADS6425 www.ti.com SLWS197 – MARCH 2007 ELECTRICAL CHARACTERISTICS Typical values are at 25°C, min and max values are across the full temperature range TMIN = –40°C to TMAX = 85°C, AVDD = LVDD = 3.3V, sampling rate = 125MSPS, 50% clock duty cycle, –1dBFS differential analog input, internal reference mode (unless otherwise noted). PARAMETER TEST CONDITIONS MIN RESOLUTION TYP MAX UNIT 12 Bits 2.0 Vpp ANALOG INPUT Differential input voltage range Differential input capacitance 7 pF Analog input bandwidth 500 MHz Analog input common mode current (per input pin of each ADC) 155 µA REFERENCE VOLTAGES VREFB Internal reference bottom voltage 1.0 V VREFT Internal reference top voltage 2.0 V VCM Common mode output voltage 1.5 V VCM Output current capability ±4 mA DC ACCURACY No missing codes EO Assured Offset error -15 ±2 +15 mV Offset error temperature coefficient 0.05 Offset error temperature coefficient, channel-channel Internal reference error (VREFT-VREFB) -15 Internal reference error temperature coefficient EG Gain error (1) ±5 mV/°C 15 0.25 Does not include gain error caused due to internal reference error -1 0.3 mV mV/°C +1 % FS Gain error temperature coefficient ∆%/°C 0.005 Gain error temperature coefficient, channel-channel DNL Differential nonlinearity -0.9 INL Integral nonlinearity -2.5 PSRR DC Power supply rejection ratio 0.5 2.0 1.0 2.5 LSB LSB –0.5 mV/V POWER SUPPLY ICC Total supply current 412 mA IAVDD Analog supply current 90 mA ILVDD LVDS supply current 502 mA Total Power Power down (1) 4 Input clock running This is specified by design and characterization. It is not tested in production. Submit Documentation Feedback 1.65 1.8 W 77 150 mW ADS6425 www.ti.com SLWS197 – MARCH 2007 ELECTRICAL CHARACTERISTICS Typical values are at 25°C, min and max values are across the full temperature range TMIN = –40°C to TMAX = 85°C, AVDD = LVDD = 3.3V, sampling rate = 125MSPS, 50% clock duty cycle, –1dBFS differential analog input, internal reference mode (unless otherwise noted). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT DYNAMIC AC CHARACTERISTICS Fin = 10 MHz 70.9 Fin = 50 MHz 67.5 Fin = 100 MHz SNR Signal to noise ratio Fin = 170 MHz Fin = 230 MHz 69.9 0 dB gain 68.5 3.5 dB Coarse gain 68.1 0 dB gain 67.4 3.5 dB Coarse gain 67.1 Fin = 10 MHz 67 Fin = 100 MHz Signal to noise and distortion ratio Fin = 170 MHz Fin = 230 MHz RMS Output noise 69.7 66.9 3.5 dB Coarse gain 67.4 0 dB gain 66.5 Inputs tied to common-mode 0.407 Fin = 230 MHz 73 87 75 3.5 dB Coarse gain 79 0 dB gain 74 3.5 dB Coarse gain 78 73 Fin = 100 MHz Fin = 170 MHz Fin = 230 MHz 90 85 3.5 dB Coarse gain 88 0 dB gain 82 3.5 dB Coarse gain 85 73 Fin = 100 MHz Fin = 170 MHz Fin = 230 MHz Worst harmonic (other than HD2, HD3) dBc 90 Fin = 50 MHz Third harmonic 91 0 dB gain Fin = 10 MHz HD3 dBc 93 Fin = 50 MHz Second harmonic 83 0 dB gain Fin = 10 MHz HD2 LSB 90 Fin = 100 MHz Fin = 170 MHz dBFS 66 3.5 dB Coarse gain Fin = 50 MHz Spurious free dynamic range 70 0 dB gain Fin = 10 MHz SFDR dBFS 70.7 Fin = 50 MHz SINAD 70.5 83 87 0 dB gain 75 3.5 dB Coarse gain 79 0 dB gain 74 3.5 dB Coarse gain 78 Fin = 10 MHz 95 Fin = 50 MHz 94 Fin = 100 MHz 91 Fin = 170 MHz 88 Fin = 230 MHz 86 Submit Documentation Feedback dBc dBc 5 ADS6425 www.ti.com SLWS197 – MARCH 2007 ELECTRICAL CHARACTERISTICS (continued) Typical values are at 25°C, min and max values are across the full temperature range TMIN = –40°C to TMAX = 85°C, AVDD = LVDD = 3.3V, sampling rate = 125MSPS, 50% clock duty cycle, –1dBFS differential analog input, internal reference mode (unless otherwise noted). PARAMETER TEST CONDITIONS MIN TYP Fin = 10 MHz Fin = 50 MHz THD Total harmonic distortion Effective number of bits 81 Fin = 100 MHz 84 Fin = 170 MHz 73 Fin = 50 MHz IMD Two-tone intermodulation distortion Cross-talk UNIT 88 70 Fin = 230 MHz ENOB MAX dBc 72 10.8 11.4 F1= 46.09 MHz, F2 = 50.09 MHz 90 F1= 185.09 MHz, F2 = 190.09 MHz 82 Near channel, Frequency of interfering signal = 10 MHz 92 Bits dBFS dBFS Far channel, Frequency of interfering signal = 10 MHz 105 DIGITAL CHARACTERISTICS The DC specifications refer to the condition where the digital outputs are not switching, but are permanently at a valid logic level 0 or 1 AVDD = LVDD = 3.3V, IO = 3.5mA, RLOAD = 100Ω (1). All LVDS specifications are characterized, but not tested at production. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT DIGITAL INPUTS High-level input voltage 2.4 V Low-level input voltage 0.8 V High-level input current 10 µA Low-level input current 10 µA 4 pF High-level output voltage 1375 mV Low-level output voltage 1025 Input capacitance DIGITAL OUTPUTS |VOD| Output differential voltage VOS Output offset voltage Common-mode voltage of OUTP and OUTM Output capacitance Output capacitance inside the device, from either output to ground (1) 6 250 350 mV 450 1200 mV 2 pF IO refers to the LVDS buffer current setting, RLOAD is the external differential load resistance between the LVDS output pair Submit Documentation Feedback mV ADS6425 www.ti.com SLWS197 – MARCH 2007 TIMING SPECIFICATIONS (1) Typical values are at 25°C, min and max values are across the full temperature range TMIN = –40°C to TMAX = 85°C, AVDD = LVDD = 3.3 V, sampling frequency = 125 MSPS, sine wave input clock, 1.5 VPP clock amplitude, CL = 5 pF (2), IO = 3.5 mA, RL = 100 Ω (3), no internal termination, unless otherwise noted. PARAMETER tJ TEST CONDITIONS Aperture jitter MIN Uncertainty in the sampling instant Interface: 2-wire, DDR bit clock, 12x serialization TYP MAX UNIT 250 fs rms (4) tsu Data setup time (5) (6) Measured from zero crossing of data transitions to zero crossing of bit clock 0.4 0.6 ns th Data hold time (5) (6) Measured from zero crossing of bit clock to zero crossing of data transitions 0.5 0.7 ns tpd_clk Clock propagation delay (4) Input clock rising edge cross-over to frame clock rising edge cross-over 3.6 4.4 Bit clock cycle-cycle jitter (6) Frame clock cycle-cycle jitter (6) 5.2 ns 350 ps pp 75 ps pp Below specifications apply for 5 MSPS ≤ Fs ≤125 MSPS and all interface options. tA Aperture delay Delay from rising edge of input clock to the actual sampling instant Aperture delay variation, channel-channel Within the same device ADC Latency (7) Wake up time 1 2 -250 Time for a sample to propagate to the ADC output Figure 1 3 ns 250 ps Clock cycles 12 Time to valid data after coming out of global power down 100 Time to valid data after input clock is re-started 100 µs 200 clock cycles Time to valid data after coming out of channel standby µs tRISE Data rise time Data rise time measured from –100 mV to +100 mV 50 100 200 ps tFALL Data fall time Data fall time measured from +100 mV to –100 mV 50 100 200 ps tRISE Bit clock and Frame clock rise time Rise time measured from –100mV to +100mV 50 100 200 ps tFALL Bit clock and Frame clock fall time Fall time measured from +100mV to –100mV 50 100 200 ps LVDS Bit clock duty cycle 45% 50% 55% LVDS Frame clock duty cycle 47% 50% 53% (1) (2) (3) (4) (5) (6) (7) Timing parameters are ensured by design and characterization and not tested in production. CL is the external single-ended load capacitance between each output pin and ground. Io refers to the LVDS buffer current setting; RL is the external differential load resistance between the LVDS output pair. Refer to Output Timings in application section for timings at lower sampling frequencies and other interface options. Timing parameters are measured at the end of a 2 inch pcb trace (100-Ω characteristic impedance) terminated by RLand CL. Setup and hold time specifications take into account the effect of jitter on the output data and clock. Note that the total latency = ADC latency + internal serializer latency. The serializer latency depends on the interface option selected as shown in Table 25 Submit Documentation Feedback 7 ADS6425 www.ti.com SLWS197 – MARCH 2007 Sample N+13 Sample N+12 Sample N+11 Sample N Input Signal tA Input Clock CLKM CLKP tPD_CLK Latency 12 Clocks Bit Clock Output Data DCLKP DCLKM DOP D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 D11 D10 D9 D8 D7 Sample N–1 Frame Clock D6 D5 D4 D3 D2 D1 D0 DOM Sample N FCLKM FCLKP T0105-03 Figure 1. Latency DCLKP Bit Clock DCLKM tsu th tsu Output Data DOP, DOM th Dn+1 Dn T0106-03 Figure 2. LVDS Timings 8 Submit Documentation Feedback ADS6425 www.ti.com SLWS197 – MARCH 2007 DEVICE PROGRAMMING MODES ADS6425 offers flexibility with several programmable features that are easily configured. The device can be configured independently using either parallel interface control or serial interface programming. In addition, the device supports a third configuration mode, where both the parallel interface and the serial control registers are used. In this mode, the priority between the parallel and serial interfaces is determined by a priority table (Table 2). If this additional level of flexibility is not required, the user can select either the serial interface programming or the parallel interface control. USING PARALLEL INTERFACE CONTROL ONLY To control the device using parallel interface, keep RESET tied to high (LVDD). Pins CFG1, CFG2, CFG3, CFG4, PDN, SEN, SCLK, and SDATA are used to directly control certain functions of the ADC. After power-up, the device will automatically get configured as per the parallel pin voltage settings (Table 3 to Table 6) and no reset is required. In this mode, SEN, SCLK, and SDATA function as parallel interface control pins. Frequently used functions are controlled in this mode—output data interface and format, power