ADVANCE DATA SHEET SKY77166 Power Amplifier Module for CDMA2000 (450-460 MHz) Applications Description • Digital cellular (CDMA2000) The SKY77166 Power Amplifier Module (PAM) is a fully matched 10-pad surface mount module developed for Code Division Multiple Access (CDMA2000) handsets and Wireless Local Loop applications. This small and efficient module packs full coverage of the 450–460 MHz bandwidth into a single compact package. The SKY77166 meets the stringent CDMA2000 linearity requirements to and exceeding 29 dBm output power. • Wireless Local Loop (WLL) Features • Low voltage positive bias supply: 3.2 V to 4.2 V • Good linearity • High efficiency across wide dynamic range • Dual-mode operation • 10-pad package: 4 x 4 x 1.15 mm • Power down control • Low power state control • CDMA2000 The single Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC) contains all active circuitry within the module, which includes onboard bias circuitry as well as input and interstage matching circuits. Output match into a 50-ohm load is realized off-chip within the module package to optimize efficiency and power performance. This device is manufactured with Skyworks’ GaAs Heterojunction Bipolar Transistor (HBT) process that provides for all positive voltage DC supply operation while maintaining high efficiency and good linearity. Primary bias to the SKY77166 is supplied directly from a three-cell Ni-Cd, a single-cell Li-Ion, or other suitable battery with an output in the 3.2 to 4.2 volt range. Power down is accomplished by setting the voltage on the low current reference pin to zero volts. No external supply side switch is needed as typical “off” leakage is a few microamperes with full primary voltage supplied from the battery. Skyworks offers lead (Pb)-free, RoHS (European Parliament for the Restriction of Hazardous Substances) -compliant packaging. Figure 1. Functional Block Diagram Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 200466A • Skyworks Proprietary and Confidential information. • Products and product information are subject to change without notice. • December 6, 2007 1 ADVANCE DATA SHEET SKY77166 POWER AMPLIFIER MODULE FOR CDMA2000 (450-460 MHZ) Electrical Target Specifications The following tables list the electrical characteristics of the SKY77166 Power Amplifier. Table 1 lists the absolute maximum ratings, while Table 2 shows the recommended operating conditions to achieve the performance characteristics listed in Table 4. Table 3 presents a truth table for the power settings. Table 1. Absolute Maximum Rating 1 Parameter Symbol Minimum Nominal Maximum Unit RF Input Power PIN — 0.0 6.0 dBm Supply Voltage VCC — 3.4 6.0 Volts Reference Voltage VREF — 2.85 2.95 Volts Operating TC –30 +25 +110 Storage –55 — +125 Case Temperature 2 TSTG 1 No damage assuming only one parameter is set at limit at a time with all other parameters set at nominal value. 2 Case Temperature refers to the temperature of the case measured at the GROUND PAD at the underside of the package. °C Table 2. Recommended Operating Conditions Parameter Symbol Minimum Nominal Maximum Unit Supply Voltage VCC 3.2 3.4 4.2 Volt Reference Voltage VREF 2.80 2.85 2.95 Volts HIGH Control voltage VCONT LOW 2.5 — 3.0 0.0 — 0.5 Volt Operating Frequency FO 450.0 455.0 460.0 MHz Case Temperature 1 TC –30 +25 +85 °C 1 Case Temperature (TC) refers to the temperature of the case measured at the GROUND PAD at the underside of the package. Table 3. Power Range Truth Table Power Mode VREF VCONT Range High Power 2.85 V 0.0 V – 0.5 V 16 dBm – 29 dBm Low Power 2.85 V 2.5 V – 3.0 V ≤ 16 dBm Shut Down 0.0 V 0.0 V — Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 2 December 6, 2007 • Skyworks Proprietary and Confidential information. • Products and product information are subject to change without notice. • 200466A SKY77166 POWER AMPLIFIER MODULE FOR CDMA2000 (450-460 MHZ) ADVANCE DATA SHEET Table 4. Electrical Specifications for CDMA2000 Nominal Operating Conditions 1 Characteristics Symbol Typical Maximum Unit VCONT ≥ 2.5 V PO = 16 dBm 24.5 26.5 28.2 GHIGH VCONT ≤ 0.5 V PO = 29 dBm 29.0 30.0 32.0 PAELOW VCONT ≥ 2.5 V PO = 16 dBm 6.5 7.0 — PAEHIGH VCONT ≤ 0.5 V PO = 29 dBm 33.0 37.0 — ICC_LOW PO = 16 dBm — 165 180 ICC_HIGH PO = 29 dBm — 630 695 IQ_LOW VCONT ≥ 2.5 V — 75 — IQ_HIGH VCONT ≤ 0.5 V — 95 — — 0.75 1.0 mA Power Added Efficiency Quiescent current Minimum GLOW Gain conditions