Z-Power LED X10490 Technical Data Sheet Specification HB601R CUSTOMER Checked by Approved by SUPPLIER Drawn by Approved by Rev.01 December 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet CONTENTS 1. Description 2. Absolute maximum ratings 3. Electro-optical characteristics 4. Characteristic diagram 5. Rank 6. Material 7. Outline Dimension 8. Packing 9. Soldering 10. Precaution for use Rev.01 December 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet HB601R 1. Description - Small size suitable for compact appliances - Surface-mounted and leadless chip HB601R Features • 2.1 X 1.0 X 0.6 mm • Side Type • Wavelength : 470 nm LED device - High brightness, wide variety of colors are available - Tape and Reel packing - Increases the life time of battery Applications • Cellular phone’s keypad lightning • Other decoration lighting Rev.01 December 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 2. Absolute maximum ratings (Ta=25℃) Parameter Symbol Value Unit Power Dissipation Pd 64 mW Forward Current IF 20 mA Peak Forward Current IFM *1 50 mA Reverse Voltage VR 5 V Operation Temperature Topr. -35 ~ 85 ℃ Storage Temperature Tstg. -40 ~ 100 ℃ *1 IFM conditions: Pulse width Tw≤0.1ms and Duty ratio≤1/10 3. Electro-Optical Characteristics (Ta=25℃) Parameter Symbol Condition Min Typ Max Unit Forward Voltage VF IF=5 ㎃ 2.7 3.05 3.2 V Reverse Current IR VR=5V - - 10 ㎂ Luminous Intensity*2 IV IF=5 ㎃ 14 17 40 mcd Wavelength λd IF=5 ㎃ 466 470 475 nm Spectral Bandwidth Δλ IF=5 ㎃ - 25 - nm Viewing Angle*3 2θ1/2 IF=5 ㎃ - 120 - ˚ *2 The luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. *3 θ1/2 is the off-axis where the luminous intensity is 1/2 the peak intensity. [Note] All products confirm to the listed minimum and maximum specifications for electric and optical characteristics, when operated at 20mA within the maximum ratings shown above. All measurements were made under the standardized environment of SSC. (Tolerance : Iv ±10 %, λD ±2 nm, VF ±0.1 V) Rev.01 December 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 (Rev.00) Relative Luminous Intensity vs Forward Current Forward Current vs. Forward Voltage 400 350 Rel ativ e Intensity I V [%] For war d Cur r ent I F(mA) Z-Power LED X10490 Technical Data Sheet 4. Electro-Optical characteristic Diagram 300 10 250 200 150 100 50 1 2.9 3.0 3.1 3.2 3.3 3.4 0 3.5 5 10 15 20 25 30 Forward Current IF [mA] For w ar d V ol tage V F(V ) Ambient Temperature vs. Allowable Forward Current Radiation Diagram 25 90 Forward current IF(mA) 20 120 60 15 150 30 10 180 5 0 0 0 20 40 60 80 100 o Ambient temperature Ta( &) Rev.01 December 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 (Rev.00) Intensity[a.u.] Z-Power LED X10490 Technical Data Sheet Spectrum 1.0 0.8 0.6 0.4 0.2 0.0 400 500 600 700 800 Wavelength [nm] Rev.01 December 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 5. Rank VF[V] IV[mcd] λD[nm] at IF=5[mA] at IF=5[mA] at IF=5[mA] 2.7-2.9 14-23 466-469 1 2.9-3.2 14-23 466-469 2 2.7-2.9 14-23 469-472 3 2.9-3.2 14-23 469-472 4 2.7-2.9 14-23 472-475 5 2.9-3.2 14-23 472-475 6 2.7-2.9 23-40 466-469 7 2.9-3.2 23-40 466-469 8 2.7-2.9 23-40 469-472 9 2.9-3.2 23-40 469-472 10 2.7-2.9 23-40 472-475 11 2.9-3.2 23-40 472-475 12 BIN 6.Metarial Item PCB Chip wire Encapsulate Electrode Material BT-Resin InGaN Gold Epoxy Au Rev.01 December 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 (Rev.00) ( Tolerance: ±0.1, Unit: mm ) 1.0 0.5 Polarity Mark 0.3 0.6 0.3 1.7 2.1 (1) (4) Cathode (1) Z-Power LED X10490 Technical Data Sheet 7.Outline Dimension Anode Rev.01 December 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 (Rev.00) 0.2 (2.75) 8.0 2.0 1.5 3.5 1.75 4.0 2.4 0.5 1.15 0.8 11.4 180 9 2 60 Z-Power LED X10490 Technical Data Sheet 8. Packing 22 13 Tolerance: ±0.2, Unit: ㎜ (1) Quantity: 3,000pcs./Reel (2) Cumulative Tolerance: Cumulative Tolerance/10pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape: Adhesion strength to be 0.1-0.7N when the over tape is turned off from the carrier tape at10˚angle to be the carrier tape. (4) Package: P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package. Rev.01 December 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 (Rev.00) Reel : K N A R ## 0 0 0 3 : Y T I T N A U Q LOT NUMBER: ########## R 1 0 6 B H : R E B M U N T R A P C S S Z-Power LED X10490 Technical Data Sheet ● Reel Packing Structure HB601R Aluminum Vinyl Bag : K N A R 0 0 0 3 : Y T I T N A U Q ## LOT NUMBER: ########## R 1 0 6 B H : R E B M U N T R A P C S S HB601R Outer Box *Material: Paper(SW3B(B)) SIZE(mm) TYPE a 7inch 245 b 220 c 142 c CHIP LED TUV MADE IN KOREA PART : HB601R CODE : Acriche Q'YT : 30,000EA Semiconductor EcoLight LOT NO : RoHS b a DATE : SEOUL SEMICONDUCTOR CO.,LTD Rev.01 December 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 9 . Soldering (1) Lead Solder Lead Solder Lead Solder 2.5~5 o C / sec. Pre-heat 120~150℃ Pre-heat time 120 sec. Max. Peak-Temperature 240℃ Max. Soldering time Condition 10 sec. Max. 2.5~5 C / sec. Pre-heating 120~150 oC 240 oC Max. 10 sec. Max. 60sec. Max. Above 200 oC 120sec. Max. (2) Lead-Free Solder Lead-frame Solder Lead Free Solder Pre-heat 150~200℃ Pre-heat time 120 sec. Max. Peak-Temperature 260℃ Max. Soldering time Condition 10 sec. Max. 1~5 o C / sec. 1~5 o C / sec. Pre-heating 150~200 o C 260 oC Max. 10 sec. Max. 60sec. Max. Above 220 oC 120sec. Max. (3) Hand Soldering conditions Do not exceed 3 seconds at maximum 280ºC under soldering iron. Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products. Rev.01 December 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 10. Precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : Max 30ºC Humidity : Max 65%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; a. After opened and mounted the soldering shall be quickly. b. Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 30% (3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC. (4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (5) Quick cooling shall be avoided. (6) Components shall not be mounted on warped direction of PCB. (7) Anti radioactive ray design is not considered for the products. (8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (10) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. (11) The LEDs must be soldered within seven days after opening the moisture-proof packing. (12) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (13) The appearance and specifications of the product may be modified for improvement without notice. Rev.01 December 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 (Rev.00)