Z-Power LED X10490 Technical Data Sheet SPECIFICATION [STW0Q14A] CUSTOMER Checked by Approved by SUPPLIER Drawn by Approved by Rev. 02 April, 2011 Document No. : SSC- QP- 7- 07- 24 Z-Power LED X10490 Technical Data Sheet CONTENTS 1. Description 2. Absolute Maximum Ratings 3. Electro-Optical Characteristics 4. Optical characteristics 5. Reliability Test Items and Conditions 6. Color & Binning 7. Bin Code Description 8. Outline Dimension 9. Material Structure 10. Reel Structure 11. Packing 12. Soldering 13. Precaution for use 14. Handling of Silicone Resin LEDs Rev. 02 April, 2011 Document No. : SSC- QP- 7- 07- 24 Z-Power LED X10490 Technical Data Sheet STW0Q14A 1. Description This surface-mount LED comes in standard package dimension. It has a substrate made up of a molded plastic reflector sitting on top of a bent lead frame. The die is attached within the reflector cavity and the cavity is encapsulated by silicone. The package design coupled with careful selection of component materials allow these products to perform with high reliability. Features • Pb-Free Reflow soldering application • RoHS compliant • White colored SMT package • Suitable for all SMT assembly and soldering methods • High Reliability (silicone resin) Applications • Electric Signs and Signals • Office Automation, Electrical Appliances, Industrial Equipment Rev. 02 April, 2011 Document No. : SSC- QP- 7- 07- 24 Z-Power LED X10490 Technical Data Sheet 2. Absolute maximum ratings*1 Parameter Symbol Value Unit Power Dissipation Pd 272 mW Forward Current IF 80 mA IFM [2] 150 mA Operating Temperature Topr -40 ~ +85 Storage Temperature Tstg -40 ~ +100 Junction Temperature Tj 125 Peak Forward Current ℃ ℃ ℃ [1] Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. [2] IFM was measured at Tw 1 msec of pulse width and D 1/10 of duty ratio. [3] LED’s properties might be different from suggested values like above and below tables if operation condition will be exceeded our parameter range. ≤ ≤ 3. Electric characteristics Parameter Forward Voltage * [1] Reverse Voltage Luminous Intensity* [2] Luminous flux Color Correlated Temperature Viewing Angle [3] Color Rendering Index* Symbol Condition Min. Typ. Max. Unit VF IF=60mA 2.9 3.2 3.4 V VR IR=5mA - 0.85 1.2 V Iv IF=60mA - 5.2 - cd Φ IF =60mA - 15 - lm CCT IF =60mA 4700 - 8200 K 2Θ1/2 IF=60mA - 120 - deg. Ra IF=60mA - 68 - - 1.5kΩ;100pF 5 - - KV ESD (HBM) Thermal resistance [4] RthJS IF=60mA 22 ºC/W [1] Forward current is 60mA per die. [2] The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. [3] 2Θ1/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity. [4] Thermal resistance: RthJS (Junction / solder), Metal PCB 25*25mm 1.6t * Tolerance : VF :± 0.1V, IV :± 10%, x,y :± 0.01 [Note] All measurements were made under the standardized environment of SSC. Rev. 02 April, 2011 Document No. : SSC- QP- 7- 07- 24 Z-Power LED X10490 Technical Data Sheet 4. Optical characteristics Forward Voltage vs. Forward Current Ta=25 Forward Current vs. Relative Luminous Intensity ℃ Ta=25 ℃ 1.6 Relative Luminous Intensity 100 10 1.2 1.0 0.8 0.6 0.4 0.2 1 0.0 3.0 3.2 3.4 3.6 3.8 0 4.0 10 20 30 40 50 60 70 80 90 100 Forward Current IF [mA] Forward Voltage VF [V] Forward Current vs. Chromaticity Coordinate Directivity Ta=25 ℃ Ta=25 0.304 ℃ 90 20mA 120 0.302 60 60mA 100mA y Forward Current IF [mA] 1.4 0.300 150mA 150 200mA 30 0.298 0.296 180 