STANSON ST3400SRG

ST3400SRG
N Channel Enhancement Mode MOSFET
5.8A
DESCRIPTION
The ST3400SRG is the N-Channel logic enhancement mode power field effect transistor
is produced using high cell density, DMOS trench technology.
This high-density process is especially tailored to minimize on-state resistance. These
devices are particularly suited for low voltage application such as cellular phone and
notebook computer power management and other battery powered circuits where high
side switching.
FEATURE
PIN CONFIGURATION
SOT-23
3
D
G
S
1
2
1.Gate
2.Source
3.Drain
30V/5.8A, RDS(ON) = 25mΩ (Typ.)
@VGS = 10V
30V/4.8A, RDS(ON) = 30mΩ
@VGS = 4.5V
30V/4.0A, RDS(ON) = 40mΩ
@VGS = 2.5V
Super high density cell design for
extremely low RDS(ON)
Exceptional on-resistance and maximum
DC current capability
SOT-23 package design
PART MARKING
SOT-23
3
A0YA
1
Y: Year Code
2
A: Week Code
1
120 Bentley Square, Mountain View, Ca 94040 USA
http://www.stnasontech.com
STN3400SRG 2009. V1
ST3400SRG
N Channel Enhancement Mode MOSFET
5.8A
ABSOULTE MAXIMUM RATINGS (Ta = 25℃ Unless otherwise noted )
Parameter
Symbol
Typical
Unit
Drain-Source Voltage
VDSS
30
V
Gate-Source Voltage
VGSS
±12
V
ID
5.8
3.5
A
IDM
25
A
Continuous Source Current (Diode Conduction)
IS
1.7
A
TA=25℃
TA=70℃
PD
2.0
1.3
W
TJ
150
℃
Storgae Temperature Range
TSTG
-55/150
℃
Thermal Resistance-Junction to Ambient
RθJA
90
Continuous Drain CurrentTJ=150℃)
TA=25℃
TA=70℃
Pulsed Drain Current
Power Dissipation
Operation Junction Temperature
℃/W
2
120 Bentley Square, Mountain View, Ca 94040 USA
http://www.stnasontech.com
STN3400SRG 2009. V1
ST3400SRG
N Channel Enhancement Mode MOSFET
5.8A
ELECTRICAL CHARACTERISTICS ( Ta = 25℃ Unless otherwise noted )
Parameter
Symbol
Condition
Min
V(BR)DSS
VGS=0V,ID=250uA
30
VGS(th)
VDS=VGS,ID=250uA
0.5
IGSS
Typ Max
Unit
Static
Drain-Source Breakdown
Voltage
Gate Threshold Voltage
Gate Leakage Current
Zero Gate Voltage Drain
Current
IDSS
V
1.5
V
VDS=0V,VGS=±12V
±100
nA
VDS=24V,VGS=0V
1
VDS=24V,VGS=0V
TJ=55℃
10
uA
Drain-source On-Resistance
RDS(on)
VGS=10V,ID=5.8A
VGS=4.5V,ID=4.8A
VGS=2.5V,ID=4.0A
25
30
40
mΩ
Forward Transconductance
gfs
VDS=4.5V,ID=5.8A
12
S
Diode Forward Voltage
VSD
IS=1.7A,VGS=0V
1.2
V
Dynamic
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Input Capacitance
Output Capacitance
Ciss
Coss
Reverse Transfer Capacitance
Crss
Turn-On Time
td(on)
Turn-Off Time
VDS=15V
VGS=10V
ID≡6.7A
tr
td(off)
tf
9.7
18
1.6
nC
3.1
VDS=15V
VGS=0V
F=1MHz
450
240
VDD=15V
RL=15Ω
ID=1.0A
VGEN=10V
RG=6Ω
7
15
10
20
20
40
11
20
pF
38
nS
3
120 Bentley Square, Mountain View, Ca 94040 USA
http://www.stnasontech.com
STN3400SRG 2009. V1
ST3400SRG
N Channel Enhancement Mode MOSFET
5.8A
TYPICAL CHARACTERICTICS (25℃ Unless noted)
4
120 Bentley Square, Mountain View, Ca 94040 USA
http://www.stnasontech.com
STN3400SRG 2009. V1
ST3400SRG
N Channel Enhancement Mode MOSFET
5.8A
TYPICAL CHARACTERICTICS (25℃ Unless noted)
5
120 Bentley Square, Mountain View, Ca 94040 USA
http://www.stnasontech.com
STN3400SRG 2009. V1
ST3400SRG
N Channel Enhancement Mode MOSFET
5.8A
SOT-23 PACKAGE OUTLINE
6
120 Bentley Square, Mountain View, Ca 94040 USA
http://www.stnasontech.com
STN3400SRG 2009. V1