STMICROELECTRONICS STH260N6F6-2

STH260N6F6-2
N-channel 60 V, 1.7 mΩ typ., 180 A STripFET™ VI DeepGATE™
Power MOSFET in H²PAK-2 package
Datasheet — production data
Features
Order code
VDSS
RDS(on) max
ID
STH260N6F6-2
60 V
< 2.4 mΩ
180 A
■
Low gate charge
■
Very low on-resistance
■
High avalanche ruggedness
TAB
2
3
1
H2PAK-2
Applications
■
Switching applications
Description
This device is an N-channel Power MOSFET
developed using the 6th generation of STripFET™
DeepGATE™ technology, with a new gate
structure. The resulting Power MOSFET exhibits
the lowest RDS(on) in all packages.
Figure 1.
Internal schematic diagram
$4!"
'
3
!-V
Table 1.
Device summary
Order code
Marking
Package
Packaging
STH260N6F6-2
260N6F6
H2PAK-2
Tape and reel
July 2012
This is information on a product in full production.
Doc ID 018784 Rev 4
1/14
www.st.com
14
Contents
STH260N6F6-2
Contents
1
Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1
Electrical characteristics (curves)
............................. 6
3
Test circuits
4
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2/14
.............................................. 8
Doc ID 018784 Rev 4
STH260N6F6-2
1
Electrical ratings
Electrical ratings
Table 2.
Absolute maximum ratings
Symbol
Parameter
Value
Unit
VDS
Drain-source voltage
60
V
VGS
Gate-source voltage
± 20
V
ID
Drain current (continuous) at TC = 25 °C
180
A
ID
Drain current (continuous) at TC = 100 °C
180
A
Drain current (pulsed)
720
A
Total dissipation at TC = 25 °C
300
W
2
W/°C
- 55 to 175
°C
Value
Unit
Thermal resistance junction-case max
0.5
°C/W
Thermal resistance junction-pcb max
35
°C/W
Maximum lead temperature for soldering
purpose
300
°C
IDM
(1)
PTOT
Derating factor
Tstg
Storage temperature
Operating junction temperature
Tj
1. Current limited by package.
Table 3.
Symbol
Rthj-case
Rthj-pcb
Tl
(1)
Thermal data
Parameter
1. When mounted on FR-4 board of 1 inch², 2 oz Cu.
Doc ID 018784 Rev 4
3/14
Electrical characteristics
2
STH260N6F6-2
Electrical characteristics
(TCASE = 25 °C unless otherwise specified)
Table 4.
Symbol
V(BR)DSS
Parameter
Test conditions
Drain-source breakdown
voltage (VGS = 0)
ID = 250 µA
Zero gate voltage
Drain current (VGS = 0)
IGSS
Gate-body leakage
current (VDS = 0)
VGS = ± 20 V
VGS(th)
Gate threshold voltage
VDS = VGS, ID = 250 µA
RDS(on)
Static drain-source
on-resistance
VGS = 10 V, ID = 60 A
Symbol
Parameter
Input capacitance
Coss
Output capacitance
Crss
Reverse transfer
capacitance
Qg
Total gate charge
Qgs
Gate-source charge
Qgd
Gate-drain charge
Symbol
Typ.
Max.
60
Unit
V
1
µA
100
µA
± 100
nA
4
V
1.7
2.4
mΩ
Typ.
Max.
Unit
VDS = 60 V, TC=125 °C
2
Dynamic
Ciss
Table 6.
Min.
VDS = 60 V
IDSS
Table 5.
4/14
On/off states
Test conditions
Min.
11800
VDS = 25 V, f = 1 MHz,
VGS = 0
VDD = 30 V, ID = 120 A,
VGS = 10 V
(see Figure 14)
-
-
1235
pF
-
pF
488
pF
183
nC
53
-
41
nC
nC
Switching times
Parameter
td(on)
tr
Turn-on delay time
Rise time
td(off)
tf
Turn-off-delay time
Fall time
Test conditions
VDD = 30 V, ID = 60 A
RG = 4.7 Ω VGS = 10 V
(see Figure 13)
Doc ID 018784 Rev 4
Min.
Typ.
Max.
Unit
-
31.4
165
-
ns
ns
-
144.4
62.6
-
ns
ns
STH260N6F6-2
Electrical characteristics
Table 7.
Symbol
Source drain diode
Parameter
Test conditions
Min.
Typ.
Max.
Unit
Source-drain current
180
A
ISDM
(1)
Source-drain current (pulsed)
720
A
VSD
(2)
Forward on voltage
ISD = 180 A, VGS = 0
1.1
V
Reverse recovery time
Reverse recovery charge
Reverse recovery current
ISD = 120 A, VDD = 48 V
di/dt = 100 A/µs,
Tj = 150 °C
(see Figure 15)
ISD
trr
Qrr
IRRM
-
55.6
116
3.8
ns
nC
A
1. Current limited by package.
2. Pulsed: pulse duration = 300 µs, duty cycle 1.5%
Doc ID 018784 Rev 4
5/14
Electrical characteristics
STH260N6F6-2
2.1
Electrical characteristics (curves)
Figure 2.
Safe operating area
Figure 3.
