Si4012 Si4012 C RYSTAL - LESS FSK/OOK RF T RANSMITTER Features Frequency range 27–960 MHz Output power range –13 to +10 dBm Low Power Consumption OOK 14.2 mA @ +10 dBm FSK 19.8 mA @ +10 dBm Data rate: Up to 100 kbaud FSK Up to 50 kbaud OOK FSK and OOK modulation Power supply = 1.8 to 3.6 V Automatic antenna tuning Programmable ramp rate Crystal-less operation ±150 ppm: 0 to 70° C ±250 ppm: –40 to 85° C Optional crystal input for applications requiring tighter tolerances Ultra low standby current <10 nA Integrated voltage regulator 255 byte FIFO Low battery detector SMBus Interface –40 to +85 °C temperature range 10-Pin MSOP Package, RoHs compliant Low BOM Applications Wireless MBus T1-mode Remote control Home security & alarm Personal data logging Toy control Wireless PC peripherals Remote meter reading Remote keyless entry Home automation Industrial control Sensor networks Health monitors Description Ordering Information: See page 43. Pin Assignments Si4012 XTAL 1 10 SDA GND 2 9 SCL TXM 3 Si4012 8 SDN TXP 4 7 nIRQ VDD 5 6 LED Patents pending Silicon Laboratories’ Si4012 is a fully-integrated crystalless CMOS high-data-rate RF transmitter designed for the sub-GHz ISM band. This chip is optimized for battery powered applications requiring low standby currents and high output transmit power. The device offers advanced radio features including continuous frequency coverage from 27–960 MHz, adjustable output power of up to +10 dBm, and data rates up to 100 kbaud in FSK mode. The Si4012’s high level of integration offers reduced BOM cost while simplifying overall system design. Functional Block Diagram Si4012 Digital Logic RF Analog Core Antenna Tune OOK SMBus Interface Host MCU TX 255 Byte Data FIFO LED XTAL PA Auto Tune TXP TXM LCOSC LPOSC VA Digital Controller VD Register Bank Rev 1.1 3/13 Divider FSK Modulator XTAL OSC LDO POR BANDGAP VDD GND Battery Monitor Copyright © 2013 by Silicon Laboratories Si4012 Si4012 2 Rev 1.1 Si4012 TABLE O F C ONTENTS Section Page 1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 1.1. Definition of Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 2. Typical Application Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 3. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 4. Host MCU Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4.1. SMBus Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 4.2. SMBus Flow Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 4.3. Host Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4.4. Operating Mode Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 5. Command Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 5.1. Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 5.2. Properties . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 5.3. Error Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41 6. Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 7. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 8. Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 9. Land Pattern: 10-Pin MSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 10. Top Marking: 10-Pin MSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48 Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50 Rev 1.1 3 Si4012 1. Electrical Specifications Table 1. Recommended Operating Conditions1 Parameter Supply Voltage Symbol Test Condition VDD Supply Voltage Slew Rate Input Voltage Min Typ Max Unit 1.8 — 3.6 V Initial Battery Insertion2 20 — 650 mV/ us Digital Input Signals –0.3 — VDD + 0.3 V Notes: 1. All specifications guaranteed by production test unless otherwise noted. Production test conditions and max limits are listed in "1.1. Definition of Test Conditions" on page 7. 2. Recommend bypass capacitor = 1 µF; slew rate measured 1 V < VDD ,< 1.7 V. Table 2. DC Characteristics* Parameter Symbol Conditions Min Typ Max Units Power Saving Modes IShutdown Lowest current mode — 10 — nA IIdle Register values retained, lowest current consumption idle mode — 600 — µA ITX_OOK OOK, Manchester encoded — 14.2 — mA ITX_FSK FSK — 19.8 — mA TX Mode Current @ 10 dBm *Note: All specifications guaranteed by production test unless otherwise noted. Production test conditions and max limits are listed in "1.1. Definition of Test Conditions" on page 7. 4 Rev 1.1 Si4012 Table 3. Si4012 RF Transmitter Characteristics1 (TA = 25 °C, VDD = 3.3 V, RL = 550 , unless otherwise noted) Parameter Test Condition Min Typ Max Unit 27 — 960 MHz — 0.3 — ppm — — — — –150 –250 –70 –100 –105 5 — — — — +150 +250 dBc/Hz dBc/Hz dBc/Hz ms ppm ppm –10 — +10 ppm — 10 — dBm — –13 — dBm –1.0 — 0.5 dB Power variation vs temp and supply, with optimum differential load, VDD > 1.8 V –2.5 — 0.5 dB Transmit power step size from –13 to 6.5 dBm — 0.25 — dB OOK mode 0.34 — 10.7 us 2 Frequency Range (FRF) Frequency Noise (rms)3 Phase Noise @ 915 MHz Frequency Tuning Time Carrier Frequency Accuracy Frequency Error Contribution with External Crystal Transmit Power4 PA Edge Ramp Rate Programmable Range Data Rate FSK Deviation OOK Modulation Depth Antenna Tuning Capacitive Range (Differential) Allen deviation, measured across 1 ms interval 10 kHz offset 100 kHz offset 1 MHz offset 0 °C ≤ TA ≤ 70 °C –40 °C ≤ TA ≤ 85 °C Maximum programmed Tx power, with optimum differential load, VDD > 2.2 V Minimum programmed TX power, with optimum differential load, VDD > 2.2 V Power variation vs temp and supply, with optimum differential load, VDD > 2.2 V OOK FSK Max frequency deviation Deviation resolution Deviation accuracy 315 MHz 0.1 — 50 0.1 — 100 — 275 — — 2 — ±(4 ppm + 2% pk-pk target FSK deviation in ppm) 60 — — 2.4 — 12.5 kbaud kbaud ppm ppm ppm dB pF Notes: 1. All specifications guaranteed by production test unless otherwise noted. Production test conditions and max limits are listed in "1.1. Definition of Test Conditions" on page 7. 