F-210-1 MEC1–120–02–F–D–A MEC1–130–02–F–D–A (1,00mm) .03937" MEC1–140–02–L–D MEC1 SERIES MINI EDGE CARD SOCKET SPECIFICATIONS Mates with: (1,60mm) .062" card For complete specifications and recommended PCB layouts see www.samtec.com?MEC1 Insulator Material: Black LCP Contact Material: BeCu Plating: Sn or Au over 50µ" (1,27µm) Ni Operating Temp Range: -55°C to +125°C Current Rating: 2A @ 80°C ambient (See website for details) Voltage Rating: 300 VAC Insertion Depth: (5,84mm) .230" to (8,13mm) .320" RoHS Compliant: Yes Processing: Lead–Free Solderable: Yes SMT Lead Coplanarity: (0,10mm) .004" max (05-20) (0,15mm) .006" max (30-70) Mates with (1,60mm) .062" card APPLICATION APPLICATION SPECIFIC OPTION 1mm MEC1 Rated @ -3dB Insertion Loss 9,19mm Stack Height Single-Ended Signaling 5.5 GHz / 11 Gbps Differential Pair Signaling 6.5 GHz / 13 Gbps Performance data for other stack heights and complete test data available at www.samtec.com?MEC1 or contact [email protected] 1 MEC1 POSITIONS PER ROW • Locking Clip (Manual placement required). • Non-polarized Call Samtec. (1,00mm) .03937" pitch PLATING OPTION 02 D OTHER OPTION –A –F 05, 08, 20, 30, 40, 50, 60, 70 = Gold flash on contact, Matte tin on tail –L = 10µ" (0,25µm) Gold on contact, Matte Tin on tail (No. of Positions + 2) x (1,00) .03937 + (2,54) .100 02 140 01 139 (6,99) .275 (0,36) (1,00) .014 .03937 (No. of Positions + 2) x (1,00) .03937 (8,89) .350 Note: Other Gold plating options available. Contact Samtec. (1,83) .072 (9,04) .356 POSITIONS PER ROW POLARIZED POSITIONS (No Contact) 05 08 20 30 40 50 60 70 3, 4 5, 6 15, 16 21, 22 31, 32 41, 42 31, 32, 63 & 64 53, 54, 115 & 116 (0,15) .006 (1,40) .055 (8,51) .335 Note: Some sizes, styles and options are non-standard, non-returnable. (0,89) .035 DIA –A OPTION WWW.SAMTEC.COM = Alignment Pin metal or plastic at Samtec discretion. –K = (7,87mm) .310" DIA Polyimide film Pick & Place Pad –TR = Tape & Reel