SHENZHENFREESCALE AO4900

AO4900
Dual N-Channel Enhancement Mode Field
Effect Transistor with Schottky Diode
General Description
The AO4900 uses advanced trench technology to provide excellent RDS(ON) and low gate charge. The
two MOSFETs make a compact and efficient switch and synchronous rectifier combination for use in DCDC converters. A Schottky diode is co-packaged in parallel with the synchronous MOSFET to boost
efficiency further. Standard Product AO4900 is Pb-free (meets ROHS & Sony 259 specifications).
AO4900L is a Green Product ordering option. AO4900 and AO4900L are electrically identical.
Features
VDS (V) = 30V
ID = 6.9A (VGS = 10V)
RDS(ON) < 27mΩ (VGS = 10V)
RDS(ON) < 32mΩ (VGS = 4.5V)
RDS(ON) < 50mΩ (VGS = 2.5V)
SCHOTTKY
VDS (V) = 30V, IF = 3A, VF=0.5V@1A
S2/A
G2
S1
G1
8
7
6
5
1
2
3
4
D2
D2/K
D2/K
D1
D1
K
A
G2
SOIC-8
S2
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
VDS
Drain-Source Voltage
VGS
Gate-Source Voltage
TA=25°C
Continuous Drain CurrentA
Pulsed Drain Current
TA=70°C
B
IDM
TA=25°C
Continuous Forward CurrentA
TA=70°C
B
TA=70°C
Power Dissipation
Junction and Storage Temperature Range
Parameter: Thermal Characteristics MOSFET
t ≤ 10s
Maximum Junction-to-AmbientA
A
Maximum Junction-to-Ambient
C
Maximum Junction-to-Lead
Thermal Characteristics Schottky
Maximum Junction-to-AmbientA
A
Maximum Junction-to-Ambient
Maximum Junction-to-Lead
S1
MOSFET
C
Steady-State
Steady-State
t ≤ 10s
Steady-State
Steady-State
TJ, TSTG
Symbol
RθJA
RθJL
RθJA
RθJL
Units
V
±12
6.9
V
5.8
A
40
IF
PD
Schottky
30
IFM
TA=25°C
1/5
ID
G1
VKA
Schottky reverse voltage
Pulsed Forward Current
D1
30
3
V
2
A
2
40
2
1.44
1.44
-55 to 150
-55 to 150
°C
Typ
Max
Units
48
62.5
74
35
110
40
47.5
62.5
71
32
110
40
W
°C/W
°C/W
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AO4900
Electrical Characteristics (TJ=25°C unless otherwise noted)
Parameter
Symbol
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
Conditions
Min
ID=250µA, VGS=0V
30
1
Zero Gate Voltage Drain Current
IGSS
Gate-Body leakage current
VDS=0V, VGS= ±12V
VGS(th)
Gate Threshold Voltage
VDS=VGS ID=250µA
0.7
ID(ON)
On state drain current
VGS=4.5V, VDS=5V
25
TJ=55°C
5
VGS=10V, ID=6.9A
TJ=125°C
Static Drain-Source On-Resistance
VGS=4.5V, ID=6.0A
Forward Transconductance
VSD
Diode Forward Voltage
IS=1A
Maximum Body-Diode Continuous Current
IS
VDS=5V, ID=5A
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
SWITCHING PARAMETERS
Qg
Total Gate Charge
Qgs
Gate Source Charge
12
100
nA
1.4
V
22.6
27
33
40
27
32
mΩ
50
mΩ
A
16
0.71
846
VGS=0V, VDS=15V, f=1MHz
mΩ
S
1
V
3
A
1050
pF
96
pF
67
pF
VGS=0V, VDS=0V, f=1MHz
1.24
3.6
Ω
9.6
12
nC
VGS=4.5V, VDS=15V, ID=6.9A
1.65
nC
Qgd
Gate Drain Charge
3
tD(on)
Turn-On DelayTime
3.2
4.8
tr
Turn-On Rise Time
tD(off)
Turn-Off DelayTime
tf
Turn-Off Fall Time
trr
Body Diode Reverse Recovery time
Qrr
nC
ns
VGS=10V, VDS=15V, RL=2.2Ω,
RGEN=3Ω
4.1
6.2
ns
26.3
40
ns
3.7
5.5
ns
IF=5A, dI/dt=100A/µs
15.5
20
ns
Body Diode Reverse Recovery charge IF=5A, dI/dt=100A/µs
7.9
nC
SCHOTTKY PARAMETERS
VF
Forward Voltage Drop
IF=1.0A
0.45
0.007 0.05
Irm
VR=30V
VR=30V, TJ=125°C
Maximum reverse leakage current
VR=30V, TJ=150°C
CT
µA
1
42
VGS=2.5V, ID=5A
gFS
Max Units
V
VDS=24V, VGS=0V
IDSS
RDS(ON)
Typ
Junction Capacitance
VR=15V
0.5
3.2
10
12
37
20
V
mA
pF
A: The value of R θJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with T A =25°C.
