Z-Power LED X10490 Technical Data Sheet Specification SPWW8F0E SSC Drawn Customer Approval Approval Rev. 0.00 March 2011. www.Acrich.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) Z-Power LED X10490 Technical Data Sheet SPWW8F0E 1. Description 2. Absolute Maximum Ratings 3. Electro- Optical Characteristics 4. Characteristic Diagram 5. CIE Chromaticity Diagram 6. Binning Table 7. Outline Dimension 8. Reel Structure 9. Packing 10. Soldering 11. Precaution for use 12. Handling of silicon Resin LEDs Rev. 0.00 March 2011. www.Acrich.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) Z-Power LED X10490 Technical Data Sheet SPWW8F0E SPWW8F0E 1. Description Features It has a substrate made up of a • Industry Standard molded plastic reflector sitting on SMT package top of a bent lead frame (AG Plating). • Low thermal The die is attached within the reflector resistance cavity and the cavity is encapsulated • Lead free product by silicone • RoHS Compliant The high reliability feature is crucial to automotive front, Interior lamp and General Lights Applications • Lighting Rev. 0.00 March 2011. www.Acrich.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 2. Absolute Maximum Ratings Parameter Power Dissipation Forward Current (Ta = 25℃) Operating Temperature Storage Temperature Junction Temperature Thermal Resistance Symbol P [1] I T d F opr T stg T R Value 1 100 (min.) 300 (typ.) 400 (max.) -40 ~ +85 -40 ~ +100 125 j Unit W mA ℃ ℃ ℃ K/W 13 th-JS [1]. Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. 3. Electro-Optical characteristics (IF=300mA) Parameter Forward Voltage Luminance Flux [ 1] Correlated Color Temperature CRI Viewing Angle [ 2] Symbo l Min Typ Max Unit VF - 3.4 3.75 V ΦV 95 lm CCT 3000 K Ra [ 3] 2θ 80 ½ 120 deg. [1]. The luminous Flux was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Flux Measurement allowance is ±10% [2]. Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram. Color coordinate : 0.005, CCT ± 5% tolerance [3]. 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity. Rev. 0.00 March 2011. www.Acrich.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 4. Characteristic Diagram Wavelength vs. Relative Spectral Power Distribution (IF=300mA) 0.2 eg alt oV rda w ro F ev tia le R 0.0 -0.2 -0.4 -0.6 -0.8 -1.0 25 50 75 100 125 150 Junction Temperature [T ] j Rev. 0.00 March 2011. www.Acrich.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 4. Characteristic Diagram Forward Current vs. Forward Voltage (Ta=25 OC ) 400 ]A m [ I 300 F tn er ru C rda rw oF 200 100 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 Forward Voltage V (V) F Relative Luminous Intensity vs Forward Current (Ta=25 OC ) 1.4 xu 1.2 lF su 1.0 on i 0.8 m uL ev 0.6 it al 0.4 e R 0.2 0.0 0 100 200 300 400 Forward Current I [mA] F Rev. 0.00 March 2011. www.Acrich.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 4. Characteristic Diagram Relative Forward Voltage vs. Junction Temperature (IF=300mA) 0.2 eg 0.0 alt oV rda -0.2 w ro F -0.4 ev tia le -0.6 R -0.8 -1.0 25 50 75 100 Junction Temperature [T ] 125 150 j Relative Luminous Intensity vs. Junction Temperature (IF=300mA) 1.0 yti sn et nI su on i m uL ev it al e R 0.8 0.6 0.4 0.2 0.0 20 40 60 80 100 120 140 Junction Temperature [T ] j Rev. 0.00 March 2011. www.Acrich.