Z-Power LED X10490 Technical Data Sheet W724C0 W724C0 Features • Super high Flux output and high Luminance Z-Power series is designed for 사진 high current operation and • Designed for high current operation high flux output applications. • Low thermal resistance • SMT solderbility • Lead Free product Z-Power LED's thermal management • RoHS compliant perform exceeds other power LED solutions. It incorporates state of the art SMD design and Thermal emission material. Application Z Power LED is ideal light sources for general illumination • Automotive interior / applications, custom designed solutions, automotive large LCD backlights exterior lighting • Automotive signal lighting • Automotive forward lighting • General Torch • Architectural lighting • Projector light source • Traffic signals • Task lighting • Decorative / Pathway lighting • Remote / Solar powered lighting • Household appliances Rev. 03 1 May 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet Full Code of Z-Power LED Series Full code form : X1 X2 X3 X4 X5 X6 – X7 X8 – X9 X10 X11 X12 X13 1. Part Number - X1 : Color - X2 : Z-Power LED series number - X3 : LENS type - X4 : Chip quantity (or Power Dissipation) - X5 : Package outline size - X6 : Type of PCB 2. Internal Number - X7 - X8 3. Code Labeling - X9 : Luminous flux (or Radiant flux for royal blue) - X10 X11 X12 : Dominant wavelength (or x,y coordinates rank code) - X13 : Forward voltage 4. Sticker Diagram on Reel & Aluminum Vinyl Bag PART NO. : X1 X2 X3 X4 X5 X6 – X7 X8 QUANTITY : ### LOT NUMBER : ########## BIN CODE : X9 X10 X11 X12 X13 For more information about binning and labeling, refer to the Application Note -1 Rev. 03 2 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet Outline Dimensions 1. Dome Type Cathode Anode Cathode Cathode Mark Notes : 1. 2. 3. 4. All dimensions are in millimeters. (tolerance : ±0.2 ) Scale : none Slug of package is connected to anode. The two leads are electrically connected *The appearance and specifications of the product may be changed for improvement without notice. Rev. 03 3 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet Characteristics for Dome type Z-Power LED 1. Pure White (W724C0) 1-1 Electro-Optical characteristics at IF=2800mA, TA=25ºC Symbol Parameter Value Min Max 700 900 lm - 400 - lm CCT - 6300 - K Ra - 70 VF - 3.6 4.2 V VF - 3.3 - V ФV [2] Luminous Flux [1] ФV [2] IF=1400mA Correlated Color Temperature [3] CRI Forward Voltage [4] IF=1400mA View Angle Thermal resistance [5] Unit Typ - 2Θ ½ 130 deg. Rθ 3 ºC /W 1-2 Absolute Maximum Ratings Parameter Symbol Value Unit Forward Current IF 2800 mA Power Dissipation Pd 11.8 W Junction Temperature Tj 140 ºC Operating Temperature Topr -40 ~ +85 ºC Storage Temperature Tstg -40 ~ +100 ºC - ±20,000V HBM - ESD Sensitivity [6] *Notes : [1] SSC maintains a tolerance of ±10% on flux and power measurements. [2] ФV is the total luminous flux output as measured with an integrated sphere. [3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram. CCT ±5% tester tolerance. [4] A tolerance of ±0.06V on forward voltage measurements [5] Rθ is measured with only emitter. (25 ºC ≤TJ ≤ 110 ºC) [6] It is included the zener chip to protect the product from ESD. --------------------------Caution-------------------------1. Please do not drive at rated current more than 5 sec. without proper heat sink. Rev. 03 4 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) 1.0 S tandard eye response curve Distribution 0.8 Relative Spectral Power Z-Power LED X10490 Technical Data Sheet Color spectrum, TA=25ºC 0.6 0.4 0.2 0.0 300 400 500 600 700 800 900 W a v e le n g t h (n m ) Rev. 03 5 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) 1. Forward Voltage vs. Forward Current, TA=25℃ Average Forward Current [mA] 2800 Pure White 2450 2100 1750 1400 1050 700 350 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 Forward Voltage [V] 2. Forward Current vs. Normalized Relative Luminous Flux, TA=25℃ 2.5 Relative Lumious Flux(a.U) Z-Power LED X10490 Technical Data Sheet Forward Current Characteristics Pure White 2.0 1.5 1.0 0.5 0.0 0 350 700 1050 1400 1750 2100 2450 2800 Forward Current [mA] Rev. 03 6 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) 1. Relative Light Output vs. Junction Temperature at IF=2800mA, TA=25℃ 160 Relative Light Output [%] Z-Power LED X10490 Technical Data Sheet Light Output Characteristics Pure White 140 120 100 80 60 40 20 0 25 50 75 100 125 150 o Junction Temperature, TJ [ C] Rev. 03 7 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) 1-1. Pure White (TJMAX = 140 ºC, @1400mA) 2000 Current [mA] 1500 1000 o RjaT = 20 C/W o RjaT = 15 C/W 500 o RjaT = 10 C/W 0 0 20 40 60 80 100 120 140 o Ambient Temperature [ C] 1-2. Pure White (TJMAX = 140 ºC, @2800mA) 3000 2500 Current [mA] Z-Power LED X10490 Technical Data Sheet Ambient