Total Supply current Condition % mA mA Reference current IREF Control current ICONT VCONT = 2.5 V — 0.95 1.2 mA Total Supply current in Power-down Mode IPD VCC = 3.4 V VREF = 0 V — 2.0 4.5 μA — –50.0 –47.5 — –61.0 –60.0 — –50.0 –45.0 — –60.0 –55.0 Adjacent Channel Power 2,3,4 Harmonic Suppression 885 kHz offset ACP1 1.98 MHz offset ACP2 Second f02 Third f03 — dB PO ≤ 29 dBm PO ≤ 29 dBm PO ≤ 29 dBm dBc dBc Noise Power in RX Band 460-470 MHz RXBN — –130 –128 dBm/Hz Noise Figure NF — — 4.0 5.5 dB Input Voltage Standing Wave Ratio (VSWR) VSWR — — 1.6:1 1.8:1 — Stability (Spurious output) S 5:1 VSWR All phases — — –70 dBc Ruggedness 5 Ru PO ≤ 29 dBm 10:1 — — VSWR 1 Unless specified otherwise: VCC = +3.4 V VREF = +2.85 V Temp = +25 °C 2 ACP is specified per CDMA2000 as the ratio of the total in-band power (1.23 MHz) to adjacent power in a 30 kHz BW. 3 CDMA2000 is configured as FCH = 9600 or PCH = –3.75 dB, DCCH = 9600, –7.0 dB, SCH = 9600, SCH = 9600, –5.36 dB, and Peak-to-Average Ratio (CCDF = 1%) = 4.5 dB. 4 For operation at VCC = 3.2 V, POUT is derated by 0.25 dB 5 All phases, time = 10 seconds. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 200466A • Skyworks Proprietary and Confidential information. • Products and product information are subject to change without notice. • December 6, 2007 3 ADVANCE DATA SHEET SKY77166 POWER AMPLIFIER MODULE FOR CDMA2000 (450-460 MHZ) Evaluation Board Description The evaluation board is a platform for testing and interfacing design circuitry. To accommodate the interface testing of the SKY77166, the evaluation board schematic and diagram are included for preliminary analysis and design. Figure 2 shows the basic schematic of the board for the 450 MHz to 460 MHz range and Figure 3 is the assembly diagram. Figure 2. Evaluation Board Schematic Figure 3. Evaluation Board Assembly Diagram Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 4 December 6, 2007 • Skyworks Proprietary and Confidential information. • Products and product information are subject to change without notice. • 200466A SKY77166 POWER AMPLIFIER MODULE FOR CDMA2000 (450-460 MHZ) ADVANCE DATA SHEET Package Dimensions and Pad Descriptions The SKY77166 is a multi-layer laminate base, overmold encapsulated modular package designed for surface mount solder attachment to a printed circuit board. Figure 4 is a mechanical drawing of the pad layout for this package. Figure 6 shows each pad function and the pad numbering convention, which starts with pad 1 in the upper left and increments counter-clockwise around the package. Figure 7 illustrates typical case markings. Figure 4. Dimensional Drawing – 4 x 4 x 1.15 mm, 10-Pad Package – SKY77166 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 200466A • Skyworks Proprietary and Confidential information. • Products and product information are subject to change without notice. • December 6, 2007 5 ADVANCE DATA SHEET SKY77166 POWER AMPLIFIER MODULE FOR CDMA2000 (450-460 MHZ) Figure 5. Phone PCB Layout Footprint for 4 x 4 mm, 10-Pad Package – SKY77166 Specific Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 6 December 6, 2007 • Skyworks Proprietary and Confidential information. • Products and product information are subject to change without notice. • 200466A SKY77166 POWER AMPLIFIER MODULE FOR CDMA2000 (450-460 MHZ) ADVANCE DATA SHEET procedures recommended by Skyworks, please refer to Skyworks Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752. Additional information on standard SMT reflow profiles can also be found in the JEDEC Standard J-STD-020. Production quantities of this product are shipped in the standard tape-and-reel format. For packaging details, refer to Skyworks Application Note: Tape and Reel Information – RF Modules, Document Number 101568. Electrostatic Discharge Sensitivity Figure 6. Pad Names and Configuration (Top View) The SKY77166 is a Class 2 device. Figure 8 lists the Electrostatic Discharge (ESD) immunity level for each non-ground pad of the SKY77166 product. The numbers in Figure 8 specify the ESD threshold level for each pad where the I-V curve between the pad and ground starts to show degradation. The ESD testing was performed in compliance with MIL-STD883E Method 3015.7 using the Human Body Model. If ESD damage threshold magnitude is found to consistently exceed 2000 volts on a given pad, this so is indicated. If ESD damage threshold below 2000 