RUICHIPS RU6Z8R

RU6Z8R
N-Channel Advanced Power MOSFET
Features
Pin Description
• 650V/8A,
RDS (ON) =0.9Ω (Typ.)@VGS=10V
• Super High Dense Cell Design
• Fast Switching
• 100% avalanche tested
TO-220
• Lead Free and Green Devices Available
(RoHS Compliant)
Applications
• High efficiency switch mode power
supplies
• Lighting
N-Channel MOSFET
Absolute Maximum Ratings
Symbol
Parameter
Rating
Unit
Common Ratings (TC=25°C Unless Otherwise Noted)
VDSS
Drain-Source Voltage
650
VGSS
Gate-Source Voltage
±30
Maximum Junction Temperature
150
°C
-55 to 150
°C
TJ
TSTG
IS
Storage Temperature Range
Diode Continuous Forward Current
①
V
TC=25°C
8
A
TC=25°C
32
TC=25°C
A
TC=100°C
8
5.2
TC=25°C
147
W
TC=100°C
59
W
0.85
°C/W
211
mJ
Mounted on Large Heat Sink
IDP
300μs Pulse Drain Current Tested
ID
Continuous Drain Current(VGS=10V)
PD
RθJC
Maximum Power Dissipation
Thermal Resistance-Junction to Case
②
A
①
Drain-Source Avalanche Ratings
③
EAS
Avalanche Energy, Single Pulsed
Copyright Ruichips Semiconductor Co., Ltd
Rev. B– DEC., 2012
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RU6Z8R
Electrical Characteristics
Symbol
(TC=25°C Unless Otherwise Noted)
Parameter
Static Characteristics
BVDSS Drain-Source Breakdown Voltage
IDSS
Zero Gate Voltage Drain Current
VGS(th)
IGSS
RDS(ON)
④
Test Condition
VGS=0V, IDS=250µA
RU6Z8R
Min.
Typ.
1
TJ=85°C
VDS=VGS, IDS=250µA
Gate Leakage Current
VGS=±30V, VDS=0V
Drain-Source On-state Resistance
VGS= 10V, IDS=4A
Unit
V
650
VDS= 650V, VGS=0V
Gate Threshold Voltage
Max.
30
2
0.9
µA
4
V
±100
nA
1.1
Ω
1.5
V
Diode Characteristics
④
VSD
trr
Qrr
Diode Forward Voltage
Reverse Recovery Time
ISD=8A, VGS=0V
ISD=8A, dlSD/dt=100A/µs
Reverse Recovery Charge
430
ns
4
µC
4.3
Ω
⑤
Dynamic Characteristics
RG
Gate Resistance
VGS=0V,VDS=0V,F=1MHz
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
td(ON)
Turn-on Delay Time
tr
Turn-on Rise Time
td(OFF)
Turn-off Delay Time
tf
180
pF
25
80
165
ns
70
⑤
Total Gate Charge
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
Notes:
1550
35
VDD=325V, RL=40Ω,
IDS=8A, VGEN= 10V,
RG=25Ω
Turn-off Fall Time
Gate Charge Characteristics
Qg
VGS=0V,
VDS=325V,
Frequency=1.0MHz
30
VDS=520V, VGS= 10V,
IDS=8A
5
nC
13
①Calculated continuous current based on maximum allowable junction temperature.
②Pulse width limited by safe operating area.
③Limited by TJmax, IAS =6.5A, VDD = 100V, RG = 50Ω , Starting TJ = 25°C.
④Pulse test ; Pulse width≤300µs, duty cycle≤2%.
⑤Guaranteed by design, not subject to production testing.
