PT100MF1MP1 PT100MF1MP1 Phototransistor ■ Features ■ Agency Approvals/Compliance 1. Mountable by both top view and side view SMD package 2. Plastic mold with resin lens 3. Sensitive (Darlington phototransistor) 4. Mold with visible light cut resin 5. Lead free and RoHS directive component 1. Compliant with RoHS directive (2002/95/EC) 2. Content information about the six substances specified in “Management Methods for Control of Pollution Caused by Electronic Information Products Regulation” (popular name: China RoHS) (Chinese: ); refer to page 9 ■ Applications 1. 2. 3. 4. 5. 6. 7. Office automation equipment Audio visual equipment Home appliances Telecommunication equipment Measuring equipment Tooling machines Computers Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.: D1-A01601EN Date March 30, 2007 ©SHARP Corporation PT100MF1MP1 ■ Outline Dimensions 3.0 2.8 (0.4) 1.5 0.95 0.65 1.5 (0.2) (0.35) 0.75 2.2 Side view (from PCB) 3.0 R0.8 1.1 (0.92) 1 1.4 0.4 1.0 2.2 1.5 1.1 (0.57) 2 Top view (from PCB) 3.0 1 (1.0) NOTES: 1. Unspecified tolerance: ±0.2 mm 2. Dimensions in parenthesis are shown for reference 3. area: Au Plating 4. Do not wire in this area 5. Resin burr are not included in outline dimensions 6. Package: Black (Visible light cut-off epoxy resin) 7. Unit: mm 0.85 (1.0) 1.5 1.1 2 1.7 (0.70) Terminal connection Pin Arrangement No. Name 1 Emitter 2 Collector 1.1 (Center of lens) Sheet No.: D1-A01601EN 2 PT100MF1MP1 ■ Absolute Maximum Ratings Parameter (Ta = 25°C) Symbol Rating Unit Collector-emitter voltage VCEO 35 V Emitter-collector voltage VECO 6 V Collector current IC 20 mA Collector power dissipation PC 75 mW Operating temperature Topr -30 to +85 °C Storage temperature Tstg -40 to+ 95 °C Soldering temperature *1 Tsol 240 °C 1 10 s (MAX.) see reflow profile on page 8. * ■ Electro-optical Charactertistics Parameter Collector current Dark current (Ta = 25°C) Symbol Conditions *1 MIN. TYP. MAX. Unit IC Ee = 0.01 mW/cm2, VCE = 5 V 0.2 – 1.2 mA ICEO Ee = 0, VCE = 10 V – – 1.0 µA – – 1.0 V Ee = 1 mW/cm2, Ic = 0.8 mA Collector-emitter saturation voltage VCE(sat) Collector-emitter breakdown voltage BVCEO IC = 0.1 mA, Ee = 0 35 – – V Emitter-collector breakdown voltage BVECO IE = 0.01 mA, Ee = 0 6 – – V Peak sensitivity wavelength λp – – 860 – nm Response time (Rise) tr – 400 2,000 µs tf VCE = 2 V, IC = 5 mA, RL = 100 Ω – 300 1,500 µs Δθ – – ±15 – ° Response time (Fall) Half intensity angle *1 Ee: Illuminance by CIE standard light source A (tungsten lamp) Sheet No.: D1-A01601EN 3 PT100MF1MP1 Fig. 1 Collector Power Dissipation vs. Ambient Temperature Fig. 3 Radiation Diagram Ta = 25°C -20° -10° 0° +10° +20° 100 -30° 60 50 -40° 40 -50° 30 -60° 20 15 10 +30° Relative radiant intensity (%) Collector power dissipation Pc (mW) 80 75 70 -70° 80 60 +40° 40 +50° 20 -80° 0 -25 0 25 50 75 85 -90° 100 +60° +70° +80° 0 +90° Angular displacement θ Ambient temperature Ta (°C) Fig. 2 Spectral Sensitivity Ta = 25°C 100 Relative sensitivity (%) 80 60 40 20 0 400 500 600 700 800 900 1,000 1,100 Wavelength λ (nm) Sheet No.: D1-A01601EN 4 PT100MF1MP1 ■ Package Specification Fig. 4 Tape Shape and Dimension 2.45 ±0.1 4.0 ±0.1 0.3 ±0.05 8.0 ±0.3 5° 5.5 ±0.1 3.3 ±0.1 3.5 ±0.05 1.75 ±0.1 2.0 ±0.05 φ1.5 +0.1 -0 4.0 ±0.1 1.8 ±0.1 Fig. 5 Reel Shape and Dimension +0.3 9.0 -0 2.0 ±0.5 60.0 -0 +1 φ13.0 ±0.2 180.0 11.4 ±1 NOTE: Units are in mm Sheet No.: D1-A01601EN 5 PT100MF1MP1 Fig. 6 Production Insertion Direction Pull-out direction ● Taping Specification 1. See Fig. 4 for the tape structure and dimensions. The carrier tape structure incorporates a cover tape thermally bonded to it to protect the parts against electrostatic damage. 2. See Fig. 5 for the Reel structure and dimensional information. 3. See Fig. 6 for the Product Insert Direction. The collector terminal is at the hole side of the tape. ● Packing Specifications Name Material Aluminum laminated bag Aluminum pholyethylene Quantity Refer to Packaging Method Label Paper (filled in by factory) – Humidity indicator card Paper (filled in by factory) 1 sheet/reel ● Packaging Method 1. Seal the aluminum laminated bag and includ the ruled tape-reel and humidity indicator card quantity. 