NSC DS36C279M

DS36C279
Low Power EIA-RS-485 Transceiver with Sleep Mode
General Description
Features
The DS36C279 is a low power differential bus/line transceiver designed to meet the requirements of RS-485 Standard for multipoint data transmission. In addition it is compatible with TIA/EIA-422-B.
The sleep mode feature automatically puts the device in a
power saving mode when both the driver and receiver are
disabled.†† The device is ideal for use in power conscious
applications where the device may be disabled for extended
periods of time.
The driver and receiver outputs feature TRI-STATE ® capability. The driver outputs operate over the entire common mode
range of −7V to +12V. Bus contention or fault situations that
cause excessive power dissipation within the device are
handled by a thermal shutdown circuit, which forces the
driver outputs into a high impedance state.
The receiver incorporates a fail safe circuit which guarantees
a high output state when the inputs are left open.†
The DS36C279T is fully specified over the industrial temperature range (−40˚C to +85˚C).
n 100% RS-485 compliant
— Guaranteed RS-485 device interoperation
n Low power CMOS design: ICC 500 µA max
n Automatic sensing sleep mode
— Reduces ICC to 10 µA maximum
n Built-in power up/down glitch-free circuitry
— Permits live transceiver intersection/displacement
n DIP and SOIC packages available
n Industrial temperature range: −40˚C to +85˚C
n On-board thermal shutdown circuitry
— Prevents damage to the device in the event of
excessive power dissipation
n Wide common mode range: −7V to +12V
n Receive open input fail-safe (Note 1)
n 1⁄4 unit load (DS36C279): ≥ 128 nodes
n 1⁄2 unit load (DS36C279T): ≥ 64 nodes
n ESD (Human Body Model): ≥ 2 kV
n Drop-in replacement for:
— LTC485 MAX485 DS75176 DS3695
Connection and Logic Diagram
Truth Table
DRIVER SECTION
RE*
DE
DI
DO/RI
X
H
H
H
DO*/RI*
L
X
H
L
L
H
X
L
X
Z
Z
RECEIVER SECTION
DS012053-1
Order Number DS36C279M, DS36C279N,
DS36C279TM or DS36C279TN
See NS Package Number M08A or N08E
RE*
DE
RI-RI*
RO
L
L
≥+0.2V
H
L
L
≤−0.2V
L
H
L
X
Z (Note 2)
L
L
OPEN (Note 1)
H
Note 1: Non-terminated, open input only
Note 2: Device enters sleep mode if enable conditions are held 600 ns
TRI-STATE ® is a registered trademark of National Semiconductor Corporation.
© 1999 National Semiconductor Corporation
DS012053
www.national.com
DS36C279 Low Power EIA-RS-485 Transceiver with Sleep Mode
July 1998
Absolute Maximum Ratings (Note 3)
Storage Temperature Range
Lead Temperature
(Soldering 4 sec)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
−65˚C to +150˚C
+260˚C
Recommended Operating
Conditions
Supply Voltage (VCC)
+12V
Input Voltage (DE, RE*, & DI)
−0.5V to (VCC +0.5V)
Common Mode (VCM)
± 15V
Driver Output/Receiver Input
± 14V
