SYNC-POWER SPN8882_11

SPN8882
N-Channel Enhancement Mode MOSFET
DESCRIPTION
The SPN8882 is the N-Channel logic enhancement mode
power field effect transistors are produced using high cell
density , DMOS trench technology. The SPN8882 has
been designed specifically to improve the overall
efficiency of DC/DC converters using either synchronous
or conventional switching PWM controllers. It has been
optimized for low gate charge, low RDS(ON) and fast
switching speed.
APPLICATIONS
z Power Management in Note book
z Powered System
z DC/DC Converter
z Load Switch
FEATURES
‹
30V/40A,RDS(ON)= 10mΩ@VGS=10V
‹
30V/40A,RDS(ON)= 14mΩ@VGS=4.5V
‹
Super high density cell design for extremely low
RDS (ON)
‹
Exceptional on-resistance and maximum DC
current capability
‹
TO-252,TO-251 package design
PIN CONFIGURATION
TO-252
TO-251
PART MARKING
2011/04/19 Ver.4
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SPN8882
N-Channel Enhancement Mode MOSFET
PIN DESCRIPTION
Pin
Symbol
Description
1
G
Gate
2
S
Source
3
D
Drain
ORDERING INFORMATION
Part Number
Package
SPN8882T252RG
SPN8882T251TG
※ SPN8882T252RG : Tape Reel ; Pb – Free
※ SPN8882T251TG : Tube ; Pb – Free
Part
TO-252
TO-251
Marking
SPN8882
SPN8882
ABSOULTE MAXIMUM RATINGS
(TA=25℃ Unless otherwise noted)
Parameter
Symbol
Typical
Unit
Drain-Source Voltage
VDSS
30
V
Gate –Source Voltage
VGSS
±20
V
Continuous Drain Current
TA=25℃
ID
TA=100℃
Pulsed Drain Current
Continuous Drain Current
Single Pulse Drain to Source Avalanche Energy − Starting
(TJ=25°C , VDD=27V , VGS=10V , IAS=28A , L=0.1mH )
Operating Junction Temperature
TA=25℃
TO-251
40
A
IDM
100
A
IS
50
A
EAS
41
mJ
TO-252-2L
Power Dissipation
60
40
PD
55
W
TJ
150
℃
Storage Temperature Range
TSTG
-55/150
℃
Thermal Resistance-Junction to Ambient
RθJA
100
℃/W
2011/04/19 Ver.4
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SPN8882
N-Channel Enhancement Mode MOSFET
ELECTRICAL CHARACTERISTICS
(TA=25℃ Unless otherwise noted)
Parameter
Symbol
Conditions
Min.
Typ
Max.
Unit
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
V(BR)DSS VGS = 0V , ID =250uA
VGS(th) VDS = VGS,IDS =250uA
Gate Leakage Current
IGSS
Forward Transconductance
gfs
VDS = 0V,VGS = ±20 V
VDS = 24V,VGS =0V
VDS = 24V,VGS =0V,
TJ = 125C
VGS = 10V, ID = 35A
VGS = 4.5V, ID = 35A
VDS = 15V, ID =20 A
Zero Gate Voltage Drain Current
IDSS
Diode Forward Voltage
VSD
IF = 40 A,VGS = 0V
Drain-Source On-Resistance
RDS(on)
30
0.8
2.4
±100
1
100
0.008
0.012
0.010
0.014
10
V
nA
uA
Ω
S
1.0
1.5
12
20
V
Dynamic
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
200
td(on)
8
12
10
15
18
30
6
9
Turn-On Time
Turn-Off Time
2011/04/19 Ver.4
tr
td(off)
tf
VDS = 15V,VGS = 5V,
ID =50 A
nC
4
5
VGS = 0V, VDS = 25V,
F=1MHz
(VDD = 15 V,ID = 50 A,
VGS=10V,RG = 2.5Ω)
1500
pF
320
Page 3
ns
SPN8882
N-Channel Enhancement Mode MOSFET
TYPICAL CHARACTERISTICS
2011/04/19 Ver.4
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SPN8882
N-Channel Enhancement Mode MOSFET
TYPICAL CHARACTERISTICS
2011/04/19 Ver.4
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SPN8882
N-Channel Enhancement Mode MOSFET
TYPICAL CHARACTERISTICS
2011/04/19 Ver.4
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SPN8882
N-Channel Enhancement Mode MOSFET
TO-252 PACKAGE OUTLINE
2011/04/19 Ver.4
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SPN8882
N-Channel Enhancement Mode MOSFET
TO-251 PACKAGE OUTLINE
2011/04/19 Ver.4
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SPN8882
N-Channel Enhancement Mode MOSFET
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2011/04/19 Ver.4
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