down modes, coarse gain and internal/external reference. The parallel pins can be configured using a simple resistor string as illustrated in Figure 3. Table 1 briefly describes the modes controlled by the parallel pins. Table 1. Parallel Pin Definition PIN SEN SCLK, SDATA CONTROL FUNCTIONS Coarse gain and internal/external reference. Sync, deskew patterns and global power down. PDN Dedicated pin for global power down CFG1 1-wire/2-wire and DDR/SDR bit clock CFG2 12x/14x serialization and SDR bit clock capture edge CFG3 Reserved function. Tie CFG3 to Ground. CFG4 MSB/LSB First and data format. USING SERIAL INTERFACE PROGRAMMING ONLY In this mode, SEN, SDATA, and SCLK function as serial interface pins and are used to access the internal registers of ADC. The registers must first be reset to their default values either by applying a pulse on RESET pin or by a high setting on the <RST> bit (in register ). After reset, the RESET pin must be kept low. The Serial Interface section describes the register programming and register reset in more detail. Since the parallel pins (CFG1-4 and PDN) are not used in this mode, they must be tied to ground. The register override bit <OVRD> - D10 in register 0x0D has to be set high to disable the control of parallel interface pins in this serial interface control ONLY mode. USING BOTH THE SERIAL INTERFACE AND PARALLEL CONTROLS For increased flexibility, a combination of serial interface registers and parallel pin controls (CFG1-4 and PDN) can also be used to configure the device. The parallel interface control pins CFG1 to CFG4 and PDN are available. After power-up, the device will automatically get configured as per the parallel pin voltage settings (Table 3 to Table 9) and no reset is required. A simple resistor string can be used as illustrated in Figure 3. SEN, SDATA, and SCLK function as serial interface pins and are used to access the internal registers of ADC. The registers must first be reset to their default values either by applying a pulse on RESET pin or by a high setting on the <RST> bit (in register ). After reset, the RESET pin must be kept low. The Serial Interface section describes the register programming and register reset in more detail. Since some functions are controlled using both the parallel pins and serial registers, the priority between the two is determined by a priority table (Table 2). Submit Documentation Feedback 9 ADS6425 www.ti.com SLWS197 – MARCH 2007 Table 2. Priority Between Parallel Pins and Serial Registers PIN CFG1 to CFG4 FUNCTIONS SUPPORTED PRIORITY As described in Table 6 to Table 9 Register bits can control the modes ONLY if the <OVRD> bit is high. If the <OVRD> bit is LOW, then the control voltage on these parallel pins determines the function as per Tables PDN Global power down D0 bit in register 0x00 controls global power down ONLY if PDN pin is LOW. If PDN is high, device is in global power down mode. SEN Serial Interface Enable 3.5 dB coarse gain setting is controlled by bit D5 in register 0x0D ONLY if the <OVRD> bit is high. Else, it is in default setting of 0 dB coarse gain. Internal/External reference setting is determined by bit D5 in register 0x00. SCLK, SDATA Serial Interface Clock and Serial Interface Data Bits D5-D7 in register 0x0A control the SYNC and DESKEW output patterns. Power down is determined by bit D0 in 0x00 register. AVDD (5/8) AVDD 3R (5/8) AVDD GND 2R AVDD (3/8) AVDD (3/8) AVDD 3R To Parallel Pin GND Figure 3. Simple Scheme to Configure Parallel Pins 10 Submit Documentation Feedback ADS6425 www.ti.com SLWS197 – MARCH 2007 DESCRIPTION OF PARALLEL PINS Table 3. SCLK, SDATA Control Pins SCLK SDATA LOW LOW NORMAL conversion. DESCRIPTION LOW HIGH SYNC - ADC outputs sync pattern on all channels. This pattern can be used by the receiver to align the deserialized data to the frame boundary. See Capture Test Patterns for details. HIGH LOW POWER DOWN –Global power down, all channels of the ADC are powered down, including internal references, PLL and output buffers. HIGH HIGH DESKEW - ADC outputs deskew pattern on all channels. This pattern can be used by the receiver to ensure deserializer uses the right clock edge. See Capture Test Patterns for details. Table 4. SEN Control Pin SEN 0 DESCRIPTION External reference and 0 dB coarse gain (Full-scale = 2V pp) (3/8)LVDD External reference and 3.5 dB coarse gain (Full-scale = 1.34V pp) (5/8)LVDD Internal reference and 3.5 dB coarse gain (Full-scale = 1.34V pp) LVDD Internal reference and 0 dB coarse gain (Full-scale = 2V pp) Independent of the programming mode used, after power-up the parallel pins PDN, CFG1 to CFG4 will automatically configure the device as per the voltage applied (Table 5 to Table 9). Table 5. PDN Control Pin PDN 0 AVDD DESCRIPTION Normal operation Power down global Table 6. CFG1 Control Pin CFG1 0 DESCRIPTION DDR bit clock and 1-wire interface (3/8)LVDD Not used (5/8)LVDD SDR bit clock and 2-wire interface LVDD DDR bit clock and 2-wire interface Table 7. CFG2 Control Pin CFG2 DESCRIPTION 0 12x serialization and capture at falling edge of bit clock (only with SDR bit clock) (3/8)LVDD 14x serialization and capture at falling edge of bit clock (only with SDR bit clock) (5/8)LVDD 14x serialization and capture at rising edge of bit clock (only with SDR bit clock) LVDD 12x serialization and capture at rising edge of bit clock (only with SDR bit clock) Table 8. CFG3 Control Pin CFG3 RESERVED - TIE TO GROUND Table 9. CFG4 Control Pin CFG4 0 DESCRIPTION MSB First and 2s complement (3/8)LVDD MSB First and Offset binary (5/8)LVDD LSB First and Offset binary LVDD LSB First and 2s complement Submit Documentation Feedback 11 ADS6425 www.ti.com SLWS197 – MARCH 2007 SERIAL INTERFACE The ADC has a serial interface formed by pins SEN (serial interface enable), SCLK (serial interface clock), SDATA (serial interface data) and RESET. Serial shift of bits into the device is enabled when SEN is low. Serial data SDATA is latched at every falling edge of SCLK when SEN is active (low). The serial data is loaded into the register at every 16th SCLK falling edge when SEN is low. In case the word length exceeds a multiple of 16 bits, the excess bits are ignored. Data can be loaded in multiple of 16-bit words within a single active SEN pulse. The interface can work with SCLK frequency from 20 MHz down to very low speeds (few hertz) and even with non-50% duty cycle SCLK. The first 5-bits of the 16-bit word are the address of the register while the next 11 bits are the register data. Register Reset After power-up, the internal registers must be reset to their default values. This can be done in one of two ways: 1. Either by applying a high-going pulse on RESET (of width greater than 10ns) OR 2. By applying software reset. Using the serial interface, set the <RST> bit in register 0x00 to high– this resets the registers to their default values and then self-resets the <RST> bit to LOW. When RESET pin is not used, it must be tied to LOW. Register Address SDATA A4 A3 A2 A1 Register Data A0 D10 D9 D8 D7 D6 t(SCLK) D5 D4 D3 D2 D1 D0 t(DH) t(DSU) SCLK t(SLOADH) t(SLOADS) SEN RESET T0109-03 Figure 4. Serial Interface Timing 12 Submit Documentation Feedback ADS6425 www.ti.com SLWS197 – MARCH 2007 SERIAL INTERFACE TIMING CHARACTERISTICS Typical values at 25°C, min and max values across the full temperature range TMIN = –40°C to TMAX = 85°C, AVDD = LVDD = 3.3V, unless otherwise noted. PARAMETER MIN TYP > dc MAX UNIT 20 MHz fSCLK SCLK Frequency, fSCLK = 1/tSCLK tSLOADS SEN to SCLK Setup time 25 ns tSLOADH SCLK to SEN Hold time 25 ns tDSU SDATA Setup time 25 ns tDH SDATA Hold time 25 ns 100 ns Time taken for register write to take effect after 16th SCLK falling edge RESET TIMING Typical values at 25°C, min and max values across the full temperature range TMIN = –40°C to TMAX = 85°C, AVDD = LVDD = 3.3V, unless otherwise noted. PARMATER CONDITIONS MIN t1 Power-on delay time Delay from power-up of AVDD and LVDD to RESET pulse active t2 Reset pulse width Pulse width of active RESET signal t3 Register write delay time Delay from RESET disable to SEN active tPO Power-up delay time TYP UNIT 5 ms 10 ns 25 Delay from power-up of AVDD and LVDD to output stable MAX ns 6.5 ms Power Supply AVDD, LVDD t1 RESET t2 t3 SEN T0108-03 Figure 5. Reset Timing Submit Documentation Feedback 13 ADS6425 www.ti.com SLWS197 – MARCH 2007 SERIAL REGISTER MAP Table 10. Summary of Functions Supported By Serial Interface REGISTER ADDRESS A4 - A0 REGISTER FUNCTIONS (1) (2) D10 D9 D8 D7 00 <RST> S/W RESET 0 0 0 04 0 0 0 0 0 <DF> DATA FORMAT 2S COMP OR STRAIGHT BINARY 0 0A 0 0D 10 11 (1) (2) 14 D5 <REF> INTERNAL OR EXTERNAL D4 D3 <PDN CHD> POWER DOWN CH D <PDN CHC> POWER DOWN CHC D2 <PDN CHB> POWER DOWN CH B <CLKIN GAIN> INPUT CLOCK BUFFER GAIN CONTROL <PATTERNS> TEST PATTERNS 0 0 0 D1 D0 <PDN CHA> POWER DOWN CH A <PDN GLOBAL> GLOBAL POWER DOWN 0 0 0 0 <CUSTOM A> CUSTOM PATTERN (LOWER 11 BITS) 0B 0C D6 <FINE GAIN> FINE GAIN CONTROL (1dB to 6 dB) <OVRD> OVERRIDE BIT 0 0 0 0 0 BYTE-WISE OR BIT-WISE MSB OR LSB FIRST <COARSE GAIN> COURSE GAIN ENABLE <TERM CLK> LVDS INTERNAL TERMINATION BIT AND WORD CLOCKS WORD-WISE CONTROL 0 0 <CUSTOM B> CUSTOM PATTERN (UPPER 5 BITS) FALLING OR RISING BIT CLOCK CAPTURE EDGE 0 <LVDS CURR> LVDS CURRENT SETTINGS 0 0 DDR OR SDR BIT CLOCK 1-WIRE OR 2-WIRE INTERFACE <CURR DOUBLE> LVDS CURRENT DOUBLE <TERM DATA> LVDS INTERNAL TERMINATION - DATA OUTPUTS The unused bits in each register (shown by white cells in above table) must be programmed as 0. Multiple functions in a