2. Fill in the label and paste on the bag. 3. Put the moisture-proof laminated bag in the ruled case. Package Shape Product Tape = reel (φ 180 mm) 1 ch type Quantity Moisture-proof Bag Quantity 1,500 pcs/reel 1 reel/bag Sheet No.: D1-A01601EN 6 PT100MF1MP1 ■ Manufacturing Guidelines ● Storage and Handling 1. Store these parts between 5°C and 30°C, at a relative humidity of less than 70%. 2. After breaking the package seal, maintain the environment within 5°C to 25°C, at a relative humidity of less than 60%, and mount the parts within two days. 3. When storing the parts after breaking the seal, Sharp recommends storage of no longer than two weeks in a dry box or by resealing the parts in a moisture-proof bag with a desiccant. 4. When baking the parts before mounting, Sharp recommends no more than one incidence of baking, performed with the parts either temporarily mounted or on a metal tray. Do not bake the parts in the carrier tape. Bake the parts at 125°C, for 16 to 24 hours. ● Cleaning Instructions 1. Confirm this device's resistance to process chemicals before use, as certain process chemicals may affect the optical characteristics. 2. Solvent cleaning: Solvent temperature should be 45°C or below. Immersion time should be 3 minutes or less. 3. Ultrasonic cleaning: The effect upon devices varies due to cleaning bath size, ultrasonic power output, cleaning time, PCB size and device mounting circumstances. Sharp recommends testing using actual production conditions to confirm the harmlessness of the ultrasonic cleaning methods. 4. Recommended solvent materials: Ethyl alcohol, Methyl alcohol, and Isopropyl alcohol. Sheet No.: D1-A01601EN 7 PT100MF1MP1 ● Soldering Instructions 1. When using solder reflow methods, follow the time and temperature profile shown below. Sharp recommends sending parts through this process only once. MAX 240°C 200°C 1 ~ 4°C/s MAX 165°C 1 ~ 4°C/s 1 ~ 4°C/s 25°C 120 s MAX. 10 s MAX. 60 s MAX. 90 s MAX. 2. If using an infrared lamp to preheat the parts, such heat sources may cause localized high temperatures in the part’s resin. Be sure to keep the heat profile within the guidelines shown in figure above. 3. Do not subject the package to excessive mechanical force during soldering as it may cause deformation or defects in plated connections. Internal connections may be severed due to mechanical force placed on the package due to the PCB flexing during the soldering process. 4. Sharp recommends checking the soldering process to ensure these guidelines are followed. Sheet No.: D1-A01601EN 8 PT100MF1MP1 ■ Presence of ODCs (RoHS Compliance) This product shall not contain the following materials, and they are not used in the production process for this product: • Regulated substances: CFCs, Halon, Carbon tetrachloride, 1,1,1-Trichloroethane (Methylchloroform). Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC). • Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE). • Content information about the six substances specified in “Management Methods for Control of Pollution Caused by Electronic Information Products Regulation” (Chinese: ) Toxic and Hazdardous Substances Category Infrared Emitting Diode Lead (Pb) mercury (Hg) Cadmium (Cd) ✓ ✓ ✓ Hexavalent chromiun (Cr6+) Polybrominated biphenyls (PBB) Polybrominated diphenyl ethers (PBDE) ✓ ✓ ✓ NOTE: ✓ indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the concentration limit requirement as described in SJ/T 11363-2006 standard. Sheet No.: D1-A01601EN 9 PT100MF1MP1 ■ Important Notices --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP’s devices. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment (trunk lines) --- Nuclear power control equipment --- Medical and other life support equipment (e.g. scuba) · Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. · If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. · Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment (terminal) --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics · This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. · Contact and consult with a SHARP representative if there are any questions about the contents of this publication. (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliabilty such as: Sheet No.: D1-A01601EN 10