LM759/LM77000 Power Operational Amplifiers General Description Features The LM759 and LM77000 are high performance operational amplifiers that feature high output current capability. The LM759 is capable of providing 325 mA and the LM77000 providing 250 mA. Both amplifiers feature small signal characteristics that are better than the LM741. The amplifiers are designed to operate from a single or dual power supply with an input common mode range that includes the negative supply. The high gain and high output power provide superior performance. Internal current limiting, thermal shutdown, and safe area compensation are employed making the LM759 and LM77000 essentially indestructible. Y Y Y Y Y Output current LM759Ð325 mA minimum LM77000Ð250 mA minimum Internal short circuit current limiting Internal thermal overload protection Internal output transistors safe-area protection Input common mode voltage range includes ground or negative supply Applications Y Y Y Y Voltage regulators Audio amplifiers Servo amplifiers Power drivers Connection Diagrams and Ordering Information TL/H/10075 – 2 Top View TL/H/10075 – 1 Lead 4 connected to case. Order Number LM759CP or LM77000CP See NS Package Number P04A Top View Order Number LM759MH, LM759CH or LM759H/883 See NS Package Number H08C C1995 National Semiconductor Corporation TL/H/10075 RRD-B30M115/Printed in U. S. A. LM759/LM77000 Power Operational Amplifiers November 1994 Absolute Maximum Ratings Internal Power Dissipation (Note 1) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. Storage Temperature Range Metal Can Plastic Package Internally Limited g 18V Supply Voltage Differential Input Voltage Input Voltage (note 2) b 65§ C to a 175§ C b 65§ C to a 150§ C 30V g 15V Operating Junction Temperature Range b 55§ C to a 150§ C Military (LM759M) Commercial (LM759C, LM77000C) 0§ C to a 125§ C Lead Temperature Metal Can (soldering, 60 sec) 300§ C Plastic Package (soldering, 10 sec) 265§ C LM759 Electrical Characteristics TJ e 25§ C, VCC e g 15V, unless otherwise specified Symbol Parameter Typ Max Units 1.0 3.0 mV Input Offset Current 5.0 30 nA IIB Input Bias Current 50 150 nA ZI Input Impedance ICC Supply Current VIR Input Voltage Range IOS Output Short Circuit Current lVCC – VOl e 30V IO PEAK Peak Output Current 3.0V s lVCC –VOl s 10V g 325 g 500 mA AVS Large Signal Voltage Gain RL t 50X, VO e g 10V 50 200 V/mV TR Transient Response RL e 50X, AV e 1.0 300 ns 5.0 % 0.6 V/ms 1.0 MHz VIO Input Offset Voltage IIO Conditions Min RS s 10 kX 0.25 1.5 12 V a b 2V to Vb Rise Time Overshoot SR Slew Rate RL e 50X, AV e 1.0 BW Bandwidth AV e 1.0 MX 18 mA V a b 2V to Vb V g 200 mA The following specifications apply for b55§ C s TJ s a 150§ C VIO Input Offset Voltage RS s 10 kX 4.5 mV IIO Input Offset Current 60 nA IIB Input Bias Current 300 CMRR Common Mode Rejection Ratio RS s 10 kX 80 100 PSRR Power Supply Rejection Ratio RS s 10 kX 80 100 dB AVS Large Signal Voltage Gain RL t 50X, VO e g 10V 25 200 V/mV VOP Output Voltage Swing RL e 50X g 10 g 12.5 V 2 nA dB LM759C Electrical Characteristics TJ e 25§ C, VCC e g 15V, unless otherwise specified Symbol Parameter Typ Max Units 1.0 6.0 mV Input Offset Current 5.0 50 nA IIB Input Bias Current 50 250 nA ZI Input Impedance ICC Supply Current VIR Input Voltage Range IOS Output Short Circuit Current lVCC –VOl e 30V IO PEAK Peak Output Current 3.0V s lVCC –VOl s 10V g 325 g 500 mA AVS Large Signal Voltage Gain RL t 50X, VO e g 10V 25 200 V/mV TR Transient Response RL e 50X, AV e 1.0 300 ns VIO Input Offset Voltage IIO Conditions Min RS s 10 kX 0.25 1.5 12 V a b 2V to Vb Rise Time Overshoot MX 18 mA V a b 2V to Vb V g 200 mA 10 % SR Slew Rate RL e 50X, AV e 1.0 0.5 V/ms BW Bandwidth AV e 1.0 1.0 MHz The following specifications apply for 0§ s TJ s a 125§ C VIO Input Offset Voltage RS s 10 kX 7.5 mV IIO Input Offset Current 100 nA IIB Input Bias Current 400 CMRR Common Mode Rejection Ratio RS s 10 kX 70 100 PSRR Power Supply Rejection Ratio RS s 10 kX 80 100 dB AVS Large Signal Voltage Gain RL t 50X, VO e g 10V 25 200 V/mV VOP Output Voltage Swing RL e 50X g 10 g 12.5 V 3 nA dB LM77000 Electrical Characteristics TJ e 25§ C, VCC e g 15V, unless otherwise specified Symbol Parameter Typ Max Units 1.0 8.0 mV Input Offset Current 5.0 50 nA IIB Input Bias Current 50 250 nA ZI Input Impedance ICC Supply Current VIR Input Voltage Range IOS Output Short Circuit Current lVCC – VOl e 30V IO PEAK Peak Output Current 3.0V s lVCC –VOl s 10V g 250 g 400 mA AVS Large Signal Voltage Gain RL t 50X, VO e g 10V 25 200 V/mV TR Transient Response RL e 50X, AV e 1.0 300 ns VIO Input Offset Voltage IIO Conditions Min RS s 10 kX 0.25 1.5 12 a 13 to Vb Rise Time Overshoot MX 18 mA a 13 to Vb V g 200 mA 10 % SR Slew Rate RL e 50X, AV e 1.0 0.5 V/ms BW Bandwidth AV e 1.0 1.0 MHz The following specifications apply for 0§ s TJ s a 125§ C VIO Input Offset Voltage RS s 10 kX 10 mV IIO Input Offset