register can be programmed in a single write operation. Submit Documentation Feedback 12X OR 14X SERIALIZE ADS6425 www.ti.com SLWS197 – MARCH 2007 DESCRIPTION OF SERIAL REGISTERS Table 11. Serial Register A REGISTER ADDRESS A4 - A0 00 BITS D10 <RST> S/W RESET D9 0 D8 0 D7 0 D6 D5 D4 D3 D2 D1 D0 0 <REF> INTERNAL OR EXTERNAL <PDN CHD> POWER DOWN CH D <PDN CHC> POWER DOWN CHC <PDN CHB> POWER DOWN CH B <PDN CHA> POWER DOWN CH A <PDN> GLOBAL POWER DOWN D0 - D4 Power down modes D0 <PDN GLOBAL> 0 Normal operation 1 Global power down, including all channels ADCs, internal references, internal PLL and output buffers D1 <PDN CHA> 0 CH A powered up 1 CH A ADC powered down D2 <PDN CHB> 0 CH B powered up 1 CH B ADC powered down D3 <PDN CHC> 0 CH C powered up 1 CH C ADC powered down D4 <PDN CHD> 0 CH D powered up 1 CH D ADC powered down D5 <REF> Reference 0 Internal reference enabled 1 External reference enabled D10 <RST> 1 Software reset applied – resets all internal registers and self-clears to 0 Submit Documentation Feedback 15 ADS6425 www.ti.com SLWS197 – MARCH 2007 Table 12. Serial Register B REGISTER ADDRESS A4 - A0 04 BITS D10 0 D9 0 D8 D7 0 D6 D5 D4 D3 D2 D1 D0 0 0 <CLKIN GAIN> INPUT CLOCK BUFFER GAIN CONTROL 0 D6 - D2 <CLKIN GAIN> Input clock buffer gain control 11000 Gain 0 Minimum gain 00000 Gain 1 01100 Gain 2 01010 Gain 3 01001 Gain 4 01000 Gain 5 Maximum gain Table 13. Serial Register C REGISTER ADDRESS A4 - A0 00 BITS D10 D9 D8 0 <DF> DATA DORMAT 2S COMP OR STRAIGHT BINARY 0 D7 D6 D5 <PATTERNS> TEST PATTERNS D4 D3 D2 D1 D0 0 0 0 0 0 D7 - D5 <PATTERNS> Capture test patterns 000 Normal ADC operation 001 Output all zeros 010 Output all ones 011 Output toggle pattern 100 Unused 101 Output custom pattern (contents of CUSTOM pattern registers 0x0B and 0x0C) 110 Output DESKEW pattern (serial stream of 1010..) 111 Output SYNC pattern D9 <DF> Data format selection 0 2s complement format 1 Straight binary format 16 Submit Documentation Feedback ADS6425 www.ti.com SLWS197 – MARCH 2007 Table 14. Serial Register D REGISTER ADDRESS A4 - A0 BITS D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 <CUSTOM A> CUSTOM PATTERN (LOWER 11 BITS) 0B D10 - D0 <CUSTOM A> Lower 11 bits of custom pattern <DATAOUT10>…<DATAOUT0> Table 15. Serial Register E REGISTER ADDRESS A4 - A0 0C BITS D10 D9 D8 <FINE GAIN> FINE GAIN CONTROL (1 dB to 6 dB) D7 D6 0 D5 0 D4 D3 D2 D1 D0 <CUSTOM B> CUSTOM PATTERN (UPPER 5 BITS) 0 D4 - D0 <CUSTOM B> Upper 5 bits of custom pattern <DATAOUT15>…<DATAOUT11> D10-D8 <FINE GAIN> Fine gain control 000 0 dB gain (Full-scale range = 2.00 Vpp) 001 1 dB gain (Full-scale range = 1.78 Vpp) 010 2 dB gain (Full-scale range = 1.59 Vpp) 011 3 dB gain (Full-scale range = 1.42 Vpp) 100 4 dB gain (Full-scale range = 1.26 Vpp) 101 5 dB gain (Full-scale range = 1.12 Vpp) 110 6 dB gain (Full-scale range = 1.00 Vpp) Table 16. Serial Register F REGISTER ADDRESS A4 - A0 0D BITS D10 <OVRD> OVER-RIDE BITE D9 D8 0 0 D7 BYTE-WISE OR BIT-WISE D6 MSB OR LSB FIRST D5 D4 D3 D2 D1 D0 <COARSE GAIN> COURSE GAIN ENABLE FALLING OR RISING BIT CLOCK CAPTURE EDGE 0 14-BIT OR 16-BIT SERIALIZE DDR OR SDR BIT CLOCK 1-WIRE OR 2-WIRE INTERFACE D0 Interface selection 0 1 wire interface 1 2 wire interface D1 Bit clock selection (only in 2-wire interface) 0 DDR bit clock 1 SDR bit clock D2 Serialization selection 0 12X serialization 1 14X serialization D4 Bit clock capture edge (only when SDR bit clock is selected, D1=1) 0 Capture data with falling edge of bit clock 1 Capture data with rising edge of bit clock Submit Documentation Feedback 17 ADS6425 www.ti.com SLWS197 – MARCH 2007 D5 <COARSE GAIN>Coarse gain control 0 0 dB coarse gain 1 3.5dB coarse gain (Full-scale range = 1.34 Vpp) D6 MSB or LSB first selection 0 MSB First 1 LSB First D7 Byte/bit wise outputs (only when 2-wire is selected) 0 Byte wise 1 Bit wise D10 <OVRD> Over-ride bit. All the functions in register 0x0D can also be controlled using the parallel control pins. By setting bit <OVRD> =1, the contents of register 0x0D will over-ride the settings of the parallel pins. 0 Disable over-ride 1 Enable over-ride Table 17. Serial Register G REGISTER ADDRESS A4 - A0 10 BITS D10 D9 D8 D7 D6 D5 <TERM CLK> LVDS INTERNAL TERMINATION BIT AND WORD CLOCKS D4 D3 D2 <LVDS CURR> LVDS CURRENT SETTINGS D0 <CURR DOUBLE> LVDS current double for data outputs 0 Nominal LVDS current, as set by <D5…D2> 1 Double the nominal value D1 <CURR DOUBLE> LVDS current double for bit and word clock outputs 0 Nominal LVDS current, as set by <D5…D2> 1 Double the nominal value D3-D2 <LVDS CURR> LVDS current setting for data outputs 00 3.5 mA 01 4 mA 10 2.5 mA 11 3 mA D5-D4 <LVDS CURR> LVDS current setting for bit and word clock outputs 00 3.5 mA 01 4 mA 10 2.5 mA 11 3 mA D10-D6 <TERM CLK> LVDS internal termination for bit and word clock outputs 00000 No internal termination 00001 166 Ω 18 Submit Documentation Feedback D1 D0 <LVDS DOUBLE> LVDS CURRENT DOUBLE ADS6425 www.ti.com SLWS197 – MARCH 2007 00010 200 Ω 00100 250 Ω 01000 333 Ω 10000 500 Ω Any combination of above bits can also be programmed, resulting in a parallel combination of the selected values. For example, 00101 is the parallel combination of 166||250 = 100 Ω 100 Ω 00101 Table 18. Serial Register H REGISTER ADDRESS A4 - A0 11 BITS D10 D9 WORD-WISE CONTROL D8 D7 D6 D5 0 0 0 0 D4 D3 D2 D1 D0 <TERM DATA> LVDS INTERNAL TERMINATION - DATA OUTPUTS D4-D0 <TERM DATA> LVDS internal termination for data outputs 00000 No internal termination 00001 166 Ω 00010 200 Ω 00100 250 Ω 01000 333 Ω 10000 500 Ω Any combination of above bits can also be programmed, resulting in a parallel combination of the selected values. For example, 00101 is the parallel combination of 166||250 = 100 Ω 00101 100 Ω D10-D9 Only when 2-wire interface is selected 00 Byte-wise or bit-wise output, 1x frame clock 11 Word-wise output enabled, 0.5x frame clock 01,10 Do not use Submit Documentation Feedback 19 ADS6425 www.ti.com SLWS197 – MARCH 2007 PIN CONFIGURATION (2-WIRE INTERFACE) LVDD DC1_P DC1_M DC0_P LGND DC0_M FCLKP FCLKM DCLKP DCLKM LGND DB1_P DB1_M DB0_P DB0_M LVDD RGC PACKAGE (TOP VIEW) DA1_P 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 1 48 DD0_M DA1_M 2 47 DD0_P DA0_P 3 46 DD1_M DA0_M 4 45 DD1_P CAP 5 44 SCLK RESET 6 43 SDATA LVDD 7 42 SEN AGND 8 41 PDN ADS6425 AGND 13 36 AGND INB_M 14 35 INC_M INB_P 15 34 INC_P AGND 16 33 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 AGND AVDD IND_P AGND 37 CFG1 12 CFG2 INA_P CFG3 IND_M AVDD 38 AGND 11 CLKM INA_M CLKP AGND AGND 39 VCM 10 CFG4 AGND NC AVDD AVDD 40 AGND 9 AVDD AVDD P0056-02 PIN ASSIGNMENTS (2-WIRE INTERFACE) PINS NAME NO. I/O NO. OF PINS DESCRIPTION SUPPLY AND GROUND PINS AVDD 9,17,19,27,32,40, 6 Analog power supply AGND 8,10,13,16,18,23,26, 31,33 36,39, 11 Analog ground LVDD 7,49,64 3 Digital power supply LGND 54,59 2 Digital ground INPUT PINS CLKP, CLKM 24,25 I 2 Differential input clock pair INA_P, INA_M 12,11 I 2 Differential input signal pair, channel A. If unused, the pins should be tied to VCM and not floated. 20 Submit Documentation Feedback ADS6425 www.ti.com SLWS197 – MARCH 2007 PIN ASSIGNMENTS (2-WIRE INTERFACE) (continued) PINS NAME NO. I/O NO. OF PINS DESCRIPTION INB_P, INB_M 15,14 I 2 Differential input signal pair, channel B. If unused, the pins should be tied to VCM and not floated. INC_P, INC_M 34,35 I 2 Differential input signal pair, channel C. If unused, the pins should be tied to VCM and not floated. IND_P, IND_M 37,38 I 2 Differential input signal pair, channel D. If unused, the pins should be tied to VCM and not floated. 1 Connect 2nF capacitor from pin to ground CAP 5 SCLK 44 I 1 This pin functions as serial interface clock input when RESET is low. When RESET is high, it controls DESKEW, SYNC and global POWER DOWN modes (along with SDATA). See Table 3 for description. This pin has an internal pull-down resistor. SDATA 43 I 1 This pin functions as serial interface data input when RESET is low. When RESET is high, it controls DESKEW, SYNC and global POWER DOWN modes (along with SCLK). See Table 3 for description. This pin has an internal pull-down resistor. SEN 42 I 1 This pin functions as serial interface enable input when RESET is low. When RESET is high, it controls coarse gain and internal/external reference modes. See Table 4 for description. This pin has an internal pull-up resistor. Serial interface reset input. When using the serial interface mode, the user MUST initialize internal registers through hardware RESET by applying a high-going pulse on this pin or by using software reset option. Refer to the Serial Interface section. In parallel interface mode, tie RESET permanently high. (SCLK, SDATA and SEN function as parallel control pins in this mode). RESET 6 I 1 PDN 41 I 1 Global power down control pin. CFG1 30 I 1 Parallel input pin. It controls 1-wire or 2-wire interface and DDR or SDR bit clock selection. See Table 6 for description. Tie to AVDD for 2-wire interface with DDR bit clock. CFG2 29 I 1 Parallel input pin. It controls 12x or 14x serialization and SDR bit clock capture edge. See Table 7 for description. For 12x serialization with DDR bit clock, tie to ground or AVDD. CFG3 28 I 1 RESERVED pin - Tie to ground. CFG4 21 I 1 Parallel input pin. It controls data format and MSB or LSB first modes. See Table 9 for description. VCM 22 I/O 1 Internal reference mode – common-mode voltage output External reference mode – reference input. The voltage forced on this pin sets the internal reference. DA0_P,DA0_M 3,4 O 2 Channel A differential LVDS data output