Temperature vs Allowable Forward Current 2000 1500 o RjaT = 10 C/W o 1000 RjaT = 8 C/W 500 0 0 20 40 60 80 100 120 140 o Ambient Temperature [ C] Rev. 03 8 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet Typical Dome Type Radiation pattern 1. Pure White 0 1.0 30 Pure White Relative Intensity 0.8 0.6 60 0.4 0.2 0.0 -80 -60 -40 -20 0 90 Angle(deg.) Rev. 03 9 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) 1. Reflow Soldering Conditions / Profile Tm : Reflow machine setting temp (max 30 sec.) Ts : Surface temp of PCB (max) Ts : Surface temp of PCB (recommend) Ts : Surface temp of PCB (min) 260 240 220 200 180 ~ Z-Power LED X10490 Technical Data Sheet Soldering profile Pre-heating Cooling -5 °C/sec Rising 5 °C/sec 150 0 Time [Hr] 2. Hand Soldering conditions Lead : Not more than 3 seconds @MAX280℃ Slug : Use a thermal-adhesives * Caution 1. Reflow soldering should not be done more than one time. 2. Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, suitable tools have to be used. 3. Die slug is to be soldered. 4. When soldering, do not put stress on the LEDs during heating. 5. After soldering, do not warp the circuit board. 6. Recommend to use a convection type reflow machine with 7 ~ 8 zones. Rev. 03 10 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet Recommended Soldering 1. Solder pad 5 2. Solder paste pattern Solder paste Note : Paste thickness : 0.2mm 1. All dimensions are in millimeters (tolerance : ±0.2 ) 2. Scale none *The appearance and specifications of the product may be changed for improvement without notice. Rev. 03 11 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet Emitter Reel Packaging MARK Note : 1. The number of loaded products in the reel is 250ea 2. All dimensions are in millimeters 3. Scale none *The appearance and specifications of the product may be changed for improvement without notice. Rev. 03 12 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet Packaging Structure Aluminum Vinyl Bag PART NO. : ######-## QUANTITY : 250 LOT NUMBER : #######-####### BIN CODE : ####### Outer Box TYPE c SIZE(mm) a c b 350 350 370 ZLED PART : W42180-** PO CODE : ## Q'YT : ###### LOT NO : YMDD-##### DATE : ###### ZLED b SEOUL SEMICONDUCTOR CO.,LTD a Note : 1. 6~10 reels are loaded in box 2. Scale none 3. For more information about binning and labeling, refer to the Application Note - 1 Rev. 03 13 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet Precaution for use • Storage To avoid the moisture penetration, we recommend storing Z Power LEDs in a dry box (or desiccator) with a desiccant . The recommended storage conditions are Temperature 5 to 30 degrees Centigrade. Humidity 50% maximum. • Precaution after opening packaging However LED is correspond SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed. a. Soldering should be done right after opening the package(within 24Hrs). b. Keeping of a fraction - Sealing - Temperature : 5 ~ 40℃ Humidity : less than 30% c. If the package has been opened more than 1week or the color of desiccant changes, components should be dried for 10-12hr at 60±5℃ • Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temp. after soldering. • Please avoid rapid cooling after soldering. • Components should not be mounted on warped direction of PCB. • Anti radioactive ray design is not considered for the products listed here in. • Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned or shredded in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed. • This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA(Isopropyl Alcohol) should be used. • When the LEDs are illuminating, operating current should be decided after considering the package maximum temperature. • LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. • The appearance and specifications of the product may be modified for improvement without notice. • Long time exposure of sunlight or occasional UV exposure will cause lens discoloration. •The slug is connected to the anode. Therefore, we recommend to isolate the heat sink. Rev. 03 14 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet Handling of Silicone resin LEDs Z-Power LED is encapsulated by silicone resin for the highest flux efficiency. Notes for handling of Silicone resin Z-Power LEDs • Avoid touching silicone resin parts especially by sharp tools such as Pincette(Tweezers) • Avoid leaving fingerprints on silicone resin parts. • Dust sensitivity silicone resin need containers having cover for storage. • When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevent. • Please do not force over 3000 gf impact or pressure diagonally on the silicon lens. It will cause fatal damage of this product • Please do not recommend to cover the silicone resin of the LEDs with other resin (epoxy, urethane, etc) Rev. 03 15 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)