Input Voltage (DO/RI, DO*/RI*)
Receiver Output Voltage
−0.5V to (VCC +0.5V)
Maximum Package Power Dissipation
@ +25˚C
M Package 1190 mW, derate
9.5 mW/˚C above +25˚C
N Package 744 mW, derate
6.0 mW/˚C above +25˚C
Supply Voltage (VCC)
Min
Typ
Max
Units
+4.75
+5.0
+5.25
V
+12
V
Bus Voltage
−7
Operating Free Air Temperature (TA)
DS36C279T
−40
+25
+85
˚C
0
+25
+70
˚C
DS36C279
Electrical Characteristics (Notes 4, 5)
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified
Symbol
Parameter
Conditions
Reference
Min
Typ
Max Units
(422)
(485)
1.5
5.0
0
5.0
V
0
5.0
V
DIFFERENTIAL DRIVER CHARACTERISTICS
VOD1
Differential Output Voltage
IO = 0 mA (No Load)
VOD0
Output Voltage
IO = 0 mA
VOD0*
Output Voltage
(Output to GND)
VOD2
∆VOD2
Differential Output Voltage
RL = 50Ω
(422)
(Termination Load)
RL = 27Ω
(485)
Balance of VOD2
RL = 27Ω or 50Ω
(Note 6)
|VOD2 − VOD2*|
VOD3
VOC
∆VOC
IOSD
Figure 1
V
2.0
2.8
1.5
2.3
5.0
V
V
−0.2
0.1
+0.2
V
1.5
2.0
5.0
V
0
3.0
V
0
3.0
V
−0.2
+0.2
V
(422, 485)
Differential Output Voltage
R1 = 54Ω, R2 = 375Ω
(Full Load)
VTEST = −7V to +12V
Figure 2
Driver Common Mode
RL = 27Ω
(485)
Output Voltage
RL = 50Ω
(422)
Balance of VOC
RL = 27Ω or
|VOC − VOC*|
RL = 50Ω
Figure 1
(Note 6)
(422, 485)
Driver Output Short-Circuit
VO = +12V
(485) Figure 4
200
+250
mA
Current
VO = −7V
(485)
−190
−250
mA
+0.035
+0.2
V
RECEIVER CHARACTERISTICS
VTH
VTL
Differential Input High
Threshold Voltage
−7V ≤ VCM ≤ +12V
VO = VOH, IO = −0.4 mA
Differential Input Low
Threshold Voltage
−7V ≤ VCM ≤ +12V
VO = VOL, IO = 0.4 mA
VHST
Hysteresis
VCM = 0V
RIN
Input Resistance
−7V ≤ VCM ≤ +12V
IIN
(Note 7)
(422, 485)
Line Input Current
Other Input = 0V,
(Note 9)
DE = VIL, RE* = VIL,
−0.2
−0.035
V
70
mV
DS36C279T
24
68
kΩ
DS36C279
48
68
kΩ
(Note 8)
DS36C279
VCC = 4.75 to 5.25
DS36C279T
or 0V
IING
Line Input Current Glitch
(Note 9)
Other Input = 0V,
DE = VIL, RE* = VIL,
DS36C279
VCC = +3.0V or 0V,
TA = 25˚C
DS36C279T
IB
Input Balance Test
RS = 500Ω
VOH
High Level Output Voltage
IOH = −4 mA, VID = +0.2V
VOL
Low Level Output Voltage
IOL = +4 mA, VID = −0.2V
www.national.com
VIN = +12V
0
0.19
0.25
mA
VIN = −7V
0
−0.1
−0.2
mA
VIN = +12V
0
0.19
0.5
mA
VIN = −7V
0
−0.1
−0.4
mA
VIN = +12V
0
0.19
0.25
mA
VIN = −7V
0
−0.1
−0.2
mA
VIN = +12V
0
0.19
0.5
mA
VIN = −7V
0
−0.1
−0.4
mA
± 400
mV
3.5
4.6
(422) (Note 12)
2
RO
Figure 11
0.3
V
0.5
V
Electrical Characteristics (Notes 4, 5)
(Continued)
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified
Symbol
Parameter
Conditions
Reference
Min
Typ
RO
7
35
Max Units
RECEIVER CHARACTERISTICS
IOSR
Short Circuit Current
VO = GND
IOZR
TRI-STATE Leakage
Current
VO = 0.4V to 2.4V
85
mA
±1
µA
2.0
VCC
V
GND
0.8
V
2
µA
−2
µA
DEVICE CHARACTERISTICS
VIH
High Level Input Voltage
VIL
Low Level Input Voltage
IIH
High Level Input Current
VIH = VCC