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 4. Characteristic Diagram Relative Dominant Wavelength vs. Junction Temperature (IF=300mA) 12 thg ne le va w tn an i m o D ev it lae R 10 8 6 4 2 0 25 50 75 100 125 150 Junction Temperature [T ] j Rev. 0.00 March 2011. www.Acrich.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 4. Characteristic Diagram Ambient Temperature vs. Forward Current 500 ]A400 m [ I ℃ ℃ ℃ F 1.Rja t = 35 / W 2.Rja 2. Rja t = 45 / W 3.Rja 3. Rja t = 55 / W tn300 er ru C dr 200 a w ro F 100 0 0 20 40 60 80 100 120 140 Temperature [T ] Radiation Diagram 0 -30 -60 -90 30 60 90 Rev. 0.00 March 2011. www.Acrich.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) 0.46 ℃ IF = 300mA] [Ta = 25 0.44 2700K 2600K 2900K 3000K 3200K 3500K 0.42 G8 H2 G2 H5 H4 F3 G5 G4 F2 H3 G3 F0 F5 0.38 H1 H0 G1 G0 F1 0.40 H9 H8 G9 F9 3700K F8 CIE Y Z-Power LED X10490 Technical Data Sheet 5. CIE Chromaticity Diagram H6 G7 H7 G6 F4 F7 F6 0.36 ENERGE STAR RANK 0.34 0.38 0.40 0.42 0.44 0.46 0.48 0.50 CIE X F0 CIE X 0.3996 0.396 0.4104 0.4146 F1 CIE Y 0.4015 0.3907 0.3978 0.4089 CIE X 0.4146 0.4104 0.4248 0.4299 CIE Y 0.3865 0.3751 0.3814 0.3931 CIE X 0.3889 0.386 0.3983 0.4017 CIE Y 0.4165 0.4048 0.4093 0.4212 CIE X 0.443 0.4374 0.4499 0.4562 CIE Y 0.3973 0.3853 0.3893 0.4015 CIE X 0.4147 0.4102 0.4207 0.4259 CIE Y 0.426 0.4138 0.4166 0.4289 CIE X 0.4687 0.462 0.474 0.481 CIE Y 0.4042 0.3919 0.3944 0.4069 CIE X 0.4373 0.4312 0.4422 0.4483 F5 CIE X 0.4062 0.4017 0.4147 0.4198 CIE Y 0.4212 0.4093 0.4138 0.426 CIE X 0.4248 0.4198 0.4317 0.4374 CIE Y 0.3814 0.371 0.3744 0.3853 CIE X 0.4259 0.4207 0.4312 0.4373 CIE Y 0.4289 0.4166 0.4194 0.4319 CIE X 0.4499 0.4436 0.4551 0.462 CIE Y 0.3893 0.3778 0.3805 0.3919 CIE X 0.4483 0.4422 0.4527 0.4593 F3 CIE Y 0.3907 0.3798 0.3865 0.3978 CIE X 0.4104 0.4062 0.4198 0.4248 CIE Y 0.3751 0.366 0.3715 0.3814 CIE X 0.4037 0.3996 0.4146 0.4197 CIE Y 0.4048 0.3931 0.3973 0.4093 CIE X 0.4374 0.4317 0.4436 0.4499 CIE Y 0.3853 0.3744 0.3778 0.3893 CIE X 0.4354 0.4299 0.443 0.4487 CIE Y 0.4138 0.4015 0.4042 0.4166 CIE X 0.462 0.4551 0.4666 0.474 CIE Y 0.3919 0.3805 0.383 0.3944 CIE X 0.4619 0.4562 0.4687 0.4747 F7 CIE X 0.3925 0.3889 0.4017 0.4062 CIE Y 0.414 0.4015 0.4089 0.4217 CIE X 0.4197 0.4146 0.4299 0.4354 CIE Y 0.4093 0.3973 0.4015 0.4138 CIE X 0.4198 0.4147 0.4259 0.4317 CIE Y 0.4288 0.4165 0.4212 0.4333 CIE X 0.4487 0.443 0.4562 0.4619 CIE Y 0.4166 0.4042 0.4069 0.4194 CIE X 0.4436 0.4373 0.4483 0.4551 CIE Y 0.4378 0.426 0.4289 0.441 CIE X 0.4747 0.4687 0.481 0.4875 CIE Y 0.3931 0.3814 0.3853 0.3973 G9 H3 H7 CIE Y 0.4217 0.4089 0.4165 0.4288 G4 G8 H2 CIE Y 0.3798 0.369 0.3751 0.3865 F9 G3 G7 H6 F4 CIE Y 0.3978 0.3865 0.3931 0.4048 F8 G2 H1 H5 CIE X 0.4551 0.4483 0.4593 0.4666 CIE X 0.4017 0.3983 0.4104 0.4147 G6 H0 CIE X 0.4562 0.4499 0.462 0.4687 CIE Y 0.369 0.36 0.366 0.3751 G1 G5 CIE X 0.4317 0.4259 0.4373 0.4436 CIE X 0.396 0.3925 0.4062 0.4104 F6 G0 CIE X 0.4299 0.4248 0.4374 0.443 F2 CIE Y 0.4089 0.3978 0.4048 0.4165 CIE Y 0.4333 0.4212 0.426 0.4378 H4 H8 CIE Y 0.4015 0.3893 0.3919 0.4042 H9 CIE Y 0.441 0.4289 0.43190.00 Rev. 0.4435 March 2011. www.Acrich.