The value in any given application depends on the user's specific board design. The current rating is based on the t ≤ 10s thermal
resistance rating.
B: Repetitive rating, pulse width limited by junction temperature.
C. The R θJA is the sum of the thermal impedence from junction to lead R θJL and lead to ambient.
D. The static characteristics in Figures 1 to 6,12,14 are obtained using 80 µs pulses, duty cycle 0.5% max.
E. These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with T A=25°C.
The SOA curve provides a single pulse rating.
Rev 3 : Aug 2005
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISIN
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
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AO4900
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
30
20
10V
3V
25
20
2.5V
15
ID(A)
ID (A)
VDS=5V
16
4.5V
12
8
10
125°C
VGS=2V
5
0
0
0
1
2
3
4
0
5
0.5
Normalized On-Resistance
VGS=2.5V
50
RDS(ON) (mΩ)
1.5
2
2.5
3
1.7
60
40
VGS=4.5V
30
20
VGS=10V
10
0
5
10
15
1.6
ID=5A
1.5
VGS=10V
VGS=4.5V
1.4
1.3
VGS=2.5V
1.2
1.1
1
0.9
0.8
20
0
ID (A)
Figure 3: On-Resistance vs. Drain Current and
Gate Voltage
50
100
150
200
Temperature (°C)
Figure 4: On resistance vs. Junction Temperature
70
1.0E+01
60
1.0E+00
ID=5A
1.0E-01
50
40
125°C
30
25°C
IS (A)
RDS(ON) (mΩ)
1
VGS (Volts)
Figure 2: Transfer Characteristics
VDS (Volts)
Fig 1: On-Region Characteristics
125°C
1.0E-02
1.0E-03
25°C
1.0E-04
1.0E-05
20
1.0E-06
10
0
2
4
6
8
VGS (Volts)
Figure 5: On resistance vs. Gate-Source Voltage
3/5
25°C
4
10
0.0
0.2
0.4
0.6
0.8
1.0
1.2
VSD (Volts)
Figure 6: Body-Diode Characteristics
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AO4900
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
1500
5
VDS=15V
ID=6.9A
Capacitance (pF)
VGS (Volts)
4
f=1MHz
VGS=0V
1250
3
2
Ciss
1000
1
750
500
Coss
250
0
0
2
4
6
8
10
0
12
0
Qg (nC)
Figure 7: Gate-Charge Characteristics
ID (A)
20
25
30
30
10ms
0.1s
1.0
15
T J(Max)=150°C
T A=25°C
100µs
1ms
10
40
T J(Max)=150°C
T A=25°C
Power (W)
10.0
5
VDS (Volts)
Figure 8: Capacitance Characteristics
100.0
RDS(ON)
limited
Crss
1s
20
10
10s
DC
0
0.001
0.1
0.1
1
10
100
VDS (Volts)
ZθJA Normalized Transient
Thermal Resistance
D=T on/T
T J,PK =T A+PDM.ZθJA.RθJA
RθJA=62.5°C/W
0.1
1
10
100
1000
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-toAmbient (Note E)
Figure 9: Maximum Forward Biased Safe
Operating Area (Note E)
10
0.01
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
1
PD
0.1
T on
Single Pulse
0.01
0.00001
0.0001
0.001
0.01
0.1
1
T
10
100
1000
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance
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AO4900
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS: SCHOTTKY
250
10
f = 1MHz
Capacitance (pF)
1
IF (Amps)
200
125°C
0.1
0.01
150
100
50
25°C
0.001
0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0
VF (Volts)
Figure 12: Schottky Forward Characteristics
10
15
20
25
30
VKA (Volts)
Figure 13: Schottky Capacitance Characteristics
0.7
100
0.6
IF=3A
Leakage Current (mA)
VF (Volts)
5
0.5
0.4
IF=1A
0.3
0.2
10
1
VR=30V
0.1
0.01
0.001
0.1
0
25
50
75
100
125
Temperature (°C)
150
0
175
25
50
75
100
125
150
175
Temperature (°C)
Figure 15: Schottky Leakage current vs. Junction
Temperature
Figure 14: Schottky Forward Drop vs.
Junction Temperature
ZθJA Normalized Transient
Thermal Resistance
10
1
D=T on/T
T J,PK =T A+PDM.ZθJA.RθJA
RθJA=62.5°C/W
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
PD
0.1
T on
Single Pulse
0.01
0.00001
0.0001
0.001
0.01
0.1
1
T
10
100
1000
Pulse Width (s)
Figure 15: Schottky Normalized Maximum Transient Thermal Impedance
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