pair, wire 0 DA1_P,DA1_M 1,2 O 2 Channel A differential LVDS data output pair, wire 1 DB0_P,DB0_M 62,63 O 2 Channel B differential LVDS data output pair, wire 0 DB1_P,DB1_M 60,61 O 2 Channel B differential LVDS data output pair, wire 1 DC0_P,DC0_M 52,53 O 2 Channel C differential LVDS data output pair, wire 0 DC1_P,DC1_M 50,51 O 2 Channel C differential LVDS data output pair, wire 1 DD0_P,DD0_M 47,48 O 2 Channel D differential LVDS data output pair, wire 0 DD1_P,DD1_M 45,46 O 2 Channel D differential LVDS data output pair, wire 1 DCLKP,DCLKM 57,58 O 2 Differential bit clock output pair FCLKP,FCLKM 55,56 O 2 Differential frame clock output pair 1 Do Not Connect The pin has an internal pull-down resistor to ground. OUTPUT PINS NC 20 Submit Documentation Feedback 21 ADS6425 www.ti.com SLWS197 – MARCH 2007 PIN CONFIGURATION (1-WIRE INTERFACE) LVDD DD_P DD_M DC_P DC_M LGND FCLKP FCLKM DCLKP DCLKM LGND DB_P DB_M DA_P DA_M LVDD RGC PACKAGE (TOP VIEW) UNUSED 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 1 48 UNUSED UNUSED 2 47 UNUSED UNUSED 3 46 UNUSED UNUSED 4 45 UNUSED CAP 5 44 SCLK RESET 6 43 SDATA LVDD 7 42 SEN AGND 8 41 PDN ADS6425 AGND 13 36 AGND INB_M 14 35 INC_M INB_P 15 34 INC_P AGND 16 33 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 AGND AVDD IND_P AGND 37 CFG1 12 CFG2 INA_P CFG3 IND_M AVDD 38 AGND 11 CLKM INA_M CLKP AGND AGND 39 VCM 10 CFG4 AGND NC AVDD AVDD 40 AGND 9 AVDD AVDD P0056-03 PIN ASSIGNMENTS (1-WIRE INTERFACE) PINS NAME NO. I/O NO. OF PINS DESCRIPTION SUPPLY AND GROUND PINS AVDD 9,17,19,27,32,40, 6 Analog power supply AGND 8,10,13,16,18,23,26, 31,33 36,39, 11 Analog ground LVDD 7,49,64 3 Digital power supply LGND 54,59 2 Digital ground INPUT PINS CLKP, CLKM 24,25 I 2 Differential input clock pair INA_P, INA_M 12,11 I 2 Differential input signal pair, channel A. If unused, the pins should be tied to VCM and not floated. 22 Submit Documentation Feedback ADS6425 www.ti.com SLWS197 – MARCH 2007 PIN ASSIGNMENTS (1-WIRE INTERFACE) (continued) PINS NAME NO. I/O NO. OF PINS DESCRIPTION INB_P, INB_M 15,14 I 2 Differential input signal pair, channel B. If unused, the pins should be tied to VCM and not floated. INC_P, INC_M 34,35 I 2 Differential input signal pair, channel C. If unused, the pins should be tied to VCM and not floated. IND_P, IND_M 37,38 I 2 Differential input signal pair, channel D. If unused, the pins should be tied to VCM and not floated. 1 Connect 2nF capacitance from pin to ground CAP 5 SCLK 44 I 1 This pin functions as serial interface clock input when RESET is low. When RESET is high, it controls DESKEW, SYNC and global POWER DOWN modes (along with SDATA). See Table 3 for description. This pin has an internal pull-down resistor. SDATA 43 I 1 This pin functions as serial interface data input when RESET is low. When RESET is high, it controls DESKEW, SYNC and global POWER DOWN modes (along with SCLK). See Table 3 for description. This pin has an internal pull-down resistor. SEN 42 I 1 This pin functions as serial interface enable input when RESET is low. When RESET is high, it controls coarse gain and internal/external reference modes. See Table 4 for description. This pin has an internal pull-up resistor. Serial interface reset input. When using the serial interface mode, the user MUST initialize internal registers through hardware RESET by applying a high-going pulse on this pin or by using software reset option. Refer to the Serial Interface section. In parallel interface mode, tie RESET permanently high. (SCLK, SDATA and SEN function as parallel control pins in this mode). RESET 6 I 1 PDN 41 I 1 Global power down control pin. CFG1 30 I 1 Parallel input pin. It controls 1-wire or 2-wire interface and DDR or SDR bit clock selection. See Table 6 for description. Tie to ground for 1-wire interface with DDR bit clock. CFG2 29 I 1 Parallel input pin. It controls 12x or 14x serialization and SDR bit clock capture edge. See Table 7 for description. For 12x serialization with DDR bit clock, tie to ground or AVDD. CFG3 28 I 1 RESERVED pin - Tie to ground. CFG4 21 I 1 Parallel input pin. It controls data format and MSB or LSB first modes. See Table 9 for description. VCM 22 I/O 1 Internal reference mode – common-mode voltage output External reference mode – reference input. The voltage forced on this pin sets the internal reference. DA_P,DA_M 62,63 O 2 Channel A differential LVDS data output pair DB_P,DB_M 60,61 O 2 Channel B differential LVDS data output pair DC_P,DC_M 52,53 O 2 Channel C differential LVDS data output pair DD_P,DD_M 50,51 O 2 Channel D differential LVDS data output pair DCLKP,DCLKM 57,58 O 2 Differential bit clock output pair FCLKP,FCLKM 55,56 O 2 Differential frame clock output pair 1-4,45-48 8 These pins are unused in the 1-wire interface. Do not connect 20 1 Do not connect The pin has an internal pull-down resistor to ground. OUTPUT PINS UNUSED NC Submit Documentation Feedback 23 ADS6425 www.ti.com SLWS197 – MARCH 2007 TYPICAL CHARACTERISTICS All plots are at 25°C, AVDD = LVDD = 3.3 V, sampling frequency = 125 MSPS, sine wave input clock, 1.5 VPP differential clock amplitude, 50% clock duty cycle, –1 dBFS differential analog input, internal reference mode, 0 dB gain (unless otherwise noted) FFT for 10 MHz INPUT SIGNAL FFT for 50 MHz INPUT SIGNAL 0 SFDR = 91 dBc SINAD = 71.35 dBFS SNR = 71.41 dBFS THD = 89.5 dBc −20 SFDR = 85.8 dBc SINAD = 70.7 dBFS SNR = 70.9 dBFS THD = 84.4 dBc −20 −40 Amplitude − dB −40 Amplitude − dB 0 −60 −80 −100 −60 −80 −100 −120 −120 −140 −140 −160 −160 0 10 20 30 40 50 60 f − Frequency − MHz 0 10 20 30 G001 Figure 6. FFT for 100 MHz INPUT SIGNAL G002 FFT for 170 MHz INPUT SIGNAL SFDR = 86.7 dBc SINAD = 69.9 dBFS SNR = 70.1 dBFS THD = 82.7 dBc SFDR = 79.9 dBc SINAD = 68.2 dBFS SNR = 68.8 dBFS THD = 78.2 dBc −20 −40 Amplitude − dB −40 Amplitude − dB 60 0 −20 −60 −80 −100 −60 −80 −100 −120 −120 −140 −140 −160 −160 0 10 20 30 40 50 60 f − Frequency − MHz 0 10 20 30 40 50 60 f − Frequency − MHz G003 G004 Figure 8. Figure 9. FFT for 230 MHz INPUT SIGNAL INTERMODULATION DISTORTION (IMD) vs FREQUENCY 0 0 SFDR = 79.2 dBc SINAD = 67.4 dBFS SNR = 68 dBFS THD = 77.9 dBc −20 fIN1 = 46.1 MHz, –7 dBFS fIN2 = 50.1 MHz, –7 dBFS 2-Tone IMD = –90.2 dBFS SFDR = –98.8 dBFS −20 −40 Amplitude − dB −40 Amplitude − dB 50 Figure 7. 0 −60 −80 −100 −60 −80 −100 −120 −120 −140 −140 −160 −160 0 10 20 30 40 f − Frequency − MHz 50 60 0 G005 Figure 10. 24 40 f − Frequency − MHz 10 20 30 40 f − Frequency − MHz Figure 11. Submit Documentation Feedback 50 60 G006 ADS6425 www.ti.com SLWS197 – MARCH 2007 TYPICAL CHARACTERISTICS (continued) All plots are at 25°C, AVDD = LVDD = 3.3 V, sampling frequency = 125 MSPS, sine wave input clock, 1.5 VPP differential clock amplitude, 50% clock duty cycle, –1 dBFS differential analog input, internal reference mode, 0 dB gain (unless otherwise noted) INTERMODULATION DISTORTION (IMD) vs FREQUENCY SFDR vs INPUT FREQUENCY 90 0 fIN1 = 185.1 MHz, –7 dBFS fIN2 = 190.1 MHz, –7 dBFS 2-Tone IMD = –81 dBFS SFDR = –91 dBFS −20 86 84 SFDR − dBc Amplitude − dB −40 88 −60 −80 −100 82 Gain = 3.5 dB 80 78 −120 76 −140 74 −160 72 0 10 20 30 40 50 Gain = 0 dB 0 60 f − Frequency − MHz 50 100 150 200 250 fIN − Input Frequency − MHz G021 Figure 12. G007 Figure 13. SNR vs INPUT FREQUENCY SFDR vs INPUT FREQUENCY ACROSS GAINS 72 92 Input adjusted to get −1dBFS input 3 dB 90 71 70 Gain = 0 dB 69 68 5 dB 86 SFDR − dBc SNR − dBFS 88 4 dB 84 82 80 Gain = 3.5 dB 6 dB 2 dB 78 67 76 66 0 dB 0 50 100 150 200 250 fIN − Input Frequency − MHz 10 30 50 70 90 110 130 150 170 190 210 230 Fin − Input Frequency − MHz G008 Figure 14. SINAD vs INPUT FREQUENCY ACROSS GAINS PERFORMANCE vs AVDD 88 0 dB 71 76 86 4 dB 70 G009 Figure 15. 72 75 SFDR 84 74 69 3 dB 3.5 dB 1 dB 68 67 82 73 80 72 SNR 78 71 76 66 70 fIN = 50.1 MHz LVDD = 3.3 V 74 6 dB 5 dB 65 20 40 60 80 100 120 140 160 180 200 220 Fin − Input Frequency − MHz 72 3.0 G010 Figure 16. SNR − dBFS 2 dB SFDR − dBc SINAD − dBFS 1 dB 74 3.1 3.2 3.3 3.4 AVDD − Supply Voltage − V 3.5 69 68 3.6 G011 Figure 17. Submit Documentation Feedback 25 ADS6425 www.ti.com SLWS197 – MARCH 2007 TYPICAL CHARACTERISTICS (continued) All plots are at 25°C, AVDD = LVDD = 3.3 V, sampling frequency = 125 MSPS, sine wave input clock, 1.5 VPP differential clock amplitude, 50% clock duty cycle, –1 dBFS differential analog input, internal reference mode, 0 dB gain (unless otherwise noted) PERFORMANCE vs LVDD PERFORMANCE vs TEMPERATURE 98 86 73 fIN = 50.1 MHz AVDD = 3.3 V 94 74 84 72 73 86 70 SFDR 82 82 72 80 71 SNR 78 69 SNR − dBFS 71 SFDR − dBc SNR 90 SNR − dBFS SFDR − dBc SFDR 70 76 69 fIN = 50.1 MHz 3.1 3.2 3.3 3.4 68 3.6 3.5 LVDD − Supply Voltage − V 74 −40 68 −20 0 20 100 75 90 74 88 SFDR (dBFS) 90 80 73 SNR (dBFS) 72 60 71 50 −50 −40 fIN = 20 MHz −30 −20 −10 SFDR − dBc 92 30 −60 G013 PERFORMANCE vs CLOCK AMPLITUDE 76 SNR − dBFS SFDR − dBc, dBFS PERFORMANCE vs INPUT AMPLITUDE SFDR (dBc) 80 Figure 19. 110 40 60 T − Temperature − °C G012 Figure 18. 70 40 73 72 SNR 86 71 84 70 82 70 80 69 78 68 76 0.5 0 Input Amplitude − dBFS 74 fIN = 50.1 MHz SNR − dBFS 78 3.0 69 SFDR 68 67 1.0 1.5 2.0 66 3.0 2.5 Input Clock Amplitude − VPP G014 Figure 20. G015 Figure 21. PERFORMANCE vs CLOCK DUTY CYCLE POWER DISSIPATION vs SAMPLING FREQUENCY 90 77 89 75 2.0 88 73 87 71 86 69 SNR 85 SNR − dBFS SFDR − dBc SFDR 67 fIN = 20.1 MHz 65 40 1.6 1.4 1.2 1.0 AVDD 0.8 0.6 LVDD 0.4 0.2 84 35 PD − Power Dissipation − W 1.8 45 50 55 Input Clock Duty Cycle − % 60 0.0 65 0 G020 Figure 22. 