IIL
Low Level Input Current
VCC = 5V
DE,
RE*,
DI
VIL = 0V
VCC = +3.0V
ICC
ICCR
Power Supply Current
(No Load)
Driver and Receiver ON
Driver OFF, Receiver ON
ICCD
Driver ON, Receiver OFF
ICCX
Sleep Mode
VCC
−2
µA
200
500
µA
200
500
µA
200
500
µA
0.2
10
µA
Switching Characteristics (Notes 5, 10)
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified
Symbol
Parameter
Conditions
Reference
Min
Typ
Max
Units
10
39
80
ns
10
40
80
ns
0
1
10
ns
ns
DRIVER CHARACTERISTICS
tPHLD
Differential Propagation
Delay High to Low
tPLHD
Differential Propagation
Delay Low to High
tSKD
Differential Skew
RL = 54Ω, CL = 100 pF
Figures 5, 6
|tPHLD − tPLHD|
tr
Rise Time
3
25
50
tf
Fall Time
3
25
50
ns
tPHZ
Disable Time High to Z
Figures 7, 8
80
200
ns
tPLZ
Disable Time Low to Z
Figures 9, 10
tPZH
Enable Time Z to High
tPZL
tPSH
tPSL
CL = 15 pF
RE* = L
80
200
ns
Figures 7, 8
50
200
ns
Enable Time Z to Low
CL = 100 pF
RE* = L
Figures 9, 10
65
200
ns
Driver Enable from Sleep
CL = 100 pF
Figures 7, 8
70
98
250
ns
Mode to Output High
(Note 11)
Figures 9, 10
70
98
250
ns
Figures 12, 13
30
210
400
ns
30
190
400
ns
Driver Enble from Sleep
CL = 100 pF
Mode to Output Low
(Note 11)
RECEIVER CHARACTERISTICS
tPHL
Propagation Delay
CL = 15 pF
High to Low
tPLH
Propagation Delay
Low to High
tSK
Skew, |tPHL − tPLH|
tPLZ
Output Disable Time
tPHZ
tPZL
0
CL = 15 pF
DE = H
Figures 14, 15,
16
Output Enable Time
tPZH
tPSH
tPSL
Receiver Enable from Sleep
CL = 15 pF
Mode to Output High
(Note 11)
Receiver Enable from Sleep
CL = 15 pF
3
20
50
ns
50
150
ns
55
150
ns
40
150
ns
45
150
ns
Figures 14, 16
70
97
250
ns
Figures 14, 15
70
95
250
ns
www.national.com
Switching Characteristics (Notes 5, 10)
(Continued)
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified
Symbol
Parameter
Conditions
Reference
Min
Typ
Max
Units
RECEIVER CHARACTERISTICS
Mode to Output Low
(Note 11)
Note 3: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devices
should be operated at these limits. The table of “Electrical Characteristics” specifies conditions of device operation.
Note 4: Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground except VOD1 and VOD2.
Note 5: All typicals are given for: VCC = +5.0V, TA = + 25˚C.
Note 6: Delta |VOD2| and Delta |V OC| are changes in magnitude of VOD2 and VOC , respectively, that occur when input changes state.
Note 7: Threshold parameter limits specified as an algebraic value rather than by magnitude.
Note 8: Hysteresis defined as VHST = VTH − VTL.
Note 9: IIN includes the receiver input current and driver TRI-STATE leakage current.
Note 10: CL includes probe and jig capacitance.
Note 11: For enable from sleep mode delays DE = L and RE* = H for greater than 600 ns prior to test (device is in sleep mode).
Note 12: For complete details of test, see RS-485.