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 6. Binning Table Bin Code Luminous Flux (lm) @ IF = 300mA Luminous Flux (lm) @ IF = 300mA Bin Code Min. Max. T2 80 91 Color Chromaticity Coordinate @ IF = 300mA Color Chromaticity Coordinate @ IF = 300mA Bin Code Min. Ref. 10 pages U1 91 Forward Voltage (V) @ IF = 300mA Max. Forward Voltage (V) @ IF = 300mA Bin Code Min. Max. H 3.0 3.25 I 3.25 3.50 J 3.50 3.75 100 U2 100 109 U3 109 118 Available ranks Rev. 0.00 March 2011. www.Acrich.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 7. outline dimension < Package Outline > ( Tolerance: ±0.2, Unit: mm ) < Solder Pattern > Rev. 0.00 March 2011. www.Acrich.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) .1 1.75± 0.1 4± 0.1 ,- 0.25± 0.05 2± 0.05 0 i 5m n (4.75) Φ1. 5.30± 0.1 8.0± 0.1 4.80± 0.1 +0 5.5± 0.05 .5 12.0± 0.2 Φ1 1.30± 0.1 Package Marking 15.4± 1.0 180 13± 0.3 2 60 Z-Power LED X10490 Technical Data Sheet 8. Reel Structure 22 13 ( Tolerance: ±0.2, Unit: mm ) (1) Quantity : 1,500pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ± 0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package Rev. 0.00 March 2011. www.Acrich.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 9. Packing Rev. 0.00 March 2011. www.Acrich.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 10. Soldering (1) Lead Solder Lead Solder Lead Solder 2.5~5 o C / sec. ℃ Pre-heat 120~150 Pre-heat time 120 sec. Max. ℃ Max. Peak-Temperature 240 Soldering time Condition 10 sec. Max. 2.5~5 C / sec. Pre-heating 120~150 oC 240 oC Max. 10 sec. Max. 60sec. Max. Above 200 oC 120sec. Max. (2) Lead-Free Solder Lead-free Solder Lead Free Solder 1~5 oC / sec. ℃ Pre-heat 150~200 Pre-heat time 120 sec. Max. ℃ Max. Peak-Temperature 260 Soldering time Condition 10 sec. Max. 1~5 oC / sec. Pre-heating 150~200 o C 260 oC Max. 10 sec. Max. 60sec. Max. Above 220 oC 120sec. Max. (3) Hand Soldering conditions Do not exceed 4 seconds at maximum 315ºC under soldering iron. (4) The encapsulated material of the LEDs is silicone. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used. Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products. Rev. 0.00 March 2011. www.Acrich.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 11. precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5ºC ~30ºC Humidity : maximum 70%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 10% (3) In the case of more than 4 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60± 5ºC. (4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (5) Quick cooling shall be avoided. (6) Components shall not be mounted on warped direction of PCB. (7) Anti radioactive ray design is not considered for the products. (8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (10) The LEDs must be soldered within seven days after opening the moisture-proof packing. (11) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (12) The appearance and specifications of the product may be modified for improvement without notice. Rev. 0.00 March 2011. www.Acrich.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 12. Handling of Silicone Resin LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. (4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. Rev. 0.00 March 2011. www.Acrich.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00)