NSC 74F574

54F/74F574
Octal D-Type Flip-Flop with TRI-STATEÉ Outputs
General Description
Features
The ’F574 is a high-speed, low power octal flip-flop with a
buffered common Clock (CP) and a buffered common Output Enable (OE). The information presented to the D inputs
is stored in the flip-flops on the LOW-to-HIGH Clock (CP)
transition.
This device is functionally identical to the ’F374 except for
the pinouts.
Y
Commercial
Y
Y
Y
Inputs and outputs on opposite sides of package
allowing easy interface with microprocessors
Useful as input or output port for microprocessors
Functionally identical to ’F374
TRI-STATE outputs for bus-oriented applications
Package
Number
Military
Package Description
N20A
20-Lead (0.300× Wide) Molded Dual-In-Line
J20A
20-Lead Ceramic Dual-In-Line
74F574SC (Note 1)
M20B
20-Lead (0.300× Wide) Molded Small Outline, JEDEC
74F574SJ (Note 1)
M20D
20-Lead (0.300× Wide) Molded Small Outline, EIAJ
54F574FM (Note 2)
W20A
20-Lead Cerpack
54F574LM (Note 2)
E20A
20-Lead Ceramic Leadless Chip Carrier, Type C
74F574PC
54F574DM (Note 2)
Note 1: Devices also available in 13× reel. Use suffix e SCX and SJX.
Note 2: Military grade device with environmental and burn-in processing. Use suffix e DMQB, FMQB and LMQB.
Logic Symbols
IEEE/IEC
TL/F/9567 – 1
TL/F/9567 – 4
Unit Loading/Fan Out
54F/74F
Pin Names
D0 – D7
CP
OE
O0 – O7
Description
U.L.
HIGH/LOW
Input IIH/IIL
Output IOH/IOL
Data Inputs
Clock Pulse Input (Active LOW)
TRI-STATE Output Enable Input (Active LOW)
TRI-STATE Outputs
1.0/1.0
1.0/1.0
1.0/1.0
150/40 (33.3)
20 mA/b0.6 mA
20 mA/b0.6 mA
20 mA/b0.6 mA
b 3 mA/24 mA (20 mA)
TRI-STATEÉ is a registered trademark of National Semiconductor Corporation.
C1995 National Semiconductor Corporation
TL/F/9567
RRD-B30M75/Printed in U. S. A.
54F/74F574 Octal D-Type Flip-Flop with TRI-STATE Outputs
May 1995
Connection Diagrams
Pin Assignment
for DIP, SOIC and Flatpak
Pin Assignment
for LCC
TL/F/9567 – 3
TL/F/9567–2
Functional Description
Function Table
The ’F574 consists of eight edge-triggered flip-flops with individual D-type inputs and TRI-STATE true outputs. The
buffered clock and buffered Output Enable are common to
all flip-flops. The eight flip-flops will store the state of their
individual D inputs that meet the setup and hold times requirements on the LOW-to-HIGH Clock (CP) transition. With
the Output Enable (OE) LOW, the contents of the eight flipflops are available at the outputs. When OE is HIGH, the
outputs go to the high impedance state. Operation of the
OE input does not affect the state of the flip-flops.
Inputs
Internal
Outputs
OE
CP
D
Q
O
H
H
H
H
L
L
L
L
H
H
L
L
L
L
H
H
L
H
L
H
L
H
L
H
NC
NC
L
H
L
H
NC
NC
Z
Z
Z
Z
L
H
NC
NC
Function
Hold
Hold
Load
Load
Data Available
Data Available
No Change in Data
No Change in Data
H e HIGH Voltage Level
L e LOW Voltage Level
X e Immaterial
Z e High Impedance
L e LOW-to-HIGH Transition
NC e No Change
Logic Diagram
TL/F/9567 – 5
Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.
2
Absolute Maximum Ratings (Note 1)
Recommended Operating
Conditions
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
Storage Temperature
b 65§ C to a 150§ C
Ambient Temperature under Bias
Junction Temperature under Bias
Plastic
b 55§ C to a 125§ C
Free Air Ambient Temperature
Military
Commercial
b 55§ C to a 125§ C
0§ C to a 70§ C
Supply Voltage
Military
Commercial
b 55§ C to a 175§ C
b 55§ C to a 150§ C
a 4.5V to a 5.5V
a 4.5V to a 5.5V
VCC Pin Potential to
Ground Pin
b 0.5V to a 7.0V
b 0.5V to a 7.0V
Input Voltage (Note 2)
b 30 mA to a 5.0 mA
Input Current (Note 2)
Voltage Applied to Output
in HIGH State (with VCC e 0V)
b 0.5V to VCC
Standard Output
b 0.5V to a 5.5V
TRI-STATE Output
Current Applied to Output
in LOW State (Max)
twice the rated IOL (mA)
Note 1: Absolute maximum ratings are values beyond which the device may
be damaged or have its useful life impaired. Functional operation under
these conditions is not implied.
Note 2: Either voltage limit or current limit is sufficient to protect inputs.