Parameter Measurement Information
DS012053-3
FIGURE 3. Driver VOH and VOL
DS012053-2
FIGURE 1. Driver VOD2 and VOC
DS012053-4
Vtest = −7V to +12V
FIGURE 4. Driver IOSD
DS012053-17
FIGURE 2. Driver VOD3
DS012053-5
FIGURE 5. Driver Differential Propagation Delay Test Circuit
www.national.com
4
Parameter Measurement Information
(Continued)
DS012053-6
FIGURE 6. Driver Differential Propagation Delays and Differential Rise and Fall Times
DS012053-10
FIGURE 10. TRI-STATE and Sleep Mode Waveforms
(tPZL, (tPSL), tPLZ)
DS012053-7
FIGURE 7. TRI-STATE and Sleep Mode Test Circuit
(tPZH, (tPSH), tPHZ)
DS012053-11
DS012053-8
FIGURE 11. Receiver VOH and VOL
FIGURE 8. TRI-STATE and Sleep Mode Waveforms
(tPZH, (tPSH), tPHZ)
DS012053-12
FIGURE 12. Receiver Differential Propagation Delay
Test Circuit
DS012053-9
FIGURE 9. TRI-STATE and Sleep Mode Test Circuit
(tPZL, (tPSL), tPLZ)
5
www.national.com
Parameter Measurement Information
(Continued)
DS012053-13
FIGURE 13. Receiver Differential Propagation Delay Waveforms
DS012053-14
FIGURE 14. Receiver TRI-STATE and Sleep Mode Test Circuit
DS012053-15
FIGURE 15. Receiver Enable and Disable Waveforms (tPLZ, tPZL, (tPSL))
DS012053-16
FIGURE 16. Receiver Enable and Disable Waveforms (tPHZ, tPZH, (tPSH))
www.national.com
6
Parameter Measurement Information
(Continued)
DS012053-19
FIGURE 17. Entering Sleep Mode Conditions
Typical Application Information
DS012053-18
FIGURE 18. Typical RS-485 Bus Interface
TABLE 1. Device Pin Descriptions
Pin
No.
Name
Description
1
RO
Receiver Output: When RE (Receiver Enable) is LOW, the receiver is enabled (ON), if DO/RI ≥
DO*/RI* by 200 mV, RO will be HIGH. If DO/RI ≤ DO*/RI* by 200 mV, RO will be LOW. Additionally
RO will be HIGH for OPEN (Non-terminated) Inputs.
2
RE*
Receiver Output Enable: When RE* is LOW the receiver output is enabled. When RE* is HIGH, the
receiver output is in TRI-STATE (OFF). When RE* is HIGH and DE is LOW, the device will enter a
low-current sleep mode after 600 ns.
3
DE
Driver Output Enable: When DE is HIGH, the driver outputs are enabled. When DE is LOW, the
driver outputs are in TRI-STATE (OFF). When RE* is HIGH and DE is LOW, the device will enter a
low-current sleep mode after 600 ns.
4
DI
Driver Input: When DE (Driver Enable) is HIGH, the driver is enabled, if DI is LOW, then DO/RI will
be LOW and DO*/RI* will be HIGH. If DI is HIGH, then DO/RI is HIGH and DO*/RI* is LOW.
5
GND
Ground Connection.
6
DO/RI
Driver Output/Receiver Input, 485 Bus Pin.
7
DO*/RI*
Driver Output/Receiver Input, 485 Bus Pin.
8
VCC
Positive Power Supply Connection: Recommended operating range for VCC is +4.75V to +5.25V.
Unit Load
unit load (see Figure 19). An RS-485 driver is capable of
driving up to 32 unit loads. This allows up to 32 nodes on a
single bus. Although sufficient for many applications, it is
sometimes desirable to have even more nodes. For example, an aircraft that has 32 rows with 4 seats per row
would benefit from having 128 nodes on one bus. This would
A unit load for an RS-485 receiver is defined by the input current versus the input voltage curve. The gray shaded region
is the defined operating range from −7V to +12V. The top
border extending from −3V at 0 mA to +12V at +1 mA is defined as one unit load. Likewise, the bottom border extending
from +5V at 0 mA to −7V at −0.8 mA is also defined as one
7
www.national.com
Unit Load
(Continued)
allow signals to be transferred to and from each individual
seat to 1 main station. Usually there is one or two less seats
in the last row of the aircraft near the restrooms and food
storage area. This frees the node for the main station.
The DS36C278, the DS36C279, and the DS36C280 all have
1⁄2 unit load and 1⁄4 unit load (UL) options available. These
devices will allow up to 64 nodes or 128 nodes guaranteed
over temperature depending upon which option is selected.
The 1⁄2 UL option is available in industrial temperature and
the 1⁄4 UL is available in commercial temperature.