26 25 50 75 Figure 23. Submit Documentation Feedback 100 fS − Sampling Frequency − MSPS 125 G016 ADS6425 www.ti.com SLWS197 – MARCH 2007 TYPICAL CHARACTERISTICS (continued) All plots are at 25°C, AVDD = LVDD = 3.3 V, sampling frequency = 125 MSPS, sine wave input clock, 1.5 VPP differential clock amplitude, 50% clock duty cycle, –1 dBFS differential analog input, internal reference mode, 0 dB gain (unless otherwise noted) OUTPUT NOISE HISTOGRAM WITH INPUTS TIED TO COMMON-MODE PERFORMANCE IN EXTERNAL REFERENCE MODE 80 94 73 fIN = 50.1 MHz External Reference Mode RMS = 0.407 LSB 70 92 72 40 30 90 71 SNR 88 70 SNR − dBFS SFDR − dBc 50 SFDR 20 86 69 10 0 2044 2045 2046 2047 2048 2049 84 1.30 2050 1.35 1.40 1.45 1.50 1.55 VVCM − VCM Voltage − V Output Code G017 Figure 24. 1.60 1.65 68 1.70 G018 Figure 25. CMRR vs FREQUENCY CMRR − Common−Mode Rejection Ratio − dBc Occurence − % 60 0 −10 −20 −30 −40 −50 −60 −70 −80 −90 −100 0 50 100 150 200 f − Frequency − MHz 250 300 G019 Figure 26. Submit Documentation Feedback 27 ADS6425 www.ti.com SLWS197 – MARCH 2007 TYPICAL CHARACTERISTICS (continued) All plots are at 25°C, AVDD = LVDD = 3.3 V, sampling frequency = 125 MSPS, sine wave input clock, 1.5 VPP differential clock amplitude, 50% clock duty cycle, –1 dBFS differential analog input, internal reference mode, 0 dB gain (unless otherwise noted) 125 120 fS - Sampling Frequency - MSPS 110 70 69.5 69 68.5 70.5 71 100 70.5 71 90 70.5 70 80 69.5 69 70 68.5 60 67.5 50 71 40 10 20 40 68 70.5 60 80 100 69 69.5 70 120 140 160 68.5 180 200 220 230 fIN - Input Frequency - MHz 66 67 68 69 70 71 SNR - dBFS Figure 27. SNR Contour 28 Submit Documentation Feedback 72 73 74 75 M0048-12 ADS6425 www.ti.com SLWS197 – MARCH 2007 TYPICAL CHARACTERISTICS (continued) All plots are at 25°C, AVDD = LVDD = 3.3 V, sampling frequency = 125 MSPS, sine wave input clock, 1.5 VPP differential clock amplitude, 50% clock duty cycle, –1 dBFS differential analog input, internal reference mode, 0 dB gain (unless otherwise noted) 125 77 120 83 80 fS - Sampling Frequency - MSPS 110 100 89 90 86 86 86 83 80 89 92 83 70 60 86 89 50 83 92 40 10 20 40 80 60 100 120 140 160 180 200 220 230 92 94 fIN - Input Frequency - MHz 74 76 78 80 82 84 86 SFDR - dBc 88 90 95 M0048-11 Figure 28. SFDR Contour Submit Documentation Feedback 29 ADS6425 www.ti.com SLWS197 – MARCH 2007 APPLICATION INFORMATION THEORY OF OPERATION The ADS6425 is a quad channel, 12-bit, 125-MSPS, pipeline ADC, based on switched capacitor architecture in CMOS technology. The conversion is initiated simultaneously by all the four channels at the rising edge of the external input clock. After the input signals are captured by the sample and hold circuit of each channel, the samples are sequentially converted by a series of low resolution stages. The stage outputs are combined in a digital correction logic block to form the final 12-bit word with a latency of 12 clock cycles. The 12-bit word of each channel is serialized and output as LVDS levels. In addition to the data streams, a bit clock and a frame clock are also output. The frame clock is aligned with the 12-bit word boundary. ANALOG INPUT The analog input consists of a switched-capacitor based differential sample and hold architecture, shown in Figure 29. This differential topology results in very good AC performance even for high input frequencies. The INP and INM pins have to be externally biased around a common-mode voltage of 1.5 V, available on VCM pin 13. For a full-scale differential input, each input pin INP, INM has to swing symmetrically between VCM + 0.5 V and VCM – 0.5 V, resulting in a 2-Vpp differential input swing. The maximum swing is determined by the internal reference voltages REFP (2.0V nominal) and REFM (1.0 V, nominal). The sampling circuit has a 3 dB bandwidth that extends up to 500 MHz (Figure 30, shown by the transfer function from the analog input pins to the voltage across the sampling capacitors TF_ADC). Sampling Switch Lpkg 6 nH 25 W Sampling Capacitor RCR Filter INP Cbond 2 pF 50 W Resr 200 W Lpkg 6 nH 3.2 pF Cpar2 Ron 1 pF 15 W Cpar1 0.8 pF Ron 10 W 50 W Ron 15 W 25 W INM Cpar2 1 pF Cbond 2 pF Resr 200 W Csamp 4.0 pF Csamp 4.0 pF Sampling Capacitor Sampling Switch S0237-01 Figure 29. Input Sampling Circuit 30 Submit Documentation Feedback ADS6425 www.ti.com SLWS197 – MARCH 2007 APPLICATION INFORMATION (continued) 1 0 Magnitude − dB −1 −2 −3 −4 −5 −6 0 100 200 300 400 500 600 fIN − Input Frequency − MHz 700 G022 Figure 30. Analog Input Bandwidth (represented by magnitude of TF_ADC, see Figure 31) Drive Circuit Requirements For optimum performance, the analog inputs must be driven differentially. This improves the common-mode noise immunity and even order harmonic rejection. A 5-Ω resistor in series with each input pin is recommended to damp out ringing caused by the package parasitics. It is also necessary to present low impedance (< 50 Ω) for the common mode switching currents. For example, this is achieved by using two resistors from each input terminated to the common mode voltage (VCM). Using RF-Transformer Based Drive Circuits Figure 31 shows a configuration using a single 1:1 turns ratio transformer (for example, WBC1-1) that can be used for low input frequencies up to 100MHz. The single-ended signal is fed to the primary winding of the RF transformer. The transformer is terminated on the secondary side. Putting the termination on the secondary side helps to shield the kickbacks caused by the sampling circuit from the RF transformer’s leakage inductances. The termination is accomplished by two resistors connected in series, with the center point connected to the 1.5 V common mode (VCM pin). The value of the termination resistors (connected to common mode) has to be low (< 100 Ω) to provide a low-impedance path for the ADC common-mode switching current. TF_ADC 0.1 mF ADS6xxx 5W INP 0.1 mF 25 W 25 W INM 1:1 5W VCM S0256-01 Figure 31. Single Transformer Drive Circuit Submit Documentation Feedback 31 ADS6425 www.ti.com SLWS197 – MARCH 2007 APPLICATION INFORMATION (continued) At high input frequencies, the mismatch in the transformer parasitic capacitance (between the windings) results in degraded even-order harmonic performance. Connecting two identical RF transformers back-to-back helps minimize this mismatch, and good performance is obtained for high frequency input signals. Figure 32 shows an example using two transformers (Coilcraft WBC1-1). An additional termination resistor pair (enclosed within the shaded box in Figure 32) may be required between the two transformers to improve the balance between the P and M sides. The center point of this termination must be connected to ground. ADS6xxx 0.1 mF 5W INP 50 W 0.1 mF 50 W 50 W 50 W INM 1:1 1:1 5W VCM S0164-04 Figure 32. Two Transformer Drive Circuit INPUT COMMON MODE To ensure a low-noise common-mode reference, the VCM pin is filtered with a 0.1-µF low-inductance capacitor connected to ground. The VCM pin is designed to directly drive the ADC inputs. The input stage of the ADC sinks a common-mode current in the order of 155 µA at 125 MSPS (per input pin). Equation 1 describes the dependency of the common-mode current and the sampling frequency. 155 mAxFs 125 MSPS (1) This equation helps to design the output capability and impedance of the CM driving circuit accordingly. REFERENCE The ADS6425 has built-in internal references REFP and REFM, requiring no external components. Design schemes are used to linearize the converter load seen by the references; this and the on-chip integration of the requisite reference capacitors eliminates the need for external decoupling. The full-scale input range of the converter can be controlled in the external reference mode as explained below. The internal or external reference modes can be selected by programming the register bit <REF> (Table 11). 32 Submit Documentation Feedback ADS6425 www.ti.com SLWS197 – MARCH 2007 APPLICATION INFORMATION (continued) INTREF Internal Reference VCM 1 kW INTREF 4 kW EXTREF REFM REFP ADS6xxx S0165-04 Figure 33. Reference Section Internal Reference When the device is in internal reference mode, the REFP and REFM voltages are generated internally. Common-mode voltage (1.5 V nominal) is output on VCM pin, which can be used to externally bias the analog input pins. External Reference When the device is in external reference mode, the VCM acts as a reference input pin. The voltage forced on the VCM pin is buffered and gained by 1.33 internally, generating the REFP and REFM voltages. The differential input voltage corresponding to full-scale is given by Equation 2. Full−scale differential input pp + (Voltage forced on VCM) 1.33 (2) In this mode, the range of voltage applied on VCM pin should be 1.45 to 1.55V. The 1.5-V common-mode voltage to bias the input pins has to be generated externally. COARSE GAIN AND PROGRAMMABLE FINE GAIN ADS6425 includes gain settings that can be used to get improved SFDR performance (compared to 0 dB gain mode). The gain settings are 3.5 dB coarse gain and programmable fine gain from 0 dB to 6 dB. For each gain setting, the analog input full-scale range scales proportionally, as shown in Table 19. The coarse gain is a fixed setting of 3.5 dB and is designed to improve SFDR with little degradation in SNR (as seen in Figure 13 andFigure 14). The fine gain is programmable in 1 dB steps from 0 to 6 dB. With the fine gain also, SFDR improvement is achieved, but at the expense of SNR (there will be about 1dB SNR degradation for every 1dB of fine gain). So, the fine gain can be used to trade-off between