0.294 0.285 0.286 0.287 0.288 0.289 0.290 0 0.291 x Rev. 02 April, 2011 Document No. : SSC- QP- 7- 07- 24 IF=60mA IF=60mA 1.0 Relative Light Output Relative Forward Voltage 1.0 0.8 0.6 0.4 0.2 0.8 0.6 0.4 0.2 0.0 40 60 80 100 120 Junction Temperation Tj (? ) 0.0 40 60 80 100 120 Junction Temperation Tj (? ) ℃ Junction Temperature ( ) vs. Chromaticity Coordinate IF=60mA 0.310 0.305 25 0.300 44 y Z-Power LED X10490 Technical Data Sheet Relative Light Output vs. Junction Temperature Forward Voltage Shift vs. Junction Temperature 0.295 64 84 0.290 104 0.285 0.280 0.270 0.275 0.280 0.285 0.290 0.295 x Rev. 02 April, 2011 Document No. : SSC- QP- 7- 07- 24 Spectrum Ta=25 ℃, I =60mA F 1.0 Relative Emission Intensity 80 Forward Current IF [mA] Z-Power LED X10490 Technical Data Sheet Ambient Temperature vs. Maximum Forward Current Rth J-A = 200 ℃/W 60 40 20 0 -40 -20 0 20 40 60 O Ambient Temperature TA [ C] 80 100 0.8 0.6 0.4 0.2 0.0 300 400 500 600 700 800 Wavelength [nm] Rev. 02 April, 2011 Document No. : SSC- QP- 7- 07- 24 Z-Power LED X10490 Technical Data Sheet 5. Reliability Test Items and Conditions Item Reference Test Conditions Duration / Cycle Number of Damaged Thermal Shock EIAJ ED-4701 Ta =-40oC(30min) ~ 100oC(30min) 100 Cycle 0/22 High Temperature Storage EIAJ ED-4701 Ta =100oC 1000 Hours 0/22 High Temp. High Humidity Storage EIAJ ED-4701 Ta =60oC, RH=90% 1000 Hours 0/22 Low Temperature Storage EIAJ ED-4701 Ta =-40oC 1000 Hours 0/22 Operating Endurance Test Internal Reference Ta =25oC, IF =60mA 1000 Hours 0/22 High Temperature High Humidity Life Test Internal Reference Ta =60oC, RH=90%, IF =60mA 500 Hours 0/22 High Temperature Life Test Internal Reference Ta =85oC, IF =60mA 500 Hours 0/22 Low Temperature Life Test Internal Reference Ta =-40oC, IF =60mA 1000 Hours 0/22 ESD(HBM) MIL-STD883D 5KV at 1.5k ; 100pF 3 Time 0/22 Reflow Tsol 260 < 10sec. Reflow Soldering ℃ 3 Time 0/22 Ω □ CRITERIA FOR JUDGING THE DAMAGE Criteria for Judgment Item Symbol Condition Forward Voltage VF Luminous Intensity IV MIN MAX IF =60mA - USL [1] × 1.2 IF =60mA LSL [2] × 0.7 - Note : [1] USL : Upper Standard Level [2] LSL : Lower Standard Level Rev. 02 April, 2011 Document No. : SSC- QP- 7- 07- 24 Z-Power LED X10490 Technical Data Sheet 6. Color & Binning 0.39 0.38 Energy Star Rank 4700K 5000K 5300K C1 0.37 5600K B1 6000K 0.36 CIE Y 0.35 6500K 0.34 7000K A0 7600K Z1 A2 0.33 0.32 0.31 8200K 0.30 A4 Z3 A6 Z5 Z2 Z7 Z4 Z6 A1 A3 A5 A7 B0 B3 B2 B4 B5 C0 C2 C4 C3 C5 C7 C6 B7 B6 0.29 0.28 0.29 0.30 0.31 0.32 0.33 0.34 0.35 0.36 CIE X Rev. 02 April, 2011 Document No. : SSC- QP- 7- 07- 24 Z-Power LED X10490 Technical Data Sheet 6. Color & Binning ● COLOR RANK Z1 <IF=60mA, Ta=25 Z2 Z3 Z4 ℃> Z5 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.2959 0.3227 0.291 0.3093 0.2976 0.3166 0.293 0.3037 0.2993 0.3107 0.2976 0.3166 0.293 0.3037 0.2993 0.3107 0.295 0.298 0.3009 0.3047 0.3041 0.324 0.2993 0.3107 0.3055 0.3177 0.3009 0.3047 0.3068 0.3113 0.3028 0.3304 0.2976 0.3166 0.3041 0.324 0.2993 0.3107 0.3055 0.3177 Z6 Z7 CIE X CIE Y CIE X CIE Y 0.295 0.298 0.3009 0.3047 0.2969 0.2919 0.3025 0.2985 0.3025 0.2985 0.3082 0.3046 0.3009 0.3047 0.3068 0.3113 A0 A1 A2 A3 A4 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3028 0.3304 0.3115 0.3393 0.3041 0.3240 0.3126 0.3324 0.3055 0.3177 0.3041 0.3240 0.3126 0.3324 0.3055 0.3177 0.3136 0.3256 0.3068 0.3113 0.3126 0.3324 