LSH–030–01–G–D–A F-213 LSH–050–01–G–D–A LSH–010–01–G–D–A LTH–010–01–G–D–A (0,50 mm) .0197" LTH–030–01–G–D–A LTH–050–01–G–D–A LTH, LSH SERIES LOW PROFILE BLADE AND BEAM SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?LTH or www.samtec.com?LSH Insulator Material: Liquid Crystal Polymer Terminal Material: Phosphor Bronze Contact Material: BeCu Plating: Au over 50µ" (1,27 µm) Ni Current Rating: 1.5A per contact @ 80°C ambient Operating Temp Range: -55°C to +125°C RoHS Compliant: Yes NO. OF POSITIONS PER ROW LTH 01 PLATING OPTION D OTHER OPTION A Mates with: LSH –K –G –010, –020, –030, –040, –050 = (5,50 mm) .217" DIA Polyimide Film Pick & Place Pad = 10µ" (0,25 µm) Gold (No. of positions per row +2) x (0,50) .01969 + (2,79) .110 (1,91) .075 –TR (0,76) .030 01 = Tape and Reel (1,27) .050 (4,80) .189 02 Processing: Lead-Free Solderable: No SMT Lead Coplanarity: (0,10 mm) .004" max Board Stacking: For applications requiring more than two connectors per board, contact [email protected] (0,50) .01969 (0,20) .008 (0,76) .030 (1,68) .066 (1,55) .061 (0,76) .030 DIA (No. of positions per row +2) x (0,50) .01969 + (1,27) .050 (5,05) .199 MATED HEIGHT LEAD STYLE MATED HEIGHT* –01 (2,31) .091 *Processing conditions will affect mated height. NO. OF POSITIONS PER ROW LSH 01 PLATING OPTION D A OTHER OPTION Mates with: LTH –G –010, –020, –030, –040, –050 = 10µ" (0,25 µm) Gold (No. of positions per row + 2) x (0,50) .01969 + (4,06) .160 (0,74) .029 02 –TR = Tape and Reel (1,22) .048 (6,50) .256 01 Note: Samtec recommends right-side-up, single-pass 63/37 Tin/Lead reflow soldering for these connectors. This product is not compatible with lead-free reflow soldering. Note: Some lengths, styles and options are non-standard, non-returnable. (0,50) .01969 (0,15) .006 (1,91) .075 (0,76) .030 (No. of positions per row + 2) x (0,50) .01969 + (1,91) .075 –K = (7,50 mm) .295" DIA Polyimide Film Pick & Place Pad (0,76) .030 DIA WWW.SAMTEC.COM (6,73) .265