SFDR and SNR. The coarse gain makes it possible to get best SFDR but without losing SNR significantly. At high input frequencies, the gains are especially useful as the SFDR improvement is significant with marginal degradation in SINAD. The gains can be programmed using the register bits <COARSE GAIN> (Table 16) and <FINE GAIN> (Table 15). Note that the default gain after reset is 0 dB. Submit Documentation Feedback 33 ADS6425 www.ti.com SLWS197 – MARCH 2007 Table 19. Full-Scale Range Across Gains GAIN, dB TYPE 0 Default (after reset) FULL-SCALE, Vpp 2 3.5 Coarse setting (fixed) 1.34 1 1.78 2 1.59 3 1.42 Fine setting (programmable) 4 1.26 5 1.12 6 1.00 CLOCK INPUT The ADS6425 clock inputs can be driven differentially (SINE, LVPECL or LVDS) or single-ended (LVCMOS), with little or no difference in performance between them. The common-mode voltage of the clock inputs is set to VCM using internal 5-kΩ resistors as shown in Figure 34. This allows using transformer-coupled drive circuits for sine wave clock or ac-coupling for LVPECL, LVDS clock sources (see Figure 35 and Figure 37). VCM VCM 5 kW 5 kW CLKP CLKM ADS6xxx S0166-04 Figure 34. Internal Clock Buffer 0.1 mF CLKP Differential Sine-Wave or PECL or LVDS Clock Input 0.1 mF CLKM ADS6xxx S0167-05 Figure 35. Differential Clock Driving Circuit 34 Submit Documentation Feedback ADS6425 www.ti.com SLWS197 – MARCH 2007 Figure 36 shows a typical scheme using PECL clock drive from a CDCM7005 clock driver. SNR performance with this scheme is comparable with that of a low jitter sine wave clock source. VCC Reference Clock REF_IN VCC Y0 CLKP Y0B CLKM CDCM7005 VCXO_INP OUTM VCXO_INM CP_OUT ADS6xxx VCXO OUTP CTRL S0238-02 Figure 36. PECL Clock Drive Using CDCM7005 Single-ended CMOS clock can be ac-coupled to the CLKP input, with CLKM (pin) connected to ground with a 0.1-µF capacitor, as shown in Figure 37. 0.1 mF CMOS Clock Input CLKP 0.1 mF CLKM ADS6xxx S0168-07 Figure 37. Single-Ended Clock Driving Circuit For best performance, the clock inputs have to be driven differentially, reducing susceptibility to common-mode noise. For high input frequency sampling, it is recommended to use a clock source with very low jitter. Bandpass filtering of the clock source can help reduce the effect of jitter. There is no change in performance with a non-50% duty cycle clock input. CLOCK BUFFER GAIN When using a sinusoidal clock input, the noise contributed by clock jitter improves as the clock amplitude is increased. Hence, it is recommended to use large clock amplitude. As shown by Figure 21, use clock amplitude greater than 1V pp to avoid performance degradation. In addition, the clock buffer has programmable gain to amplify the input clock to support very low clock amplitude. The gain can be set by programming the register bits <CLKIN GAIN> (Table 12) and increases monotonically from Gain 0 to Gain 4 settings. Table 20 shows the minimum clock amplitude supported for each gain setting. Submit Documentation Feedback 35 ADS6425 www.ti.com SLWS197 – MARCH 2007 Table 20. Minimum Clock Amplitude Across Gains CLOCK BUFFER GAIN MINIMUM CLOCK AMPLITUDE SUPPORTED, mV (pp differential) Gain 0 (Minimum gain) 800 Gain 1 (default gain) 400 Gain 2 300 Gain 3 200 Gain 4 (Highest gain) 150 POWER DOWN MODES The ADS6425 has three power down modes – global power down, channel standby and input clock stop. Global Power Down This is a global power down mode in which almost the entire chip is powered down, including the four ADCs, internal references, PLL and LVDS buffers. As a result, the total power dissipation falls to about 77 mW typical (with input clock running). This mode can be initiated by setting the register bit <PDN GLOBAL> (Table 11). The output data and clock buffers are in high impedance state. The wake-up time from this mode to data becoming valid in normal mode is 100 µs. Channel Standby In this mode, only the ADC of each channel is powered down and this helps to get very fast wake-up times. Each of the four ADCs can be powered down independently using the register bits <PDN CH> (Table 11). The analog power dissipation varies from 1115 mW (only one channel in standby) to 245 mW (all four channels in standby). The output LVDS buffers remain powered up. The wake-up time from this mode to data becoming valid in normal mode is 200 clock cycles. Input Clock Stop The converter enters this mode: • If the input clock frequency falls below 1 MSPS or • If the input clock amplitude is less than 400 mV (pp, differential with default clock buffer gain setting) at any sampling frequency. All ADCs and LVDS buffers are powered down and the power dissipation is about 235 mW. The wake-up time from this mode to data becoming valid in normal mode is 100 µs. Table 21. Power Down Modes Summary POWER DOWN MODE AVDD POWER (mW) LVDD POWER (mW) WAKE UP TIME In power-up 1360 297 – Global power down 65 12 100 µs 1 Channel in standby 1115 297 200 Clocks 2 Channels in standby 825 297 200 Clocks 3 Channels in standby 532 297 200 Clocks 4 Channels in standby 245 297 200 Clocks Input clock stop 200 35 100 µs POWER SUPPLY SEQUENCING During power-up, the AVDD and LVDD supplies can come up in any sequence. The two supplies are separated inside the device. Externally, they can be driven from separate supplies or from a single supply. 36 Submit Documentation Feedback ADS6425 www.ti.com SLWS197 – MARCH 2007 DIGITAL OUTPUT INTERFACE The ADS6425 offers several flexible output options making it easy to interface to an ASIC or an FPGA. These options can be easily programmed using either parallel pins and/or the serial interface. The output interface options are: • 1-wire, 1× frame clock, 12× and 14× serialization with DDR bit clock • 2-wire, 1× frame clock, 12× serialization, with DDR and SDR bit clock, byte wise/bit wise/word wise • 2-wire, 1× word clock, 14× serialization, with SDR bit clock, byte wise/bit wise/word wise • 2-wire, (0.5 x) frame clock, 14× serialization, with DDR bit clock, byte wise/bit wise/word wise. The maximum sampling frequency, bit clock frequency and output data rate will vary depending on the interface options selected (refer to Table 12). Table 22. Maximum Recommended Sampling Frequency for Different Output Interface Options INTERFACE OPTIONS MAXIMUM RECOMMENDED SAMPLING FREQUENCY, MSPS BIT CLOCK FREQUENCY, MHZ FRAME CLOCK FREQUENCY, MHZ SERIAL DATA RATE, Mbps 1-Wire DDR Bit clock 12× Serialization 65 390 65 780 14× Serialization 65 455 65 910 2-Wire DDR Bit clock 12× Serialization 125 375 125 750 14× Serialization 125 437.5 62.5 875 SDR Bit clock 12× Serialization 65 390 65 390 14× Serialization 65 455 65 455 2-Wire Each interface option is described in detail below. 1-WIRE INTERFACE - 12× AND 14× SERIALIZATION WITH DDR BIT CLOCK Here the device outputs the data of each ADC serially on a single LVDS pair (1-wire). The data is available at the rising and falling edges of the bit clock (DDR bit clock). The ADC outputs a new word at the rising edge of every frame clock, starting with the MSB. Optionally, it can also be programmed to output the LSB first. The data rate is 12 × Sample frequency (12× serialization) and 14 × Sample frequency (14× serialization). Submit Documentation Feedback 37 ADS6425 www.ti.com SLWS197 – MARCH 2007 Input Clock, CLK Freq = Fs 14-Bit Serialization (1) 12-Bit Serialization Frame Clock, FCLK Freq = 1 ´ Fs Bit Clock, DCLK Freq = 6 ´ Fs Output Data DA, DB, DC, DD Data Rate = 12 ´ Fs D11 (D0) D10 (D1) D9 (D2) D8 (D3) D7 (D4) D6 (D5) D5 (D6) D7 (D6) D6 (D7) D4 (D7) D3 (D8) D2 (D9) D1 (D10) D0 (D11) D11 (D0) D0 (0) 0 (D0) D10 (D1) Bit Clock, DCLK Freq = 7 ´ Fs Output Data DA, DB, DC, DD Data Rate = 14 ´ Fs 0 (D0) 0 (D1) D11 (D2) D10 (D3) D9 (D4) D8 (D5) D5 (D8) D4 (D9) D3 D2 (D10) (D11) D1 (0) Sample N 0 (D1) Sample N + 1 Data Bit in MSB First Mode D13 (D2) Data Bit in LSB First Mode (1) In 14-Bit serialization, two zero bits are padded to the 12-bit ADC data on the MSB side. T0225-01 Figure 38. 1-Wire Interface 2-WIRE INTERFACE - 12× SERIALIZATION WITH DDR/SDR BIT CLOCK The 2-wire interface is recommended for sampling frequencies above 65 MSPS. The device outputs the data of each ADC serially on two LVDS pairs (2-wire). The data rate is 6 × Sample frequency since 6 bits are sent on each wire every clock cycle. The data is available along with DDR bit clock or optionally with SDR bit clock. Each ADC sample is sent over the 2 wires as byte-wise or bit-wise or word-wise. 38 Submit Documentation Feedback ADS6425 www.ti.com SLWS197 – MARCH 2007 Input Clock, CLK Freq = Fs Frame Clock, FCLK Freq = 1 ´ Fs Bit Clock – SDR, DCLK Freq = 6 ´ Fs In Byte-Wise Mode Bit Clock – DDR, DCLK Freq = 3 ´ Fs Output Data DA0, DB0, DC0, DD0 D5 (D0) D4 (D1) D3 (D2) D2 (D3) D1 (D4) D0 (D5) D5 (D0) D4 (D1) D3 (D2) D2 (D3) D1 (D4) D0 (D5) Output Data DA1, DB1, DC1, DD1 D11 (D6) D10 (D7) D9 (D8) D8 (D9) D7 D6 D11 (D6) D10 (D7) D9 (D8) D8 (D9) D7 D6 (D10) (D11) (D10) (D11) D10 (D0) D8 (D2) D6 (D4) D4 (D6) D2 (D8) (D10) In Word-Wise Mode In Bit-Wise Mode Data Rate = 6 ´ Fs Output Data DA0, DB0, DC0, DD0 D10 (D0) D8 (D2) D6 (D4) D4 (D6) D2 (D8) (D10) Output Data DA1, DB1, DC1, DD1 D11 (D1) D9 (D3) D7 (D5) D5 (D7) D3 (D9) (D11) D11 (D1) D9 (D3) D7 (D5) D5 (D7) D3 (D9) (D11) Output Data DA0, DB0, DC0, DD0 D11 (D0) D10 (D1) D9 (D2) D8 (D3) D7 (D4) D6 (D5) D5 (D6) D4 (D7) D3 (D8) D2 (D9) D1 D0 (D10) (D11) Output Data DA1, DB1, DC1, DD1 D11 (D0) D10 (D1) D9 (D2) D8 (D3) D7 (D4) D6 (D5) D5 (D6) D4 (D7) D3 (D8) D2 (D9) (D10) (D11) D0 D1 Data Bit in MSB First Mode D1 D0 D1 D0 White Cells – Sample N D5 (D0) Data Bit in LSB First Mode Grey Cells – Sample N + 1 T0226-01 Figure 39. 