First, for a 1⁄2 UL device the top and bottom borders shown in
Figure 19 are scaled. Both 0 mA reference points at +5V and
−3V stay the same. The other reference points are +12V at
+0.5 mA for the top border and −7V at −0.4 mA for the bottom border (see Figure 19). Second, for a 1⁄4 UL device the
top and bottom borders shown in Figure 19 are scaled also.
Again, both 0 mA reference points at +5V and −3V stay the
same. The other reference points are +12V at +0.25 mA for
the top border and −7V at −0.2 mA for the bottom border
(see Figure 19).
The advantage of the 1⁄2 UL and 1⁄4 UL devices is the increased number of nodes on one bus. In a single master
multi-slave type of application where the number of slaves
exceeds 32, the DS36C278/279/280 may save in the cost of
extra devices like repeaters, extra media like cable, and/or
extra components like resistors.
www.national.com
DS012053-20
FIGURE 19. Input Current vs Input Voltage
Operating Range
The DS36C279 and DS36C280 have an additional feature
which offers more advantages. The DS36C279 has an automatic sleep mode function for power conscious applications.
The DS36C280 has a slew rate control for EMI conscious
applications. Refer to the sleep mode and slew rate control
portion of the application information section in the corresponding datasheet for more information on these features.
Sleep Mode
The DS36C279 features an automatic shutdown mode that
allows the device to save power when not transmitting data.
Since the shutdown mode is automatic, no external components are required. It may be used as little or as much as the
application requires. The more the feature is utilized, the
more power it saves.
The sleep mode is automatically entered when both the
driver and receiver are disabled. This occurs when both the
DE pin is asserted to a logic low and the RE* pin is asserted
to a logic high. Once both pins are asserted the device will
enter sleep mode typically in 50 ns. The DS36C279 is guaranteed to go into sleep mode within 600 ns after both pins
are asserted. The device wakes up (comes out of sleep
mode) when either the DE pin is asserted to a logic high
and/or the RE* pin is asserted to a logic low. After the device
enters sleep mode it will take longer for the device to wake
up than it does for the device to enable from TRI-STATE. Refer to datasheet specifications tPSL and tPSH and compare
with tPZL and tPZH for timing differences.
The benefit of the DS36C279 is definitely its power savings.
When active the device has a maximum ICC of 500 µA.
When in sleep mode the device has a maximum ICC of only
10 µA, which is 50 times less power than when active. The
ICC when the device is active is already very low but when in
sleep mode the ICC is ultra low.
8
Physical Dimensions
inches (millimeters) unless otherwise noted
8-Lead (0.150" Wide) Molded Small Outline Package, JEDEC
Order Number DS36C279M or DS36C279TM
NS Package Number M08A
8-Lead (0.300" Wide) Molded Dual-In-Line Package
Order Number DS36C279N or DS36C279TN
NS Package Number N08E
9
www.national.com
DS36C279 Low Power EIA-RS-485 Transceiver with Sleep Mode
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
2. A critical component is any component of a life support
1. Life support devices or systems are devices or sysdevice or system whose failure to perform can be reatems which, (a) are intended for surgical implant into
sonably expected to cause the failure of the life support
the body, or (b) support or sustain life, and whose faildevice or system, or to affect its safety or effectiveness.
ure to perform when properly used in accordance
with instructions for use provided in the labeling, can
be reasonably expected to result in a significant injury
to the user.
National Semiconductor
Corporation
Americas
Tel: 1-800-272-9959
Fax: 1-800-737-7018
Email: [email protected]
www.national.com
National Semiconductor
Europe
Fax: +49 (0) 1 80-530 85 86
Email: [email protected]
Deutsch Tel: +49 (0) 1 80-530 85 85
English Tel: +49 (0) 1 80-532 78 32
Français Tel: +49 (0) 1 80-532 93 58
Italiano Tel: +49 (0) 1 80-534 16 80
National Semiconductor
Asia Pacific Customer
Response Group
Tel: 65-2544466
Fax: 65-2504466
Email: [email protected]
National Semiconductor
Japan Ltd.
Tel: 81-3-5639-7560
Fax: 81-3-5639-7507
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.