volts is measured for either polarity, numbers are indicated that represent worst case values observed in product characterization. Various failure criteria can be utilized when performing ESD testing. Many vendors employ relaxed ESD failure standards, which fail devices only after “the pad fails the electrical specification limits” or “the pad becomes completely non-functional”. Skyworks employs most stringent criteria and fails devices as soon as the pad begins to show any degradation on a curve tracer. Figure 7. Typical Case Markings – 4 x 4 mm Package Package and Handling Information Because of its sensitivity to moisture absorption, this device package is baked and vacuum-packed prior to shipment. Instructions on the shipping container label must be followed regarding exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. The SKY77166 is capable of withstanding an MSL3/250 °C solder reflow. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. If the part is attached in a reflow oven, the temperature ramp rate should not exceed 3 °C per second; maximum temperature should not exceed 250 °C. If the part is manually attached, precaution should be taken to insure that the part is not subjected to temperatures exceeding 250 °C for more than 10 seconds. For details on attachment techniques, precautions, and handling Figure 8. ESD Sensitivity of Non-Ground Pads (Top View) Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 200466A • Skyworks Proprietary and Confidential information. • Products and product information are subject to change without notice. • December 6, 2007 7 ADVANCE DATA SHEET To avoid ESD damage, both latent and visible, it is very important that the product assembly and test areas follow the Class-1 ESD • Personnel Grounding - Wrist Straps - Conductive Smocks, Gloves and Finger Cots - Antistatic ID Badges • Protective Workstation - Dissipative Table Top - Protective Test Equipment (Properly Grounded) - Grounded Tip Soldering Irons - Solder Conductive Suckers - Static Sensors SKY77166 POWER AMPLIFIER MODULE FOR CDMA2000 (450-460 MHZ) handling precautions listed below. • Facility - Relative Humidity Control and Air Ionizers - Dissipative Floors (less than 109 Ω to GND) • Protective Packaging and Transportation - Bags and Pouches (Faraday Shield) - Protective Tote Boxes (Conductive Static Shielding) - Protective Trays - Grounded Carts - Protective Work Order Holders Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 8 December 6, 2007 • Skyworks Proprietary and Confidential information. • Products and product information are subject to change without notice. • 200466A Ordering Information Model Number Manufacturing Part Number SKY77166 SKY77166 Product Revision Package Operating Temperature MCM 4x4 –30 °C to +85 °C Revision History Revision Level Date Description P1 September 22, 2006 Advance Information A February 15, 2007 Revise: Change data sheet Revision suffix from P1 to A (Advance data sheet status continues); Table 4 B December 6, 2007 Revise: Figures 1, 2, 3, 6–8; Table 4 References Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752 Application Note: Tape and Reel Information – RF Modules, Document Number 101568 Standard SMT Reflow Profiles: JEDEC Standard J–STD–020 (current revision). Copyright © 2005–2007, Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products. These materials are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials. Skyworks may make changes to its documentation, products, specifications and product descriptions at any time, without notice. Skyworks makes no commitment to update the information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from future changes to its documentation, products, specifications and product descriptions. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by or under this document. Except as may be provided in Skyworks Terms and Conditions of Sale for such products, Skyworks assumes no liability whatsoever in association with its documentation, products, specifications and product descriptions. THESE MATERIALS ARE PROVIDED “AS IS” WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED OR OTHERWISE, RELATING TO SALE AND/OR USE OF SKYWORKS PRODUCTS INCLUDING WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. SKYWORKS FURTHER DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. 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