2-Wire Interface 12× Serialization Submit Documentation Feedback 39 ADS6425 www.ti.com SLWS197 – MARCH 2007 2-WIRE INTERFACE - 14× SERIALIZATION In 14× serialization, two zero bits are padded to the 12-bit ADC data on the MSB side and the combined 14-bit data is serialized and output over two LVDS pairs. A frame clock at 1× sample frequency is also available with an SDR bit clock. With DDR bit clock option, the frame clock frequency is 0.5× sample frequency. The output data rate will be 7 × Sample frequency as 7 data bits are output every clock cycle on each wire. Each ADC sample is sent over the 2 wires as byte-wise or bit-wise or word-wise. Using the 14× serialization makes it possible to upgrade to a 14-bit ADC in the 64xx family in the future seamlessly, without requiring any modification to the receiver capture logic design. 40 Submit Documentation Feedback ADS6425 www.ti.com SLWS197 – MARCH 2007 Input Clock, CLK Freq = Fs Frame Clock, FCLK Freq = 1 ´ Fs In Byte-Wise Mode Bit Clock – SDR, DCLK Freq = 7 ´ Fs Output Data DA0, DB0, DC0, DD0 D6 (D0) D5 (D1) D4 (D2) D3 (D3) D2 (D4) D1 (D5) D0 (D6) D6 (D0) D5 (D1) D4 (D2) D3 (D3) D2 (D4) D1 (D5) D0 (D6) D6 (D0) D5 (D1) Output Data DA1, DB1, DC1, DD1 0 (D7) 0 (D8) D11 (D9) D10 D9 D8 (0) D7 (0) 0 (D7) 0 (D8) D11 (D9) D10 D9 (D10) (D11) (D10) (D11) D8 (0) D7 (0) 0 (D7) 0 (D8) D2 D0 (0) 0 (D0) D10 (D2) D8 (D4) D6 (D6) D4 (D8) D2 (D10) D0 (0) 0 (D0) D10 (D2) (D11) D1 (0) 0 (D1) D11 (D3) D1 (0) D0 (0) 0 (D0) 0 (D1) D1 (0) D0 (0) 0 (D0) 0 (D1) In Word-Wise Mode In Bit-Wise Mode Data Rate = 7 ´ Fs Output Data DA0, DB0, DC0, DD0 0 (D0) D10 (D2) D8 (D4) D6 (D6) D4 (D8) (D10) Output Data DA1, DB1, DC1, DD1 0 (D1) D11 (D3) D9 (D5) D7 (D7) D5 (D9) (D11) D1 (0) 0 (D1) D11 (D3) D9 (D5) D7 (D7) D5 (D9) Output Data DA0, DB0, DC0, DD0 0 (D0) 0 (D1) D11 (D2) D10 (D3) D9 (D4) D8 (D5) D7 (D6) D6 (D7) D5 (D8) D4 (D9) D3 D2 (D10) (D11) Output Data DA1, DB1, DC1, DD1 0 (D0) 0 (D1) D11 (D2) D10 (D3) D9 (D4) D8 (D5) D7 (D6) D6 (D7) D5 (D8) D4 (D9) (D10) (D11) D3 Data Bit in MSB First Mode D3 D2 D3 White Cells – Sample N D6 (D0) Data Bit in LSB First Mode Grey Cells – Sample N + 1 T0227-01 Figure 40. 2-Wire Interface 14× Serialization - SDR Bit Clock Submit Documentation Feedback 41 ADS6425 www.ti.com SLWS197 – MARCH 2007 Input Clock, CLK Freq = Fs Frame Clock, FCLK Freq = 0.5 ´ Fs In Byte-Wise Mode Bit Clock – DDR, DCLK Freq = 3.5 ´ Fs Output Data DA0, DB0, DC0, DD0 D6 (D0) D5 (D1) D4 (D2) D3 (D3) D2 (D4) D1 (D5) D0 (D6) D6 (D0) D5 (D1) D4 (D2) D3 (D3) D2 (D4) D1 (D5) D0 (D6) D6 (D0) D5 (D1) Output Data DA1, DB1, DC1, DD1 0 (D7) 0 (D8) D11 (D9) D10 D9 D8 (0) D7 (0) 0 (D7) 0 (D8) D11 (D9) D10 D9 (D10) (D11) (D10) (D11) D8 (0) D7 (0) 0 (D7) 0 (D8) D2 D0 (0) 0 (D0) D10 (D2) D8 (D4) D6 (D6) D4 (D8) D2 (D10) D0 (0) 0 (D0) D10 (D2) (D11) D1 (0) 0 (D1) D11 (D3) D1 (0) D0 (0) 0 (D0) 0 (D1) D1 (0) D0 (0) 0 (D0) 0 (D1) In Word-Wise Mode In Bit-Wise Mode Data Rate = 7 ´ Fs Output Data DA0, DB0, DC0, DD0 0 (D0) D10 (D2) D8 (D4) D6 (D6) D4 (D8) (D10) Output Data DA1, DB1, DC1, DD1 0 (D1) D11 (D3) D9 (D5) D7 (D7) D5 (D9) (D11) D1 (0) 0 (D1) D11 (D3) D9 (D5) D7 (D7) D5 (D9) Output Data DA0, DB0, DC0, DD0 0 (D0) 0 (D1) D11 (D2) D10 (D3) D9 (D4) D8 (D5) D7 (D6) D6 (D7) D5 (D8) D4 (D9) D3 D2 (D10) (D11) Output Data DA1, DB1, DC1, DD1 0 (D0) 0 (D1) D11 (D2) D10 (D3) D9 (D4) D8 (D5) D7 (D6) D6 (D7) D5 (D8) D4 (D9) (D10) (D11) D3 Data Bit in MSB First Mode D3 D2 D3 White Cells – Sample N D6 (D0) Data Bit in LSB First Mode Grey Cells – Sample N + 1 T0228-01 Figure 41. 2-Wire interface 14× Serialization - DDR Bit Clock 42 Submit Documentation Feedback ADS6425 www.ti.com SLWS197 – MARCH 2007 OUTPUT BIT ORDER In the 2-wire interface, three types of bit order are supported - byte-wise, bit-wise and word-wise. Byte-wise: Each 12-bit sample is split across the 2 wires. Wires DA0, DB0, DC0 and DD0 carry the 6 LSB bits D5-D0 and wires DA1, DB1, DC1 and DD1 carry the 6 MSB bits. Bit-wise: Each 12-bit sample is split across the 2 wires. Wires DA0, DB0, DC0 and DD0 carry the 6 even bits (D0,D2,D4..) and wires DA1, DB1, DC1 and DD1 carry the 6 odd bits (D1,D3,D5...). Word-wise: In this case, all 12-bits of a sample are sent over a single wire. Successive samples are sent over the 2 wires. For example sample N is sent on wires DA0, DB0, DC0 and DD0, while sample N+1 is sent over wires DA1, DB1, DC1 and DD1. The frame clock frequency is 0.5x sampling frequency, with the rising edge aligned with the start of each word. MSB/LSB FIRST By default after reset, the 12-bit ADC data is output serially with the MSB first (D11,D10,...D1,D0). The data can be output LSB first also by programming the register bit <MSB_LSB_First>. In the 2-wire mode, the bit order in each wire is flipped in the LSB first mode. OUTPUT DATA FORMATS Two output data formats are supported – 2s complement (default after reset) and offset binary. They can be selected using the serial interface register bit <DF>. In the event of an input voltage overdrive, the digital outputs go to the appropriate full-scale level. For a positive overdrive, the output code is 0xFFF in offset binary output format, and 0x7FF in 2s complement output format. For a negative input overdrive, the output code is 0x000 in offset binary output format and 0x800 in 2s complement output format. LVDS CURRENT CONTROL The default LVDS buffer current is 3.5 mA. With an external 100-Ω termination resistance, this develops ±350-mV logic levels at the receiver. The LVDS buffer currents can also be programmed to 2.5 mA, 3.0 mA and 4.5 mA using the register bits <LVDS CURR>. In addition, there exists a current double mode, where the LVDS nominal current is doubled (register bits <CURR DOUBLE>, Table 17). LVDS INTERNAL TERMINATION An internal termination option is available (using the serial interface), by which the LVDS buffers are differentially terminated inside the device. Five termination resistances are available – 166, 200, 250, 333, and 500 Ω (nominal with ±20% variation). Any combination of these terminations can be programmed; the effective termination will be the parallel combination of the selected resistances. The terminations can be programmed separately for the clock and data buffers (bits <TERM CLK> and <TERM DATA>, Table 18). The internal termination helps to absorb any reflections from the receiver end, improving the signal integrity. This makes it possible to drive up to 10 pF of load capacitance, compared to only 5 pF without the internal termination.Figure 42 and Figure 43 show the eye diagram with 5 pF and 10 pF load capacitors (connected from each output pin to ground). With 100-Ω internal and 100-Ω external termination, the voltage swing at the receiver end will be halved (compared to no internal termination). The voltage swing can be restored by using the LVDS current double mode (bits <CURR DOUBLE>, Table 17). Submit Documentation Feedback 43 ADS6425 www.ti.com SLWS197 – MARCH 2007 C001 Figure 42. LVDS Data Eye Diagram with 5-pF Load Capacitance (No Internal Termination) C002 Figure 43. LVDS Data Eye Diagram with 10-pF Load Capacitance (100 Ω Internal Termination) CAPTURE TEST PATTERNS ADS6425 outputs the bit clock (DCLK), positioned nearly at the center of the data transitions. It is recommended to route the bit clock, frame clock and output data lines with minimum relative skew on the PCB. This ensures sufficient setup/hold times for a reliable capture by the receiver. The DESKEW is a 1010... or 0101... pattern output on the serial data lines that can be used to verify if the receiver capture clock edge is positioned correctly. This may be useful in case there is some skew between DCLK and serial data inside the receiver. Once deserialized, it is required to ensure that the parallel data is aligned to the frame boundary. The SYNC test pattern can be used for this. For example, in the 1-wire interface, the SYNC pattern is 6 '1's followed by 6 '0's (from MSB to LSB). This information can be used by the receiver logic to shift the deserialized data till it matches the SYNC pattern. In addition to DESKEW and SYNC, the ADS6425 includes other test patterns to verify correctness of the capture by the receiver such as all zeros, all ones and toggle. These patterns are output on all four channel data lines simultaneously. Some patterns like custom and sync are affected by the type of interface selected, serialization and bit order. 