F-213 QSH–060–01–L–D–DP–A ® QSH–060–01–L–D–A–K (0,50 mm) .0197" QSH–030–01–F–D–A QSH SERIES HIGH SPEED GROUND PLANE SOCKET SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?QSH Insulator Material: Liquid Crystal Polymer Contact Material: Phosphor Bronze Plating: Au or Sn over 50µ" (1,27 µm) Ni Current Rating: Contact: 1.0A per contact @ 30°C Temperature Rise Ground Plane: 7.8A per ground plane @ 30°C Temperature Rise Operating Temp Range: -55°C to +125°C Voltage Rating: 125 VAC (5 mm Stack Height) Max Cycles: 100 RoHS Compliant: Yes Blade & Beam Design Board Mates: QTH ® Cable Mates: HQCD, HQDP (See Application Specific note) fina TM 10 year Mixed Flowing Gas with 50µ" Gold Call Samtec for maximum cycles mated with QTH Type PINS PER ROW NO. OF PAIRS QSH 01 Note: Some lengths, styles and options are non-standard, non-returnable. PLATING OPTION A TYPE OTHER OPTION –F –030, –060, –090 APPLICATION SPECIFIC OPTION *Note: –C Plating passes 10 year MFG testing notes at Download app ppnote /a om c.c www.samte @ samtec.com G SI t ac nt Co on protocols for questions = Gold Flash on Signal Pins and Ground Plane, Matte Tin on tails (60 total pins per bank = –D) • 14 mm, 15 mm, 22 mm and 30 mm stack height (Caution: Some automatic placement/inspection machines may have component height restrictions. Please consult machinery specifications.) • 30µ" (0,76 µm) Gold (Specify -H plating for Data Rate cable mating applications.) • Edge Mount & Guide Posts • 80(-DP), 120, 150 positions per row • Retention Option Call Samtec. 100 GbE ™ sport Hyper tran XAUI ® s PCI Expres SATA ™ InfiniBand Rated @ 3dB Insertion Loss with PCB effects* w/o PCB effects** Single-Ended Signaling –D 9 GHz / 18 Gbps 9.5 GHz / 19 Gbps Differential Pair Signaling –D 8 GHz / 16 Gbps 10.5 GHz / 21 Gbps Differential Pair Signaling –DP 9.5 GHz / 19 Gbps 16.5 GHz / 33 Gbps *Performance data includes effects of a non-optimized PCB. **Test board losses de-embedded from performance data. Performance data for other stack heights and complete test data available at www.samtec.com?QSH or contact [email protected] QTH/QSH 5 mm Stack Height l i nch.com s ocol Prot orted Supp EXTENDED LIFE PRODUCT Processing: Lead-Free Solderable: Yes SMT Lead Coplanarity: (0,10 mm) .004" max (030-060) (0,15 mm) .006" max (090) Board Stacking: For applications requiring more than two connectors per board contact [email protected] Integral metal plane for power or ground –020, –040, –060 (20 pairs per bank = –D–DP) –L –D = (No. of Pins per Row/30) x (20,00) .7875 + (1,27) .050 = 10µ" (0,25 µm) Gold on Signal Pins and Ground Plane, Matte Tin on tails –DP = (No. of Pairs per Row/20) x (20,00) .7875 + (1,27) .050 (20,00) .7875 (7,49) .295 (0,50) .0197 (0,15) .006 (3,25) .128 (3,05) .120 (7,24) .285 (0,76) .030 (0,89) .035 DIA –K = (8,25 mm) .325" DIA Polyimide Film Pick & Place Pad –D–DP = Differential Pair (–01 only) –C* 02 01 –D = SingleEnded = Electro-Polished Selective 50µ" (1,27 µm) min Au over 150µ" (3,81 µm) Ni on Signal Pins in contact area, 10µ" (0,25 µm) min Au over 50µ" (1,27 µm) Ni on Ground Plane in contact area, Matte Tin over 50µ" (1,27 µm) min Ni on all solder tails –TR = Tape & Reel (–090 positions maximum) –L QTH MATED LEAD HEIGHT STYLE WITH QSH* –01 –02 –03 –04 –05 –07 (5,00) .197 (8,00) .315 (11,00) .433 = Latching Option (N/A on –060 (–D–DP), –080, –090 & –120 positions) (16,00) .630 (19,00) .748 (25,00) .984 *Processing conditions will affect mated height. ALSO AVAILABLE (0,64) .025 –L WWW.SAMTEC.COM Board Spacing Standoffs. See SO Series.