2. The frequency range is continuous over the specified range. 3. The frequency step size is limited by the frequency noise. 4. Optimum differential load is equal to 4 V/(11.5 mA/2 x 4/PI) = 550 Therefore the antenna load resistance in parallel with the Si4012 differential output resistance should equal 600 Rev 1.1 5 Si4012 Table 4. Low Battery Detector Characteristics* (TA = 25° C, VDD = 3.3 V, RL = 550 , unless otherwise noted) Parameter Test Condition Min Typ Max Unit — 2 — % Battery Voltage Measurement Accuracy *Note: All specifications guaranteed by production test unless otherwise noted. Production test conditions and max limits are listed in "1.1. Definition of Test Conditions" on page 7. Table 5. Optional Crystal Oscillator Characteristics* (TA = 25° C, VDD = 3.3 V, RL = 600 , unless otherwise noted) Parameter Crystal Frequency Range Input Capacitance (GPIO0) Crystal ESR Start-Up Time Test Condition GPIO0 configured as a crystal oscillator; XO_LOWCAP=1 GPIO0 configured as a crystal oscillator; XO_LOWCAP=0 GPIO0 configured as a crystal oscillator; XO_LOWCAP=1 GPIO0 configured as a crystal oscillator; XO_LOWCAP=0 Crystal oscillator only, 60 mH motional arm inductance Min 10 — Typ — 3 Max 13 — — 5.5 — — — 120 — — 80 — 9 50 Unit MHz pF pF ms *Note: All specifications guaranteed by production test unless otherwise noted. Production test conditions and max limits are listed in "1.1. Definition of Test Conditions" on page 7. Table 6. Thermal Conditions Parameter Symbol Value Unit Ambient Temperature TA –40 to 85 C Junction Temperature TOP –40 to 90 C Storage Temperature TSTG –55 to 125 C Symbol Value Unit VDD –0.5 to 3.9 V IIN 10 mA VIN –0.3 to (VDD + 0.3) V Table 7. Absolute Maximum Ratings1,2 Parameter Supply Voltage Input Current3 Input Voltage4 Notes: 1. Permanent device damage may occur if the absolute maximum ratings are exceeded. Functional operation should be restricted to the conditions as specified in the operational sections of this data sheet. Exposure beyond recommended operating conditions for extended periods may affect device reliability. 2. Handling and assembly of these devices should only be done at ESD-protected workstations. 3. All input pins besides VDD. 4. For GPIO pins configured as inputs. 6 Rev 1.1 Si4012 1.1. Definition of Test Conditions Production Test Conditions: TA = +25 °C. VDD = +3.3 VDC. TX output power measured at 100 MHz. All RF output levels referred to the pins of the Si4012 (not the RF module). Qualification Test Conditions: TA = –40 to +85 °C. VDD = +1.8 to +3.6 VDC. All RF output levels referred to the pins of the Si4012 (not the RF module). Rev 1.1 7 Si4012 2. Typical Application Schematic See Note 1 Optional CR2032 Coin Cell 1.8 to 3.6 V See Note 2 C3 D1 X1 1 XTAL SDA 10 2 GND SCL 9 3 TXM C2 Si4012 SDN 8 4 TXP nIRQ 7 5 VDD LED 6 R2 R1 Host MCU C1 1 µF Loop Antenna Notes: 1. The Si4012 has internal 50 k pull-up resistors. Additional optional external pull-up resistors may be added should the board design required it. 2. See note about how to choose the value of C3 in "5.2.10. PROPERTY: XO_CONFIG" on page 39. 8 Rev 1.1 Si4012 3. Functional Description Si4012 Digital Logic RF Analog Core Antenna Tune OOK SMBus Interface Host MCU FSK Modulator Divider PA LPOSC VA TXP TXM LCOSC TX 255 Byte Data FIFO LED XTAL Auto Tune Digital Controller VD Register Bank XTAL OSC LDO POR BANDGAP VDD GND Battery Monitor Figure 1. Si4012 Functional Block Diagram The Si4012 is a fully-integrated, crystal-less, sub-GHz CMOS RF transmitter offering industry-leading RF performance, high integration, flexibility, low BOM, small board area, and ease of design. The device is designed to operate with any host MCU via a serial interface while optimized for battery-powered applications. The Si4012 operates from voltages ranging from 1.8 to 3.6 V and offers an ultra-low standby current consumption of less than 10 nA. The embedded power amplifier can be programmed to supply from –13 dBm up to +10 dBm, while the patented automatic antenna tuning circuit ensures that the resonant frequency and impedance matching between the PA output and the connected antenna are configured for optimum transmit efficiency and low harmonic content. Users may configure the device for either FSK or OOK modulation with supported symbol rates of up to 100 kbps. To ensure the lowest system cost, the Si4012 can be used without an external crystal or frequency reference by leveraging Silicon Labs' patented and proven crystal-less oscillator technology. This technology offers better than ±150 ppm carrier frequency stability over the temperature range of 0 to +70 °C and ±250 ppm carrier frequency stability over the industrial temperature range of –40 to + 85 °C. No production alignments are necessary since all RF functions are integrated into the device. Rev 1.1 9 Si4012 4. Host MCU Interface 4.1. SMBus Interface The SMBus interface is implemented as a bidirectional 2-wire interface (SCL, SDA) with the host configured as master and the Si4012 configured as slave. Both standard (100 kbps) and fast (400 kbps) modes are supported with 7-bit addressing. The default device address is 1110000x, where x is the R/W bit. 4.1.1. Design Recommendation In designs with multiple SMBus devices, it is recommended to use separate SMBus buses where possible since all attached SMBus devices will wake on bus traffic to confirm address. This process can lead to better battery life compared to systems with single-bus designs. 