Thermal impedance
AM09068v2
ID
(A)
280tok
K
ea
his
nt
i
ion
ar
xR
ma
at
er
by
Op ited
Lim
100
is
δ=0.5
Tj=175°C
Tc=25°C
Single pulse
)
on
(
DS
0.2
100µs
0.1
1ms
10
0.05
-1
10
0.02
10ms
Zth=k Rthj-c
δ=tp/τ
0.01
1
Single pulse
tp
τ
-2
0.1
0.1
Figure 4.
10
1
VDS(V)
Output characteristics
10 -5
10
Figure 5.
-4
-2
-3
10
-1
10
10
tp (s)
10
Transfer characteristics
AM09069v1
AM09070v1
ID(A)
ID (A)
400
VDS=2V
400
VGS=10V
350
350
6V
300
300
250
250
5V
200
200
150
150
100
100
50
50
0
0
Figure 6.
1
2
3
VDS(V)
Normalized BVDSS vs. temperature
AM09071v1
BVDSS
(norm)
ID=1mA
0
0
Figure 7.
1
2
4
3
5
VGS(V)
Static drain-source on-resistance
AM09072v2
RDS(on)
(mΩ)
VGS=10V
1.1
1.78
1.0
1.74
0.9
1.70
0.8
1.66
0.7
0.6
-75
6/14
-25
25
75
125
175 TJ(°C)
1.62
20
Doc ID 018784 Rev 4
40
60
80
100
ID(A)
STH260N6F6-2
Figure 8.
Electrical characteristics
Gate charge vs. gate-source
voltage
Figure 9.
AM09073v1
VGS
(V)
Capacitance variations
AM09074v1
C
(pF)
f=1MHz
VDD=30V
ID=120A
12
10
10000
Ciss
1000
Coss
8
6
4
Crss
2
0
0
100
50
150
200
100
Qg(nC)
Figure 10. Normalized gate threshold voltage
vs. temperature
AM09075v1
VGS(th)
(norm)
0.1
1
Figure 11. Normalized on-resistance vs.
temperature
AM09076v1
RDS(on)
(norm)
ID=60A
VGS=10V
ID=250µA
1.2
VDS(V)
10
2.0
1.0
1.5
0.8
0.6
1.0
0.4
0.5
0.2
-75
25
-25
75
175 TJ(°C)
125
0
-75
-25
25
75
125
175 TJ(°C)
Figure 12. Source-drain diode forward
characteristics
AM09077v1
VSD
(V)
TJ=-55°C
1.0
0.9
TJ=25°C
0.8
0.7
TJ=150°C
0.6
0.5
0.4
0
20
40
60
80
100 120
ISD(A)
Doc ID 018784 Rev 4
7/14
Test circuits
3
STH260N6F6-2
Test circuits
Figure 13. Switching times test circuit for
resistive load
Figure 14. Gate charge test circuit
VDD
12V
47kΩ
1kΩ
100nF
3.3
μF
2200
RL
μF
VGS
IG=CONST
VDD
100Ω
Vi=20V=VGMAX
VD
RG
2200
μF
D.U.T.
D.U.T.
VG
2.7kΩ
PW
47kΩ
1kΩ
PW
AM01468v1
AM01469v1
Figure 15. Test circuit for inductive load
Figure 16. Unclamped inductive load test
switching and diode recovery times
circuit
A
A
D.U.T.
FAST
DIODE
B
B
L
A
D
G
VD
L=100μH
S
3.3
μF
B
25 Ω
1000
μF
D
VDD
2200
μF
3.3
μF
VDD
ID
G
RG
S
Vi
D.U.T.
Pw
AM01470v1
Figure 17. Unclamped inductive waveform
AM01471v1
Figure 18. Switching time waveform
ton
V(BR)DSS
tdon
VD
toff
tr
tdoff
tf
90%
90%
IDM
10%
ID
VDD
10%
0
VDD
VDS
90%
VGS
AM01472v1
8/14
0
Doc ID 018784 Rev 4
10%
AM01473v1
STH260N6F6-2
4
Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.
Doc ID 018784 Rev 4
9/14
Package mechanical data
Table 8.
STH260N6F6-2
H²PAK 2 leads mechanical data
mm
Dim.
Min.
Typ.
Max.
A
4.30
4.80
A1
0.03
0.20
C
1.17
1.37
e
4.98
5.18
E
0.50
0.90
F
0.78
0.85
H
10.00
10.40
H1
7.40
7.80
-
10/14
L
15.30
15.80
L1
1.27
1.40
L2
4.93
5.23
L3
6.85
7.25
L4
1.5
1.7
M
2.6
2.9
R
0.20
0.60
V
0°
8°
Doc ID 018784 Rev 4
STH260N6F6-2
Package mechanical data
Figure 19. H²PAK 2 leads drawing
8159712_C
Doc ID 018784 Rev 4
11/14
Package mechanical data
STH260N6F6-2
Figure 20. H²PAK 2 recommended footprint
12/14
Doc ID 018784 Rev 4
STH260N6F6-2
5
Revision history
Revision history
Table 9.
Document revision history
Date
Revision
Changes
31-May-2011
1
First release.
25-Aug-2011
2
Updated mechanical data.
01-Feb-2012
3
Updated Table 2: Absolute maximum ratings.
Minor text changes.
06-Jul-2012
4
Section 2.1: Electrical characteristics (curves) has been added.
Doc ID 018784 Rev 4
13/14
STH260N6F6-2
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2012 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
14/14
Doc ID 018784 Rev 4