DC Electrical Characteristics
Symbol
54F/74F
Parameter
Min
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
VCD
Input Clamp Diode Voltage
VOH
Output HIGH
Voltage
Typ
Units
2.0
54F 10% VCC
54F 10% VCC
74F 10% VCC
74F 10% VCC
74F 5% VCC
74F 5% VCC
VCC
Conditions
Max
V
Recognized as a HIGH Signal
0.8
V
Recognized as a LOW Signal
b 1.2
V
2.5
2.4
2.5
2.4
2.7
2.7
Min
IIN e b18 mA
V
Min
IOH
IOH
IOH
IOH
IOH
IOH
IOL e 20 mA
IOL e 24 mA
e
e
e
e
e
e
b 1 mA
b 3 mA
b 1 mA
b 3 mA
b 1 mA
b 3 mA
VOL
Output LOW
Voltage
54F 10% VCC
74F 10% VCC
0.5
0.5
V
Min
IIH
Input HIGH
Current
54F
74F
20.0
5.0
mA
Max
VIN e 2.7V
IBVI
Input HIGH Current
Breakdown Test
54F
74F
100
7.0
mA
Max
VIN e 7.0V
ICEX
Output HIGH
Leakage Current
54F
74F
250
50
mA
Max
VOUT e VCC
VID
Input Leakage
Test
74F
V
0.0
IID e 1.9 mA
All Other Pins Grounded
IOD
Output Leakage
Circuit Current
74F
3.75
mA
0.0
VIOD e 150 mV
All Other Pins Grounded
IIL
Input LOW Current
b 0.6
mA
Max
VIN e 0.5V
IOZH
Output Leakage Current
50
mA
Max
VOUT e 2.7V
IOZL
Output Leakage Current
IOS
Output Short-Circuit Current
IZZ
Bus Drainage Test
ICCZ
Power Supply Current
4.75
b 60
55
3
b 50
mA
Max
VOUT e 0.5V
b 150
mA
Max
VOUT e 0V
500
mA
0.0V
VOUT e 5.25V
86
mA
Max
VO e HIGH Z
AC Electrical Characteristics
Symbol
Parameter
Min
74F
54F
74F
TA e a 25§ C
VCC e a 5.0V
CL e 50 pF
TA, VCC e Mil
CL e 50 pF
TA, VCC e Com
CL e 50 pF
Typ
Max
Min
Max
60
Min
Units
Max
fmax
Maximum Clock Frequency
100
70
tPLH
tPHL
Propagation Delay
CP to On
2.5
2.5
5.3
5.3
8.5
8.5
2.5
2.5
9.5
9.5
2.5
2.5
8.5
8.5
MHz
tPZH
tPZL
Output Enable Time
3.0
3.0
5.5
6.0
9.0
9.0
2.5
2.5
10.5
10.5
2.5
2.5
10.0
10.0
tPHZ
tPLZ
Output Disable Time
1.5
1.5
3.3
2.8
5.5
5.5
1.5
1.5
7.0
7.0
1.5
1.5
6.5
6.5
ns
ns
AC Operating Requirements
Symbol
Parameter
74F
54F
74F
TA e a 25§ C
VCC e a 5.0V
TA, VCC e Mil
TA, VCC e Com
Min
Min
Min
Max
Max
ts(H)
ts(L)
Set-up Time, HIGH or LOW
Dn to CP
2.5
2.0
3.0
2.5
2.5
2.0
th(H)
th(L)
Hold Time, HIGH or LOW
Dn to CP
2.0
2.0
2.0
2.0
2.0
2.0
tw(H)
tw(L)
CP Pulse Width
HIGH or LOW
5.0
5.0
5.0
5.0
5.0
5.0
4
Units
Max
ns
ns
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows:
74F
574
S
Temperature Range Family
74F e Commercial
54F e Military
C
X
Special Variations
QB e Military grade device with
environmental and burn-in
processing
Device Type
Temperature Range
C e Commercial (0§ C to a 70§ C)
M e Military (b55§ C to a 125§ C)
Package Code
P e Plastic DIP
D e Ceramic DIP
F e Flatpak
L e Leadless Chip Carrier (LCC)
S e Small Outline JEDEC
SJ e Small Outline SOIC EIAJ
Physical Dimensions inches (millimeters)
20-Lead Ceramic Leadless Chip Carrier (L)
NS Package Number E20A
5
Physical Dimensions inches (millimeters) (Continued)
20-Lead Ceramic Dual-In-Line Package (D)
NS Package Number J20A
20-Lead (0.300× Wide) Molded Small Outline Package, JEDEC (S)
NS Package Number M20B
6
Physical Dimensions inches (millimeters) (Continued)
20-Lead (0.300× Wide) Molded Small Outline Package, EIAJ
NS Package Number M20D
20-Lead (0.300× Wide) Molded Dual-In-Line Package (P)
NS Package Number N20A
7
54F/74F574 Octal D-Type Flip-Flop with TRI-STATE Outputs
Physical Dimensions inches (millimeters) (Continued)
20-Lead Ceramic Flatpak (F)
NS Package Number W20A
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