4.2. SMBus Flow Control The SCL and SDA pins are configured as open drain requiring external pull-up resistors. Flow control is implemented using the open drain configuration as shown below. Figure 2. WRITE Operation from Master to Slave The data (SDA) pin never changes when SCL = 1 during bit data transfers. If it changes, it indicates a START or STOP condition generated by the master/host. After the START condition, a 7-bit address is sent to the Si4012/slave by the host/master, followed by a single bit determining what is going to drive SDA (i.e., a write or read operation). For a WRITE operation, the master drives the following SDA bits, and the slave sends ACK/NAK bits. For a READ operation, the slave drives the data bits, and the master responds with ACK/NACK. Figure 2 shows a write operation from MASTER to SLAVE. Shortly after the R/W bit is received, the SLAVE device holds the SCL line low (blue line), thus stalling the master. The master will detect when SCL is released by the slave and will clock in the ACK/NACK bit from the slave (ACK shown above). By this, the slave (Si4012) can service each incoming byte and manage flow control to the host. 4.3. Host Interrupts An nIRQ line from the Si4012 to the host is used to issue interrupts to the host. The host can then read the interrupt status and clear interrupts from the Si4012 via the SMBus interface. 10 Rev 1.1 Si4012 4.4. Operating Mode Control NOTE1, 2 TUNE with XO 5 TX_START NOTE1 Yes Yes No SHUTDOWN 1 SDN=1? STANDBY 2 CHANGE_STATE / Tx_START SMBus or SDN (NOTE 4) TX 6 XO in CHIP_CONFIG? No CHANGE_STATE NOTE1, 3 TX_START TUNE without XO 4 SENSOR 3 NOTE1 NOTE1 Figure 3. State Machine Diagram Transition Notes 1. Transition to any state (including SHUTDOWN) using the CHANGE_STATE command. Alternatively, transition to SHUTDOWN using the SDN pin. 2. If a CHANGE_STATE command to the XO TUNE state is issued (even if already in the XO TUNE state), then an XO TUNE operation is carried out immediately. This enables close control of timing (fastest execution) for a subsequent TX_START command. In the TUNE state, a tune operation is carried out in the interval specified in TUNE_INTERVAL. 3. Transition to end state specified in the TX_START command or TX_STOP command. 4. If coming out of the SHUTDOWN via SMBus, an SMBus “wake-up” byte is required. This byte is discarded, and normal SMBus communication can proceed after the power on reset (ipor) is asserted to the host. State Descriptions The Si4012 has six power modes, which are summarized below. Further details on the IC configuration in these modes can be found in "5.1.5. COMMAND: CHANGE_STATE" on page 22. SHUTDOWN—Lowest current consumption; the majority of hardware blocks are powered down. STANDBY—Low power state with fast SMBus response. SENSOR—Same as STANDBY, but the battery is measured periodically. TUNE—Periodic tuning state. A tune is performed on any CHANGE_STATE to TUNE command and then periodically based on the interval defined in TUNE_INTERVAL. This provides faster transition to TX. If XO is enabled, XO will be used during tune operation. TX—Transmission state. Rev 1.1 11 Si4012 Table 8. Power Modes IVDD Response Time to TX (without XO) Response Time to TX (with XO Early Enable) 10 nA 22.2 ms 22.2 ms Circuit Blocks Mode Shutdown Digital SMBUS LDO OFF OFF SYS CLK LBD OFF OFF OFF OFF OFF OFF LC XTAL DIV PA Standby ON SLOW OFF OFF OFF OFF OFF 600 µA3 6.6 ms 6.6 ms4 Sensor ON FAST ON OFF OFF OFF OFF 610 µA3 6.6 ms 6.6 ms4 ON FAST OFF ON1 OFF ON1 ON1 Note2 370 µs — ON FAST OFF ON1 Note2 — 370 µs Tune without XO Tune with XO ON ON ON1 ON1 Notes: 1. The LC, DIV, and PA are turned on as needed during the Tune operation. 2. See the tune section from Tune Start to PA Tune in the charts below for current consumption in Tune with XO and Tune without XO. 3. The current consumption at Standby and Sensor does not include the power consumed by the internal XO circuitry. XO should be turned off with SET_PROPERTY/CHIP_CONFIG to save power if external XO is not used or if tuning is not happening soon when external XO is present. 4. The response time assumes external XO stays enabled prior to TX. 12 Rev 1.1 Si4012 Figure 4. Current Consumption with XO Figure 5. Current Consumption with XO (Upscaled between 30 and 80 ms) Rev 1.1 13 Si4012 Figure 6. Current Consumption without XO Figure 7. Current Consumption without XO (Upscaled between 30 and 80 ms) 14 Rev 1.1 Si4012 5. Command Structure The Si4012 has been designed to complete commands in the shortest time possible and to support both polled or event driven (interrupt based) modes. For longer operations, commands are implemented as launch commands. When the result of the launched command is completed, status is returned to the host via host polling or as an interrupt (if enabled). The status is obtained over the SMBus. For example, when a TX_START command is launched, the Si4012 will parse the command, check it for errors, and return the status to the host immediately; it will also start the TX process. The host can then either poll for an error or “packet sent” or receive an interrupt on nIRQ. All host commands consist of a 1-byte opcode followed by 0 or more arguments. All responses from the Si4012 consist of a 1-byte top level status followed by 0 or more data values. Command Structure: Bit 7 6 5 4 3 2 1 0 5 4 3 2 1 0 CMD ARG1 ARG2 … ARGn Response Structure: Bit STATUS 7 6 CTS Err[6:0] DATA1 DATA2 … DATAn A CTS (Clear to Send) indicates that the Si4012 has received the command and that the host can send another command. The CTS does not necessarily mean the command has been processed. The host should poll interrupt status or use interrupts (nIRQ) to get execution status for deferred operations. Err[6:0] indicates an error has occurred if it is non-zero. See the “error