Copyright Ruichips Semiconductor Co., Ltd
Rev. B– DEC., 2012
2
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RU6Z8R
Typical Characteristics
Drain Current
Ptot - Power (W)
ID - Drain Current (A)
Power Dissipation
Tj - Junction Temperature (°C)
Tj - Junction Temperature (°C)
Safe Operation Area
ID - Drain Current (A)
Normalized Effective Transient
Thermal Transient Impedance
VDS - Drain-Source Voltage (V)
Copyright Ruichips Semiconductor Co., Ltd
Rev. B– DEC., 2012
Square Wave Pulse Duration (sec)
3
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RU6Z8R
Typical Characteristics
Drain-Source On Resistance
ID - Drain Current (A)
RDS(ON) - On Resistance (Ω)
Output Characteristics
VDS - Drain-Source Voltage (V)
ID - Drain Current (A)
Gate Threshold Voltage
RDS(ON) - On - Resistance (Ω)
Normalized Threshold Voltage
Drain-Source On Resistance
VGS - Gate-Source Voltage (V)
Copyright Ruichips Semiconductor Co., Ltd
Rev. B– DEC., 2012
Tj - Junction Temperature (°C)
4
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RU6Z8R
Typical Characteristics
Source-Drain Diode Forward
IS - Source Current (A)
Normalized On Resistance
Drain-Source On Resistance
Tj - Junction Temperature (°C)
VSD - Source-Drain Voltage (V)
Gate Charge
C - Capacitance (pF)
VGS - Gate-Source Voltage (V)
Capacitance
VDS - Drain-Source Voltage (V)
Copyright Ruichips Semiconductor Co., Ltd
Rev. B– DEC., 2012
QG - Gate Charge (nC)
5
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RU6Z8R
Avalanche Test Circuit and Waveforms
Switching Time Test Circuit and Waveforms
Copyright Ruichips Semiconductor Co., Ltd
Rev. B– DEC., 2012
6
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RU6Z8R
Ordering and Marking Information
Device
Marking
Package
Packaging
Quantity
Reel Size
Tape width
RU6Z8R
RU6Z8R
TO-220
Tube
50
-
-
Copyright Ruichips Semiconductor Co., Ltd
Rev. B– DEC., 2012
7
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RU6Z8R
Package Information
TO-220FB-3L
SYMBOL
A
MM
INCH
MM
MIN
NOM
MAX
MIN
NOM
MAX
4.40
4.57
4.70
0.173
0.180
0.185
SYMBOL
Øp1
INCH
MIN
NOM
MAX
MIN
NOM
MAX
1.40
1.50
1.60
0.055
0.059
0.063
A1
1.27
1.30
1.33
0.050
0.051
0.052
e
2.54BSC
0.1BSC
A2
2.35
2.40
2.50
0.093
0.094
0.098
e1
5.08BSC
0.2BSC
b
0.77
-
0.90
0.030
-
0.035
H1
6.40
6.50
6.60
0.252
0.256
0.260
b2
1.23
-
1.36
0.048
-
0.054
L
12.75
-
13.17
0.502
-
0.519
-
-
3.95
-
-
0.156
C
0.48
0.50
0.52
0.019
0.020
0.021
L1
D
15.40
15.60
15.80
0.606
0.614
0.622
L2
D1
9.00
9.10
9.20
0.354
0.358
0.362
Øp
3.57
3.60
3.63
0.141
0.142
0.143
DEP
0.05
0.10
0.20
0.002
0.004
0.008
Q
2.73
2.80
2.87
0.107
0.110
0.113
E
9.70
9.90
10.10
0.382
0.389
0.398
θ1
5°
7°
9°
5°
7°
9°
θ2
1°
3°
5°
1°
3°
5°
E1
-
8.70
-
-
0.343
-
E2
9.80
10.00
10.20
0.386
0.394
0.401
2.50REF.
0.098REF.
ALL DIMENSIONS REFER TO JEDEC STANDARD
DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS
Copyright Ruichips Semiconductor Co., Ltd
Rev. B– DEC., 2012
8
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RU6Z8R
Customer Service
Worldwide Sales and Service:
[email protected]
Technical Support:
[email protected]
Investor Relations Contacts:
[email protected]
Marcom Contact:
[email protected]
Editorial Contact:
[email protected]
HR Contact:
[email protected]
Legal Contact:
[email protected]
Shen Zhen RUICHIPS Semiconductor CO., LTD
Room 501, the 5floor An Tong Industrial Building,
NO.207 Mei Hua Road Fu Tian Area Shen Zhen City, CHINA
TEL: (86-755) 8311-5334
FAX: (86-755) 8311-4278
E-mail: [email protected]
Copyright Ruichips Semiconductor Co., Ltd
Rev. B– DEC., 2012
9
www.ruichips.com