44 Submit Documentation Feedback ADS6425 www.ti.com SLWS197 – MARCH 2007 Table 23. Test Patterns PATTERN DESCRIPTION All zeros Outputs logic low. All ones Outputs logic high. Toggle Outputs toggle pattern - <D11-D0> alternates between 101010101010 and 010101010101 every clock cycle. Custom Outputs a 12-bit custom pattern. The 12-bit custom pattern can be specified into two serial interface registers. In the 2-wire interface, each code is sent over the 2 wires depending on the serialization and bit order. Sync Deskew Outputs a sync pattern. Outputs deskew pattern. Either <D11-D0> = 101010101010 OR <D11-D0> = 010101010101 every clock cycle. Table 24. SYNC Pattern INTERFACE OPTION 1-Wire 2-Wire SERIALIZATION SYNC PATTERN ON EACH WIRE 12 X MSB-111111000000-LSB 14 X MSB-11111110000000-LSB 12 X MSB-111000-LSB 14 X MSB-1111000-LSB Submit Documentation Feedback 45 ADS6425 www.ti.com SLWS197 – MARCH 2007 OUTPUT TIMINGS AT LOWER SAMPLING FREQUENCIES Setup, hold and other timing parameters are specified across sampling frequencies and for each type of output interface in the tables below. Table 26 to Table 29: Typical values are at 25°C, min and max values are across the full temperature range TMIN = –40°C to TMAX = 85°C, AVDD = LVDD = 3.3 V, CL = 5 pF , IO = 3.5 mA, RL = 100 Ω , no internal termination, unless otherwise noted. Timing parameters are ensured by design and characterization and not tested in production. Ts = 1/ Sampling frequency = 1/Fs Table 25. Clock Propagation Delay and Serializer Latency for different interface options INTERFACE SERIALIZATION 1-wire with DDR bit clock 2-wire with DDR bit clock 2-wire with SDR bit clock 2-wire with DDR bit clock 12X tpd_clk = 0.5xTs + tdelay 14X tpd_clk = 0.428xTs + tdelay 12X (1) 0 tpd_clk = tdelay 1 tpd_clk = 0.5xTs + tdelay 0 2 (when tpd_clk≥ Ts) tpd_clk = 0.857xTs + tdelay 14X 2-wire with SDR bit clock (1) SERIALIZER LATENCY clock cycles CLOCK PROPAGATION DELAY, tpd_clk 1 (when tpd_clk < Ts) tpd_clk = 0.428xTs + tdelay 0 Note that the total latency = ADC latency + serializer latency. The ADC latency is 12 clocks. Table 26. Timings for 1-Wire Interface SERIALIZATION 12× 14× DATA SETUP TIME, tsu ns DATA HOLD TIME, th ns SAMPLING FREQUENCY MSPS MIN TYP MIN TYP 65 0.4 0.6 0.5 0.7 40 0.8 1.0 0.9 1.1 20 1.6 2.0 1.8 2.2 10 3.5 4.0 3.5 4.2 MAX 65 0.3 0.5 0.4 0.6 40 0.65 0.85 0.7 0.9 20 1.3 1.65 1.6 1.9 10 3.2 3.5 3.2 3.6 tdelay ns MAX MIN TYP MAX Fs≥ 40 MSPS 3 4 5 Fs < 40 MSPS 3 4.5 6 Fs≥ 40 MSPS 3 4 5 Fs < 40 MSPS 3 4.5 6 Table 27. Timings for 2-Wire Interface, DDR Bit Clock SERIALIZATION 12× 14× 46 DATA SETUP TIME, tsu ns DATA HOLD TIME, th ns SAMPLING FREQUENCY MSPS MIN TYP MIN TYP 105 0.55 0.75 0.6 0.8 92 0.65 0.85 0.7 0.9 80 0.8 1.0 0.8 1.05 65 0.9 1.2 1.0 1.3 40 1.7 2.0 1.1 2.1 105 0.45 0.65 0.5 0.7 92 0.55 0.75 0.6 0.8 80 0.65 0.85 0.7 0.9 65 0.8 1.1 0.8 1.1 40 1.4 1.7 1.5 1.9 MAX Submit Documentation Feedback tdelay ns MAX MIN TYP MAX Fs≥ 45 MSPS 3.4 4.4 5.4 Fs < 45 MSPS 3.7 5.2 6.7 Fs≥ 45 MSPS 3 4 5 Fs < 45 MSPS 3 4.5 6 ADS6425 www.ti.com SLWS197 – MARCH 2007 Table 28. Timings for 2-Wire Interface, SDR Bit Clock SERIALIZATION 12× 14× DATA SETUP TIME, tsu ns DATA HOLD TIME, th ns SAMPLING FREQUENCY MSPS MIN TYP MIN TYP 65 1.0 1.2 1.1 1.3 40 1.8 2.0 1.9 2.1 20 3.9 4.1 3.8 4.1 10 8.2 8.4 7.8 8.2 65 0.8 1.0 1.0 1.2 40 1.5 1.7 1.6 1.8 20 3.4 3.6 3.3 3.5 10 6.9 7.2 6.6 6.9 MAX tdelay ns MAX MIN TYP MAX Fs≥ 40 MSPS 3.4 4.4 5.4 Fs < 40 MSPS 3.7 5.2 6.7 Fs≥ 40 MSPS 3.4 4.4 5.4 Fs < 40 MSPS 3.7 5.2 6.7 Table 29. Output Jitter (applies to all interface options) SAMPLING FREQUENCY MSPS ≥ 65 BIT CLOCK JITTER, CYCLE-CYCLE ps, peak-peak MIN TYP MAX 350 Submit Documentation Feedback FRAME CLOCK JITTER, CYCLE-CYCLE ps, peak-peak MIN TYP MAX 75 47 ADS6425 www.ti.com SLWS197 – MARCH 2007 DEFINITION OF SPECIFICATIONS Analog Bandwidth – The analog input frequency at which the power of the fundamental is reduced by 3 dB with respect to the low frequency value. Aperture Delay – The delay in time between the rising edge of the input sampling clock and the actual time at which the sampling occurs. Aperture Uncertainty (Jitter) – The sample-to-sample variation in aperture delay. Clock Pulse Width/Duty Cycle – The duty cycle of a clock signal is the ratio of the time the clock signal remains at a logic high (clock pulse width) to the period of the clock signal. Duty cycle is typically expressed as a percentage. A perfect differential sine-wave clock results in a 50% duty cycle. Maximum Conversion Rate – The maximum sampling rate at which certified operation is given. All parametric testing is performed at this sampling rate unless otherwise noted. Minimum Conversion Rate –The minimum sampling rate at which the ADC functions. Differential Nonlinearity (DNL) – An ideal ADC exhibits code transitions at analog input values spaced exactly 1 LSB apart. The DNL is the deviation of any single step from this ideal value, measured in units of LSBs. Integral Nonlinearity (INL) – The INL is the deviation of the ADC's transfer function from a best fit line determined by a least squares curve fit of that transfer function, measured in units of LSBs. Gain Error – The gain error is the deviation of the ADC's actual input full-scale range from its ideal value. The gain error is given as a percentage of the ideal input full-scale range. Offset Error – The offset error is the difference, given in number of LSBs, between the ADC's actual average idle channel output code and the ideal average idle channel output code. This quantity is often mapped into mV. Temperature Drift – The temperature drift coefficient (with respect to gain error and offset error) specifies the change per degree Celsius of the parameter from TMIN to TMAX. It is calculated by dividing the maximum deviation of the parameter across the TMIN to TMAX range by the difference TMAX–TMIN. Signal-to-Noise Ratio – SNR is the ratio of the power of the fundamental (PS) to the noise floor power (PN), excluding the power at DC and the first nine harmonics. P SNR + 10Log10 S PN (3) SNR is either given in units of dBc (dB to carrier) when the absolute power of the fundamental is used as the reference, or dBFS (dB to full scale) when the power of the fundamental is extrapolated to the converter’s full-scale range. Signal-to-Noise and Distortion (SINAD) – SINAD is the ratio of the power of the fundamental (PS) to the power of all the other spectral components including noise (PN) and distortion (PD), but excluding dc. PS SINAD + 10Log10 PN ) PD (4) SINAD is either given in units of dBc (dB to carrier) when the absolute power of the fundamental is used as the reference, or dBFS (dB to full scale) when the power of the fundamental is extrapolated to the converter's full-scale range. Effective Number of Bits (ENOB) – The ENOB is a measure of a converter’s performance as compared to the theoretical limit based on quantization noise. ENOB + SINAD * 1.76 6.02 (5) Total Harmonic Distortion (THD) – THD is the ratio of the power of the fundamental (PS) to the power of the first nine harmonics (PD). P THD + 10Log10 S PD (6) THD is typically given in units of dBc (dB to carrier). 48 Submit Documentation Feedback ADS6425 www.ti.com SLWS197 – MARCH 2007 Spurious-Free Dynamic Range (SFDR) – The ratio of the power of the fundamental to the highest other spectral component (either spur or harmonic). SFDR is typically given in units of dBc (dB to carrier). Two-Tone Intermodulation Distortion – IMD3 is the ratio of the power of the fundamental (at frequencies f1 and f2) to the power of the worst spectral component at either frequency 2f1–f2 or 2f2–f1. IMD3 is either given in units of dBc (dB to carrier) when the absolute power of the fundamental is used as the reference, or dBFS (dB to full scale) when the power of the fundamental is extrapolated to the converter’s full-scale range. DC Power Supply Rejection Ratio (DC PSRR) – The DC PSSR is the ratio of the change in offset error to a change in analog supply voltage. The DC PSRR is typically given in units of mV/V. AC Power Supply Rejection Ratio (AC PSRR) – AC PSRR is the measure of rejection of variations in the supply voltage by the ADC. If ∆Vsup is the change in supply voltage and ∆Vout is the resultant change of the ADC output code (referred to the input), then PSRR + 20Log10 DVout , expressed in dBc DVsup (7) Voltage Overload Recovery – The number of clock cycles taken to recover to less than 1% error for a 6 dB overload on the analog inputs. A 6 dBFS sine wave input at Nyquist frequency is used as the test stimulus. Common Mode Rejection Ratio (CMRR) – CMRR is the measure of rejection of variations in the analog input common-mode by the ADC. If ∆Vcm_in is the change in the common-mode voltage of the input pins and ∆Vout is the resultant change of the ADC output code (referred to the input), then CMRR + 20Log10 DVout , expressed in dBc DVcm_in (8) Submit Documentation Feedback 49 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. 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Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Low Power Wireless www.ti.com/lpw Telephony www.ti.com/telephony Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2007, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 7-May-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty ADS6425IRGCR ACTIVE QFN RGC 64 2000 Green (RoHS & 4204878-0001 Level-3-260C-168 HR no Sb/Br) ADS6425IRGCRG4 ACTIVE QFN RGC 64 2000 Green (RoHS & 4204878-0001 Level-3-260C-168 HR no Sb/Br) ADS6425IRGCT ACTIVE QFN RGC 64 250 Green (RoHS & 4204878-0001 Level-3-260C-168 HR no Sb/Br) ADS6425IRGCTG4 ACTIVE QFN RGC 64 250 Green (RoHS & 4204878-0001 Level-3-260C-168 HR no Sb/Br) Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 17-May-2007 TAPE AND REEL INFORMATION Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com Device 17-May-2007 Package Pins Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant ADS6425IRGCR RGC 64 TAI 330 16 9.3 9.3 1.5 12 16 PKGORN T2TR-MS P ADS6425IRGCT RGC 64 TAI 330 16 9.3 9.3 1.5 12 16 PKGORN T2TR-MS P TAPE AND REEL BOX INFORMATION Device Package Pins Site Length (mm) Width (mm) Height (mm) ADS6425IRGCR RGC 64 TAI 342.9 336.6 28.58 ADS6425IRGCT RGC 64 TAI 342.9 336.6 28.58 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 17-May-2007 Pack Materials-Page 3 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security RFID www.ti-rfid.com Telephony www.ti.com/telephony Low Power Wireless www.ti.com/lpw Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2007, Texas Instruments Incorporated