codes” section for a full list of available error codes. Rev 1.1 15 Si4012 GET_INT_STATUS Command S SLA WA CMD A P S SLA R A STATUS A DATA1 N P TX_STOP Command S SLA WA CMD A ARG1 Underlined items are sent from the Si4012 (slave) A ARG2 A P S S = Start W = Write (1bit) R = Read (1bit) A = Acknowledge N = Not-Acknowledge P = Stop SLA Figure 8 above demonstrates two examples using the SMBus command sequence. Rev 1.1 STATUS SLA = Slave Address (7 bits) CMD = Command opcode (8bit) ARG = Command Argument (8bit) DATA = Data Value (8bit) STATUS = Top Level Status (8bit) Figure 8. SMBus Sequence Example 16 R A N P Si4012 5.1. Commands Table 9 lists the commands available via the SMBus and described in the following sections. Table 9. Commands Available via SMBus Section Command Description 5.1.1 Get_Rev Device revision information 5.1.2 Set_Property Sets device properties 5.1.3 Get_Property Gets device properties 5.1.4 LED_CTRL LED Control 5.1.5 Change_State Configures device mode 5.1.6 Get_State Get device mode 5.1.7 TX_Start Start data transmission 5.1.8 Set_Int Enable interrupts 5.1.9 Get_Int_Status Read & clear interrupts 5.1.10 Init_FIFO Clears Tx FIFO 5.1.11 Set_FIFO Stores data in FIFO for Tx 5.1.12 TX_Stop Stops transmission 5.1.13 Get_Bat_Status Gets battery status Rev 1.1 17 Si4012 5.1.1. COMMAND: GET_REV Purpose: Return product and revision information for the device. ARG: None DATA: Product ID, Revision ID. Command: GET_REV Command 7 6 5 4 CMD 3 2 1 0 0x10 Response: 18 GET_REV Reply 7 STATUS CTS 6 5 4 3 2 Err DATA1 ProdId[31:24] DATA2 ProdId[23:16] DATA3 ProdId[15:8] DATA4 ProdId[7:0] DATA5 RevisionID_RMIDU[47:40] DATA6 RevisionID_RMIDU[39:32] DATA7 RevisionID_RMIDL[31:24] DATA8 RevisionID_RVID[23:16] DATA9 RevisionID_FWIDU[15:8] DATA10 RevisionID_FWIDL[7:0] Rev 1.1 1 0 Si4012 5.1.2. COMMAND: SET_PROPERTY Purpose: ARG: DATA: Command: Set a property common to one or more commands. These are similar to parameters for a command but are not expected to change frequently and may be controlled by the higher software layers. Setting properties may not cause the device to take immediate action, however the property will take effect once a command which uses it is issued. See the “Properties” section of this document for details on properties. PROP_ID[7:0]— Selects the property to set. DATA[n:0]—Value of the property. The length varies depending on the PROP_ID, up to 6-byte in big Endian can be specified. None SET_PROPERTY Command 7 6 5 4 3 2 1 0 CMD 0x11 ARG1 PROP_ID[7:0] ARG2 PROP_DATA1, MSB of Property 's value ARG3 PROP_DATA 2 ARG4 PROP_DATA 3 ARG5 PROP_DATA 4 ARG6 PROP_DATA5 ARG7 PROP_DATA6 Response: SET_PROPERTY Reply 7 STATUS CTS 6 5 4 3 2 1 0 Err Rev 1.1 19 Si4012 5.1.3. COMMAND: GET_PROPERTY Purpose: ARG: DATA: Return the value of a specified property. See "5.2. Properties" on page 32 for details on properties. PROP_ID[7:0]—Selects the property to retrieve. DATA[n:0] —Value of the specified property, the length varies depending on the PROP_ID, up to 6 bytes Command: GET_PROPERTY Command 7 6 5 4 3 2 CMD 0x12 ARG1 PROP_ID[7:0] 1 0 1 0 Response: 20 GET_PROPERTY Reply 7 STATUS CTS 6 5 4 3 2 Err DATA1 PROP_DATA1, MSB of Property's value DATA2 PROP_DATA 2 DATA3 PROP_DATA 3 DATA4 PROP_DATA 4 DATA5 PROP_DATA5 DATA6 PROP_DATA6 Rev 1.1 Si4012 5.1.4. COMMAND: LED_CTRL Purpose:Turn on/off LED if LED driver is enabled. ARG: LedOn—If LED driver is enabled, turn LED on if set, otherwise, turn LED off. If LED driver is not enabled, LedOn is ignored if set. DATA: None Command: LED_CTRL Command 7 6 5 4 CMD 3 2 1 0 0x13 ARG1 LedOn Response: LED_CTRL Reply 7 STATUS CTS 6 5 4 3 2 1 0 Err Notes: If LEDOn is set, the Si4012 checks the LedIntensity setting set by the host in SET_PROPERTY/LED_INTENSITY. If the LedIntensity is 0, LED driver will be disabled. Err is set to 0x0A to report this condition. Rev 1.1 21 Si4012 5.1.5. COMMAND: CHANGE_STATE Change state to IDLE or SHUTDOWN. The device will change to the specified state at the earliest time possible. If changing into IDLE state, ARG2 specifies the idle mode. Purpose: Table 10. IVDD Response Time to TX (without XO) Response Time to TX (with XO Early Enable) 15 nA 22.2 ms 22.2 ms Circuit Blocks Mode Shutdown Digital SMBUS LDO OFF OFF SYS CLK LBD OFF OFF OFF OFF OFF OFF LC XTAL DIV PA Standby ON SLOW OFF OFF OFF OFF OFF 600 µA3 6.6 ms 6.6 ms4 Sensor ON FAST ON OFF OFF OFF OFF 610 µA3 6.6 ms 6.6 ms4 ON FAST OFF ON1 OFF ON1 ON1 Note2 370 µs — ON FAST OFF ON1 Note2 — 370 µs Tune without XO ON Tune with XO ON ON1 ON1 Notes: 1. The LC, DIV and PA are turned on as needed during the Tune operation. 2. See the tune section from Tune Start to PA Tune in the charts below for current consumption in Tune with XO and Tune without XO. 3. The current consumption at Standby and Sensor does not include the power consumed by the internal XO circuitry. XO should be turned off with SET_PROPERTY/CHIP_CONFIG to save power if external XO is not used or if tuning is not happening soon when external XO is present. 4. The response time assumes external XO stays enabled prior to TX. ARG: DATA: 22 State[1:0]—state to transition to. 00 IDLE – Go to idle mode state using the idle mode specified. 01 SHUTDOWN – Go to shutdown state. 10–11 – Reserved. IdleMode[2:0]—IDLE mode if changing to idle state. 000 Standby – Low Power State 001 Sensor – Enable Low Battery Detector 010 Tune – Periodic tuning 011–111 – Reserved None Rev 1.1 Si4012 Command: CHANGE_STATE Command 7 6 5 4 3 CMD 2 1 0 0x60 ARG1 State[1:0] ARG2 Response:: IdleMode[2:0] None if changing to SHUTDOWN, otherwise CHANGE_STATE Reply 7 STATUS CTS 6 5 4 3 2 1 0 Err Notes: 1. Changing state among different idle modes is allowed. 