0.3210 0.3408 0.3136 0.3256 0.3216 0.3334 0.3146 0.3187 0.3115 0.3393 0.3205 0.3481 0.3126 0.3324 0.3210 0.3408 0.3136 0.3256 A5 A6 A7 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3136 0.3256 0.3068 0.3113 0.3146 0.3187 0.3146 0.3187 0.3082 0.3046 0.3155 0.3120 0.3221 0.3261 0.3155 0.3120 0.3225 0.3190 0.3216 0.3334 0.3146 0.3187 0.3221 0.3261 Rev. 02 April, 2011 Document No. : SSC- QP- 7- 07- 24 Z-Power LED X10490 Technical Data Sheet 6. Color & Binning ● COLOR RANK B0 <IF=60mA, Ta=25 B1 B2 B3 ℃> B4 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3207 0.3462 0.3292 0.3539 0.3212 0.3389 0.3293 0.3461 0.3217 0.3316 0.3212 0.3389 0.3293 0.3461 0.3217 0.3316 0.3293 0.3384 0.3222 0.3243 0.3293 0.3461 0.3373 0.3534 0.3293 0.3384 0.3369 0.3451 0.3294 0.3306 0.3292 0.3539 0.3376 0.3616 0.3293 0.3461 0.3373 0.3534 0.3293 0.3384 B5 B6 B7 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3293 0.3384 0.3222 0.3243 0.3294 0.3306 0.3294 0.3306 0.3226 0.3178 0.3295 0.3234 0.3366 0.3369 0.3295 0.3234 0.3364 0.3288 0.3369 0.3451 0.3294 0.3306 0.3366 0.3369 C0 C2 C4 C6 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3376 0.3616 0.3373 0.3534 0.3369 0.3451 0.3366 0.3369 0.3373 0.3534 0.3369 0.3451 0.3366 0.3369 0.3364 0.3288 0.3456 0.3601 0.3448 0.3514 0.344 0.3428 0.3433 0.3345 0.3463 0.3687 0.3456 0.3601 0.3448 0.3514 0.344 0.3428 C1 C3 C5 C7 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3463 0.3687 0.3456 0.3601 0.3448 0.3514 0.344 0.3428 0.3456 0.3601 0.3448 0.3514 0.344 0.3428 0.3433 0.3345 0.3539 0.3669 0.3526 0.3578 0.3514 0.3487 0.35 0.34 0.3552 0.376 0.3539 0.3669 0.3526 0.3578 0.3514 0.3487 Rev. 02 April, 2011 Document No. : SSC- QP- 7- 07- 24 Z-Power LED X10490 Technical Data Sheet 7. Bin Code Description Bin Code Luminous Intensity CIE Forward Voltage N0 A0 Z1 Luminous Intensity (cd) @ IF = 60mA Flux [lm] Color Rank @ IF = 60mA Z~C Bin Code Min. Max. Typ N0 5.0 5.5 N5 5.5 P0 P5 Forward Voltage (V) @ IF = 60mA Bin Code Min. Max. 16.5 Y3 2.9 3.0 6.0 17.7 Z1 3.0 3.1 6.0 6.5 19.2 Z2 3.1 3.2 6.5 7.0 21 Z3 3.2 3.3 A1 3.3 3.4 Available ranks Not yet available ranks CCT IV Rank 6000~8200K (CIE Z,A) N0 N5 P0 4700~6000 K (CIE B,C) N0 N5 P0 [Note] All measurements were made under the standardized environment of SSC. In order to ensure availability, single color rank will not be orderable. Rev. 02 April, 2011 Document No. : SSC- QP- 7- 07- 24 Z-Power LED X10490 Technical Data Sheet 8. Outline Dimension ( Tolerance: Package Marking ±0.1, Unit: mm ) A N.C N.C C Slug (Anode) 0.65 Circuit Diagram 2.80 0.65 1.10 1.80 Cathode Anode 1 2 1.10 0.95 4.10 0.40 [Recommended Solder Pattern] ESD Protection Device [Note] Package Forward Current is 100mA 9. Material Structure Parts No. ① ② ③ ④ ⑤ ⑥ Name Description Materials LEAD FRAME Metal Copper Alloy (Silver Plated) Chip Source Blue LED GaN on Sapphire Wire Metal Gold Wire Encapsulation Silicone +Phosphor Body Thermo Plastic Heat- resistant Polymer Zener Diode Si Rev. 02 April, 2011 Document No. : SSC- QP- 7- 07- 24 15.4± 1.0 180 13± 0.3 2 60 Z-Power LED X10490 Technical Data Sheet 10. Reel Structure 22 13 ( Tolerance: ±0.2, Unit: mm ) (1) Quantity : 3,500pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ± 0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package Rev. 02 April, 2011 Document No. : SSC- QP- 7- 07- 24 Z-Power LED X10490 Technical Data Sheet 11. Soldering (1) Lead Solder Lead Solder Lead Solder 2.5~5 o C / sec. ℃ Pre-heat 120~150 Pre-heat time 120 sec. Max. ℃ Max. Peak-Temperature 240 Soldering time Condition 10 sec. Max. 2.5~5 C / sec. Pre-heating 120~150 oC 240 oC Max. 10 sec. Max. 60sec. Max. Above 200 oC 120sec. Max. (2) Lead-Free Solder Lead-free Solder Lead Free Solder 1~5 oC / sec. ℃ Pre-heat 150~200 Pre-heat time 120 sec. Max. ℃ Max. Peak-Temperature 260 Soldering time Condition 10 sec. Max. 1~5 oC / sec. Pre-heating 150~200 o C 260 oC Max. 10 sec. Max. 60sec. Max. Above 220 oC 120sec. Max. (3) Hand Soldering conditions Do not exceed 4 seconds at maximum 315ºC under soldering iron. (4) The encapsulated material of the LEDs is silicone. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used. (5) It is recommended that the customer use the nitrogen reflow method. (6) Repairing should not be done after the LEDs have been soldered. (7) Reflow soldering should not be done more than two times. In the case of more than 24 hours passed soldering after first, LEDs will be damaged. Rev. 02 April, 2011 Document No. : SSC- QP- 7- 07- 24 Z-Power LED X10490 Technical Data Sheet 12. Packing Reel QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. HUMIDITY INDICATOR DESI PAK Aluminum Vinyl Bag QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. Outer Box Structure Material : Paper(SW3B(B)) SIZE (mm) TYPE a c b 7inch 245 220 142 1 SIDE c 1 QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX RoHS PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. b a Rev. 02 April, 2011 Document No. : SSC- QP- 7- 07- 24 Z-Power LED X10490 Technical Data Sheet 13. precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desicator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5ºC ~30ºC Humidity : maximum 70%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 10% (3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60± 5ºC. (4) Silver plating might be tarnished in the environment that contains corrosive gases and materials. Also any product that has tarnished lead might be decreased the solder-ability and optical-electrical properties compare to normal ones. Please do not expose the product in the corrosive environment during the storage. (5) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (6) Quick cooling shall be avoided. (7) Components shall not be mounted on warped direction of PCB. (8) Anti radioactive ray design is not considered for the products. (9) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (10) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (11) The LEDs must be soldered within seven days after opening the moisture-proof packing. (12) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (13) The appearance and specifications of the product may be modified for improvement without notice. Rev. 02 April, 2011 Document No. : SSC- QP- 7- 07- 24 Z-Power LED X10490 Technical Data Sheet 14. Handling of Silicone Resin LEDs 1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. 2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. 3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. 4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. 5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. 6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this product with acid or sulfur material in sealed space. Rev. 02 April, 2011 Document No. : SSC- QP- 7- 07- 24