2. State can also be changed via TX_START/TX_STOP. 3. An alternative way to transition to SHUTDOWN is by setting SDN pin to high. 4. SMBus activity or setting SDN pin to low will take the device out of shut down state. Rev 1.1 23 Si4012 5.1.6. COMMAND: GET_STATE Get chip state and status. None Purpose: ARG: DATA: State[1:0]—current state 00 Idle 01 Reserved 10 TX AutoTX—current AutoTX setting IdleMode[2:0]. If State is Idle 000 Standby – Low power state 001 Sensor – Enable Low Battery Detector 010 Tune – Periodic tuning DTMod[1:0] if State is TX 00 – FIFO Mode 01 – CW Mode 10 – PN9-0 Mode 11 – PN9-1 Mode ActTxPktSize—actual packet sent in the last transmission PrevError —error code if error occurred in the previous operation Command: GET_STATE Command 7 6 5 4 CMD 3 2 1 0 0x61 Response: GET_STATE 7 STATUS CTS 6 5 4 2 1 0 Err DATA1 AutoTX DATA2 24 3 State[1:0] IdleMode[2:0]/DTMod[1:0] DATA3 ActTxPktSize[15:8] DATA4 ActTxPktSize[7:0] DATA5 PrevError Rev 1.1 Si4012 5.1.7. COMMAND: TX_START Start transmission and go to a designated state after the packet is transmitted. This is an asynchronous operation. Transmission may not have been started when response is sent back the host. Purpose: ARG: Packet Size[15:0] to be transmitted State to transition to when transmission is completed. AutoTX—Enable/Disable FIFO Auto-TX 1: Auto-Transmit Enabled. Transmission will start when the FIFO level reaches the auto transmit threshold specified in ffautotxthr in FIFO_THRESHOLD. If ffautotxthr=0, transmission will start immediately. 0:Auto-Transmit Disabled. Transmit will start immediately until the data specified in the PacketSize is transmitted, or all the data in the FIFO is exhausted, whichever occurs first. If the FIFO becomes empty before the specified packet length is transmitted a FIFO underflow error will occur. State[1:0]—State to transition to when transmission is completed. 00: IDLE—Go to idle state when the packet transmission completes based on the idle mode. 01: SHUTDOWN—Go to shutdown state when the packet transmission completes. 10–11: Reserved. IdleMode[2:0] if State is Idle; DTmod[1:0] if State is TX. Idle Mode 000 Standby – Low power state 001 Sensor – Enable Low Battery Detector 010 Tune – Periodic tuning DTMod[1:0] 00 01 DATA: Command: – FIFO Mode – CW Mode 10 – PN9-0 Mode 11 – PN9-1 Mode Current data size in the FIFO when TX_START is received. TX_START Command 7 6 5 4 3 2 CMD 0x62 ARG1 PacketSize[15:8] ARG2 PacketSize[7:0] ARG3 AutoTX ARG4 1 0 State[1:0] IdleMode[2:0] ARG5 DTMod[1:0] Rev 1.1 25 Si4012 Response: TX_START Reply STATUS DATA1 Notes: 7 6 5 4 CTS 3 2 1 0 Err ActualDataSize[7:0] Si4012 allows larger packet sizes than the FIFO. It also allows the packet size to be greater than the data available in the FIFO. If the packet size is less than the data stored in the FIFO, the data specified in packet size will be transmitted in one transmission leaving leftover data in the FIFO. The size to be transmitted will be specified in the DATA field. If the packet size is larger than the data stored in the FIFO size, when TX_START is received, all the data in the FIFO will be transmitted. The size of the data currently available in the FIFO will be specified in the DATA field. If auto transmit is enabled, the Si4012 will automatically transmit data when the TX FIFO level reaches the auto transmit level dictated by ffautotxthr without another explicit TX_START until the data specified in PacketSize is all transmitted. An interrupt is triggered with pksent set in the interrupt status. AutoTX state will be cleared when packet is successfully transmitted or FIFO underflow has happened. If auto transmit is not enabled, the Si4012 will start transmitting what’s available in the FIFO until FIFO becomes empty. The host is responsible for keeping FIFO from underflow by supplying the balance of the data needed for the packet size. If the packet size equals to the data stored in the FIFO size, all the data in the FIFO will be transmitted, ActualDataSize will be equal to the packet size. The host should poll ipksent using GET_INT_STATUS to check when the packet has been sent, or monitor the pksent interrupt. 26 Rev 1.1 Si4012 5.1.8. COMMAND: SET_INT Purpose: Enable interrupts. ARG: enffunder—Enable FIFO Underflow entxffafull—Enable TX FIFO Almost Full entxffaem—Enable TX FIFO Almost Empty enffover—Enable FIFO Overflow enpksent—Enable Packet Sent enlbd—Enable Low Battery Detect DATA: None Command: SET_INT Command 7 6 5 4 CMD ARG1 3 2 1 0 0x63 enffunder entxffafull entxffaem enffover enpksent enlbd entune reserved 6 5 4 3 2 1 0 Response: SET_INT Reply 7 STATUS CTS Err Rev 1.1 27 Si4012 5.1.9. COMMAND: GET_INT_STATUS Read the interrupt status and clear interrupts. None Purpose: ARG: DATA: iffunder—FIFO Underflow itxffafull—TX FIFO Almost Full itxffaem—TX FIFO Almost Empty iffover—FIFO Overflow ipksent—Packet Sent ilbd—Low Battery Detect itune—tune complete ipor—Power On Reset Command: GET_INT_STATUS Command 7 6 5 CMD 4 3 2 1 0 3 2 1 0 itune ipor 0x64 Response: GET_INT_STATUS Reply 7 STATUS CTS DATA1 iffunder 6 5 4 Err itxffafull itxffaem iffover ipksent ilbd Notes: Calling the GET_INT_STATUS command will clear all interrupts and reset the nIRQ pin. Therefore, the host must note any interrupt bits that are set and take the necessary actions to service these interrupts. TX FIFO Almost Full and TX FIFO Almost Empty Interrupts These interrupts are triggered upon transition at the respective thresholds. Therefore, if an interrupt is generated for FIFO Almost Empty and then cleared by a call to GET_INT_STATUS, another interrupt will NOT be generated if the FIFO remains below the Almost Empty threshold. The FIFO must go above the threshold and then fall back to the threshold before another Almost Empty threshold is generated and sent to the host. Low Battery Detect (LBD) Interrupt The LBD is cleared when the host calls GET_INT_STATUS. The Si4012 regenerates lbd interrupts periodically when the LBD timer expires. 28 Rev 1.1 Si4012 5.1.10. COMMAND: INIT_FIFO Purpose: Clear the TX FIFO by clearing the FIFO with 0s and initializing the FIFO head and tail pointer ARG: None DATA: None Command: INIT_FIFO Command 7 6 5 4 CMD 3 2 1 0 0x65 Response: INIT_FIFO Reply 7 STATUS CTS 6 5 4 3 2 1 0 Err 5.1.11. COMMAND: SET_FIFO Purpose: Store data from the command interface into FIFO for transmission. ARG: Up to 255 bytes DATA: None Command: SET_FIFO Command 7 6 5 4 3 2 CMD 0x66 ARG1 FIFO_DATA1[7:0] ARG2 FIFO_DATA2[7:0] 1 0 … ARGn FIFO_DATAn[7:0] Response: SET_FIFO Reply 7 STATUS CTS 6 5 4 3 2 1 0 Err If ARG exceeds the FIFO size of 255 bytes, Err is set to 0x08 (Too many arguments). The Si4012 raises the ‘FIFO Almost Full’ or ‘FIFO Almost Empty’ interrupt when appropriate. If auto transmit is enabled and the FIFO level is above the auto transmit threshold, the Si4012 will start transmit automatically. Rev 1.1 29 Si4012 5.1.12. COMMAND: TX_STOP Purpose: Stop transmission and go to designated state (this command can also be used to abort existing transmissions) ARG: State[1:0]—State to transition to when transmission is stopped. 00 IDLE – Go to idle state when the packet transmission is stopped based on the idle mode. 01 SHUTDOWN – Go to shutdown state when the packet transmission is stopped. 10-11 – Reserved. IdleMode[2:0] —IDLE mode if changing to idle state. 000 Standby – Low power state 001 Sensor – Enable Low Battery Detector 010 Tune – Periodic tuning 011–111 – Reserved DATA: None Command: TX_STOP Command 7 6 5 4 3 CMD 2 1 0x67 ARG1 State[1:0] ARG2 Response: 30 0 IdleMode[2:0] None if changing to SHUTDOWN, otherwise TX_STOP Reply 7 STATUS CTS 6 5 4 3 2 1 Err Rev 1.1 0 Si4012 5.1.13. COMMAND: GET_BAT_STATUS Purpose: Get the battery status such as current VDD voltage. ARG: Load Option—0: Battery voltage is measured immediately without any load. >0: battery voltage is measured after major power hungry parts of the device are temporarily turned on. These parts are turned off when measurement is done after LoadWaitTime x 17 µs of wait time. DATA: BTV[15:0]—Battery voltage in mV Command: GET_BAT_STATUS Command 7 6 5 4 3 CMD 0x68 ARG Load/Wait Time 2 1 0 Response: GET_BAT_STATUS Reply 7 STATUS CTS 6 5 4 3 2 1 0 Err DATA1 BTV[15:8] DATA2 BTV[7:0] Notes: 1. If tuning is in progress when this API is received, Err is set to 0x11 (Device busy). 2. In sensor mode, Si4012 reads battery voltage periodically with no load based on the interval set in SET_PROPERTY/LBD_CONFIG. Rev 1.1 31 Si4012 5.2. Properties 5.2.1. Properties Summary Section Property ID Property Description 5.2.2 0x10 CHIP_CONFIG 5.2.3 0x11 LED_INTENSITY 5.2.4 0x20 5.2.5 0x21 TUNE_INTERVAL 5.2.6 0x30 FIFO_THRESHOLD FIFO almost full, almost empty and auto transmit threshold 5.2.7 0x31 BITRATE_CONFIG Data rate and ramp rate if OOK 5.2.8 0x40 TX_FREQ Carrier frequency for transmission if OOK, upper frequency for transmission if FSK 5.2.9 0x41 LBD_CONFIG Low battery voltage threshold that triggers interrupt, battery voltage sampling interval 5.2.10 0x50 XO_CONFIG XO frequency and low capacitance control 5.2.11 0x60 PA_CONFIG PA maximum current driver, PA level, cap, alpha and beta steps FSK Dev polarity, LSB first, XO LED current drive strength MODULATION_FSKDEV MOD type and FSK deviation if FSK Tuning interval in seconds The format table in this section applies to the ARG field of SET_PROPERTY after PROP_ID and DATA field of GET_PROPERTY. I.e., PROP_ID corresponds to ARG1, PROP_DATA1 corresponds to ARG2 or DATA1, PROP_DATA2 corresponds to ARG3 or DATA 2, etc. Default is the value of a property the Si4012 defaults to if the host does not set the property via SET_PROPERTY. Fields correspond to the PROP_DATA. 32 Rev 1.1 Si4012 5.2.2. PROPERTY: CHIP_CONFIG Purpose: Property: Default: Fields: Select FSK deviation polarity, LSB first and external crystal. 0x10 0x08 FskDevPola—FSK deviation polarity. 0: 1: +deviation when modulation data is 1 and –dev for Din = 0 +dev for Din = 0 and –dev for Din = 1 LsbFirst—When set, LSB is transmitted first. Otherwise, MSB is transmitted first. UseXo—Use external crystal if set Format: CHIP_CONFIG Property 7 6 5 4 PROP_ID 3 2 UseXo LsbFirst 1 0 0x10 PROP_DATA1 FskDevPola Note: If the crystal is not populated on the board, there will still be a 1.4 mA current draw penalty for the XO circuitry on the Si4012. The host should send SET_PROPERTY/CHIP_CONFIG with bit 3 cleared to turn off the XO circuitry. Rev 1.1 33 Si4012 5.2.3. PROPERTY: LED_INTENSITY Purpose: Property: Default: Fields: LED current drive strength 0x11 0x00 LedIntensity [1:0]—LED intensity 00: LED off 01: 0.37 mA 10: 0.60 mA 11: 0.97 mA. Format: LED_INTENSITY Property 7 6 5 4 PROP_ID 3 2 1 0 0x11 PROP_DATA1 LedIntensity[1:0] 5.2.4. PROPERTY: MODULATION_FSKDEV Modulation type and FSK deviation. 0x20 0x013F Purpose: Property: Default: Fields: modutype—Modulation type, default 1. 0: 1: OOK FSK biFskDev[6:0] –biFSKDev if FSK, default 63. Format: MODULATION_FSKDEV Property 7 6 5 PROP_ID 4 3 2 1 0 0x20 PROP_DATA1 ModuType PROP_DATA2 biFskDev[6:0] Note: If SET_PROPERTY\DATA_RATE is sent and data rate is set to a value above 500, but modulation is set to OOK, Err will be set in the response with ‘Data rate out of range’ error code. The biFSKDev parameter is attained either via the WDS Chip Configurator utility or by using the Si4012 calculation spreadsheet. 34 Rev 1.1 Si4012 5.2.5. PROPERTY: TUNE_INTERVAL Tune interval used for periodic tuning. 0x21 0x000A Purpose: Property: Default: Fields: TuningItv[15:0]—tuning interval in seconds Format: TUNE_INTERVAL Property 7 6 5 4 3 2 PROP_ID 0x21 PROP_DATA1 TuningItv[15:8] PROP_DATA2 TuningItv[7:0] 1 0 Note: The tuning interval specifies the frequency in which the device performs periodic tuning in tune state and in CW Mode. In CW or PN9 mode, if TuningItv is 0, no tuning will be performed. In FIFO mode, if Si4012 is in tune state but TuningItv is set to 0 by the host, tuning will be performed every 10 seconds. 5.2.6. PROPERTY: FIFO_THRESHOLD FIFO threshold settings—FIFO Almost Empty, FIFO Almost Full and auto transmit level. 0x30 Purpose: Property: Fields: ffafullthr[7:0]—FIFO Almost Full Threshold in bytes, default 0xF0 ffaemthr[7:0]—FIFO Almost Empty Threshold in bytes, default 0x10 ffautotxthr[7:0]—FIFO Threshold controlling when to start auto transmit, default 0x20 bytes. Format: FIFO_THRESHOLD Property 7 6 5 4 3 PROP_HI 0x30 PROP_DATA1 ffafullthr[7:0] PROP_DATA2 ffaemthr[7:0] PROP_DATA3 ffautotxthr[7:0] 2 1 0 Notes:Ffautotxthr applies only when auto transmit is enabled. If ffautotxthr is set to 0, the Si4012 transmits whenever data becomes available in the FIFO. This field is ignored when auto transmit is disabled. Rev 1.1 35 Si4012 5.2.7. PROPERTY: BITRATE_CONFIG Purpose: Property: Fields: Data rate and ramp rate if OOK. 0x31 DataRate[9:0]—Data rate in units of 100 bps, ranging from 1 to 1000 for FSK and 1 to 500 for OOK. Default 0x60. RampRate[3:0]—Ramp rate in µs. 1, 2, 4, or 8 is supported. Default 2. Format: DATA_RATE Property 7 6 5 PROP_ID 4 3 2 1 0 0x31 PROP_DATA1 DataRate[9:8] PROP_DATA2 DataRate[7:0] PROP_DATA3 RampRate[3:0] Notes:The data rate won’t take into effect until transmission time. If SET_PROPERTY\MODULATION_CONFIG is sent and modulation is set to OOK by the host, but DataRate is set to > 500, Err will be set in the response. The default modulation type is FSK. If SET_PROPERTY \MODULATION_FSKDEV is not sent, any value above 1000 will result in Err being set in the response—0x0D (Data Rate out of Range). RampRate is ignored if ModuType in MODULATION_FSKDEV is FSK. In OOK mode, any value except 1, 2, 4, or 8 will result in Err 0x04—bad parameter in ARG4. In FSK mode, the minimum data rate is 200 bps. The ramp rate parameter dictates the minimum data rate. The Si4012 will set Err to 0x10 (data rate not supported) if the value is smaller than the minimum data rate on the specified Ramp Rate. 36 Ramp Rate 1 2 4 8 Min Data Rate (bps) 300 200 200 100 Rev 1.1 Si4012 5.2.8. PROPERTY: TX_FREQ Purpose: Property: Default: Fields: Carrier frequency for transmission if OOK, upper frequency if FSK and center frequency in CW mode. 0x40 0x19ddc7c8 for 433.965 MHz (433.92 MHz+90 kHz/2) TxFreq[31:0]—Ranging from 27 MHz to 960 MHz. OOK: Carrier Frequency (Hz) FSK: Upper Frequency (Hz) CW Mode: Center Frequency (Hz) Format: TX_FREQ Property 7 6 5 4 3 PROP_ID 0x40 PROP_DATA1 TxFreq[31:24] PROP_DATA2 TxFreq[23:16] PROP_DATA3 TxFreq[15:8] PROP_DATA4 TxFreq[7:0] 2 1 0 Note: Frequency out of range in SET_PROPERTY will result in Err = 0x0E (Frequency out of Range) in the response. Rev 1.1 37 Si4012 5.2.9. PROPERTY: LBD_CONFIG Purpose: Property: Fields: Default: Format: Battery voltage threshold used to determine when to raise Low Battery Detector Interrupt, battery voltage sampling interval. 0x41 LbdThr[15:0]—Battery voltage threshold in mV. Default 0x09C4 or 2500 mV. SampleInterval[15:0]—Battery voltage sampling interval in seconds. 0x3C or 60 seconds. LBD_CONFIG Property 38 7 6 5 4 3 PROP_ID 0x41 PROP_DATA1 LbdThr[15:8] PROP_DATA2 LbdThr[7:0] PROP_DATA3 SampleInterval[15:8] PROP_DATA4 SampleInterval[7:0] Rev 1.1 2 1 0 Si4012 5.2.10. PROPERTY: XO_CONFIG Purpose: Property: Fields: Frequency of external crystal and low cap configuration if using external crystal. 0x50 XoFreq[31:0]—Crystal frequency, unit in Hz. Default 0x00989680 or 10 MHz. XoLowCap —This bit should be set for crystal that require less than 14 pF of Cload capacitance. Default 0. See note below. Format: XO_CONFIG Property 7 6 5 4 3 2 PROP_ID 0x50 PROP_DATA1 XoFreq[31:24] PROP_DATA2 XoFreq[23:16] PROP_DATA3 XoFreq[15:8] PROP_DATA4 XoFreq[7:0] PROP_DATA5 1 0 XoLowCap Note: For correct operation of the oscillator, the user must do the following: Check the crystal data sheet for the “Cload” capacitor value that should be placed across the crystal’s terminals to oscillate at the correct frequency If Cload > 14 pF, XO_LOWCAP bit of the XO_CONFIG property has to be set to 0. In this case, the input capacitance of the XTAL pin of the Si4012 is approximately 5.5 pF, so a (Cload – 5.5)pF capacitor should be placed externally across the crystal terminals. If Cload < 14 pF XO_LOWCAP bit of the XO_CONFIG property have to be set to 1. In this case, the input capacitance of the XTAL pin of the Si4012 is approximately 3 pF, so the external capacitor placed across the crystal has to be (Cload – 3)pF. Rev 1.1 39 Si4012 5.2.11. PROPERTY: PA_CONFIG Purpose: Property: Fields: PA max current driver, PA level, PA cap, alpha steps and beta steps. 0x60 PaMaxDrv—Allows for maximum current drive, calculated from Spreadsheet. Default 1. PaLevel[6:0]—PA level calculated from Spreadsheet. Default 70. PaCap[8:0]—PA cap. Default 128. fAlphaSteps[7:0]—PA Alpha steps, default 125 fBetaSteps[7:0]—PA Beta steps, default 127 Format: PA_CONFIG Property 7 6 5 4 3 PROP_ID 2 1 0 0x60 PROP_DATA1 PaMaxDrv PROP_DATA2 PaLevel[6:0] PROP_DATA3 PaCap[8] PROP_DATA4 PaCap[7:0] PROP_DATA5 fAlphaSteps[7:0] PROP_DATA6 fBetaSteps[7:0] Note: fAlphaSteps and fBetaSteps should be calculated by the Si4012 calculator spreadsheet. See AN564 for details. fAlphaSteps specifies the number of steps advancing from the minimum supported value –0.075 with 0.0006 per step. The maximum fAlpha is +0.075. fAlpha is computed using the formula below: Alpha + 0.075 f ALPHASTEPS = ------------------------------------------0.0006 fBetaSteps specifies the number of steps advancing from the minimum supported value –0.254 with 0.002 per step. The maximum fBeta is +0.254. fBeta is computed using the formula below: Beta + 0.254 f BETASTEPS = --------------------------------------0.002 40 Rev 1.1 Si4012 5.3. Error Codes If the Si4012 detects an error upon receipt of a command, such as a bad parameter, the error is reported in the Response. If the Si4012 detects an error while executing a command after the response has sent back to the host, the error is stored. The host can retrieve an actual error code via the GET_STATE command. The table below provides the list of error codes. Error Code Description 0x7f Bad parameter in CMD 0x01 Bad parameter in ARG1 0x02 Bad parameter in ARG2 0x03 Bad parameter in ARG3 0x04 Bad parameter in ARG4 0x05 Bad parameter in ARG5 0x06 Bad parameter in ARG6 0x07 Bad parameter in ARG7 0x08 Too many arguments 0x09 Too few arguments 0x0A LED on requested but LED driver is disabled 0x0B State change failed 0x0C LBD is disabled 0x0D Data rate is out of range 0x0E Frequency out of range 0x0F Internal error 0x10 Data rate not supported 0x11 Device busy 0x12 FIFO overflow 0x13 FIFO underflow Rev 1.1 41 Si4012 6. Pin Descriptions 42 XTAL 1 10 SDA GND 2 9 SCL TXM 3 8 SDN TXP 4 7 nIRQ VDD 5 6 LED Si4012 Pin Number Name Description 1 XTAL Crystal input 2 GND Ground 3,4 TXM, TXP 5 VDD Supply input 9 LED LED driver output 7 nIRQ Interrupt status output, active low, open collector 8 SDN Shutdown input pin, active high 9 SCL SMB (SMBus) Clock input/output, open collector 10 SDA SMB (SMBus) Data input/output, open collector RF transmitter differential outputs Rev 1.1 Si4012 7. Ordering Guide Part Number* Description Package Type Operating Temperature Si4012-C1001GT Crystal-less RF Transmitter MSOP-10 –40 to 85 °C Si4012-C1001AT MSOP-10 –40 to 85 °C Crystal-less RF Transmitter (Automotive Grade) *Note: Add an “(R)” at the end of the device part number to denote tape and reel option. Rev 1.1 43 Si4012 8. Package Outline Figure 9 illustrates the package details for the Si4012. Table 11 lists the values for the dimensions shown in the illustration. Figure 9. 10-Pin MSOP Package Table 11. Package Dimensions Symbol A A1 A2 b c D E E1 Millimeters Symbol Min Nom Max — 0.00 0.75 0.17 0.08 — — 0.85 — — 3.00 BSC 4.90 BSC 3.00 BSC 1.10 0.15 0.95 0.33 0.23 Millimeters Min e L L2 q aaa bbb ccc ddd 0.40 0° — — — — Nom 0.50 BSC 0.60 0.25 BSC — — — — — Notes: 1. All dimensions are shown in millimeters (mm). 2. Dimensioning and tolerancing per ASME Y14.5M-1994. 3. This drawing conforms to JEDEC Outline MO-187, Variation “BA.” 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 44 Rev 1.1 Max 0.80 8° 0.20 0.25 0.10 0.08 Si4012 9. Land Pattern: 10-Pin MSOP Figure 10 shows the recommended land pattern details for the Si4012 in a 10-Pin MSOP package. Table 12 lists the values for the dimensions shown in the illustration. Figure 10. 10-Pin MSOP Land Pattern Rev 1.1 45 Si4012 Table 12. 10-Pin MSOP Land Pattern Dimensions Dimension MIN MAX C1 4.40 REF E 0.50 BSC G1 3.00 — X1 — 0.30 Y1 Z1 1.40 REF — 5.80 Notes: General 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ASME Y14.5M-1994. 3. This Land Pattern Design is based on the IPC-7351 guidelines. 4. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm. Solder Mask Design 1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 µm minimum, all the way around the pad. Stencil Design 1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 2. The stencil thickness should be 0.125 mm (5 mils). 3. The ratio of stencil aperture to land pad size should be 1:1. Card Assembly 1. A No-Clean, Type-3 solder paste is recommended. 2. The recommended card reflow profile is per the JEDEC/IPC J-STD020 specification for Small Body Components. 46 Rev 1.1 Si4012 10. Top Marking: 10-Pin MSOP Figure 11. 10-Pin MSOP Top Marking Table 13. Top Marking Explanation Line 1 Marking: Base Part Number Ordering Options (See "7. Ordering Guide" on page 43). 12 = Si4012 C1 = Revision Line 2 Marking: TTTT = Manufacturing Code Manufacturing code from assembly house. Line 3 Marking: Y = Year WW = Workweek Assigned by assembly subcontractor. Corresponds to the year and workweek of the mold date. Rev 1.1 47 Si4012 DOCUMENT CHANGE LIST Revision 0.1 to Revision 1.0 Added API. Updated "1. Electrical Specifications" on page 4. Revision 1.0 to Revision 1.1 48 Added automotive grade version to ordering guide. Rev 1.1 Si4012 NOTES: Rev 1.1 49 Si4012 CONTACT INFORMATION Silicon Laboratories Inc. 400 West Cesar Chavez Austin, TX 78701 Tel: 1+(512) 416-8500 Fax: 1+(512) 416-9669 Toll Free: 1+(877) 444-3032 Please visit the Silicon Labs Technical Support web page: https://www.silabs.com/support/pages/contacttechnicalsupport.aspx and register to submit a technical support request. Patent Notice Silicon Labs invests in research and development to help our customers differentiate in the market with innovative low-power, small size, analogintensive mixed-signal solutions. Silicon Labs' extensive patent portfolio is a testament to our unique approach and world-class engineering team. The information in this document is believed to be accurate in all respects at the time of publication but is subject to change without notice. Silicon Laboratories assumes no responsibility for errors and omissions, and disclaims responsibility for any consequences resulting from the use of information included herein. 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