Current 100 nA IIB Input Bias Current 400 CMR Common Mode Rejection RS s 10 kX 70 100 PSRR Power Supply Rejection Ratio RS s 10 kX 80 100 dB AVS Large Signal Voltage Gain RL t 50X, VO e g 10V 25 200 V/mV VOP Output Voltage Swing RL e 50X g 10 g 12.5 V nA dB Note 1: Although the internal power dissipation is limited, the junction temperature must be kept below the maximum specified temperature in order to meet data sheet specifications. To calculate the maximum junction temperature or heat sink required, use the thermal resistance values which follow the Equivalent Circuit Schematic. Note 2: For a supply voltage less than 30V between V a and Vb, the absolute maximum input voltage is equal to the supply voltage. Note 3: For military electrical specifications RETS759X are available for LM759H. 4 Note: All resistor values in ohms. TL/H/10075 – 3 Equivalent Circuit 5 Package Typ iJC § C/W Max iJC § C/W Typ iJA § C/W Max iJA § C/W Plastic Package (P) 8.0 12 75 80 Metal Can (H) 30 40 120 150 PD Max e Mounting Hints Metal Can Package (LM759CH/LM759MH) The LM759 in the 8-Lead TO-99 metal can package must be used with a heat sink. With g 15V power supplies, the LM759 can dissipate up to 540 mW in its quiescent (no load) state. This would result in a 100§ C rise in chip temperature to 125§ C (assuming a 25§ C ambient temperature). In order to avoid this problem, it is advisable to use either a slip on or stud mount heat sink with this package. If a stud mount heat sink is used, it may be necessary to use insulating washers between the stud and the chassis because the case of the LM759 is internally connected to the negative power supply terminal. Plastic Package (LM759CP/LM77000CP) The LM759CP and LM77000CP are designed to be attached by the tab to a heat sink. This heat sink can be either one of the many heat sinks which are commercially available, a piece of metal such as the equipment chassis, or a suitable amount of copper foil as on a double sided PC board. The important thing to remember is that the negative power supply connection to the op amp must be made through the tab. Furthermore, adequate heat sinking must be provided to keep the chip temperature below 125§ C under worst case load and ambient temperature conditions. TJ Max b TA or iJC a iCA b TA T e J Max (without a heat sink) iJA iCA e iCS a iSA Solving TJ: TJ e TA a PD (iJC a iCA) or e TA a PDiJA (without a heat sink) Where: TJ e Junction Temperature TA e Ambient Temperature PD e Power Dissipation iJA e Junction to ambient thermal resistance iJC e Junction to case thermal resistance iCA e Case to ambient thermal resistance iCS e Case to heat sink thermal resistance iSA e Heat sink to ambient thermal resistance 6 Typical Performance Characteristics Frequency Response for Various Closed Loop Gains Open Loop vs Frequency Response Output Voltage vs Frequency Output Voltage vs Load Resistance Voltage Follower Large Signal Pulse Response Voltage Follower Transient Response Total Harmonic Distortion vs Frequency Total Harmonic Distortion vs Power Output Input Noise Voltage vs Frequency Noise Current vs Frequency Short Circuit Current vs Junction Temperature Peak Output Current vs Output Voltage TL/H/10075 – 4 7 Applications Offset Null Circuit Paralleling LM759 Power Op Amps TL/H/10075–5 Audio Applications TL/H/10075 – 6 Low Cost Phono Amplifier TL/H/10075–7 8 Speaker Impedance (Ohms) Output Power (Watts) Min Supply (Volts) VOP – P (Volts) 4 8 16 32 0.18 0.36 0.72 1.44 9 12 15 25 2.4 4.8 9.6 19.2 Applications (Continued) Bi-Directional Intercom System Using the LM759 Power Op Amp TL/H/10075 – 9 Features: Circuit Simplicity 1 Watt of Audio Output Duplex operation with only one two-wire cable as interconnect. Note 1: All resistor values in ohms. 9 Applications (Continued) Servo Applications High Slew Rate Power Op Amp/Audio Amp AG Servo AmplifierÐBridge Type TL/H/10075 – 10 Features: High Slew Rate 9 V/ms High 3 dB Power Bandwidth 85 kHz 18 Watts Output Power into an 8X load. Low DistortionÐ0.2%, 10 Vrms, 1 kHz into 8X Design Consideration AV t 10 TL/H/10075 – 11 Features: Gain of 10 Use of LM759 Means Simple Inexpensive Circuit Design Considerations: 325 mA Max Output Current DC Servo Amplifier TL/H/10075 – 12 Features: Circuit Simplicity One Chip Means Excellent Reliability Design Considerations IO s 325 mA Note 1: All resistor values in ohms. 10 Regulator Applications Adjustable Dual Tracking Regulator TL/H/10075 – 13 Features: Wide Output Voltage Range ( g 2.2V to g 30V) Excellent Load Regulation DVO k g 5 mV for DIO e g 0.2 A Excellent Line Regulation DVO k g 2 mV for DVI e 10V Note 1: All resistor values in ohms. 10 Amp Ð 12 Volt Regulator Features: Excellent Load and Line Regulation Excellent Temperature Coefficient-Depends Largely on Tempco of the Reference Zener TL/H/10075 – 14 Note 1: All resistor values in ohms. 11 12 Physical Dimensions inches (millimeters) 8-Lead Metal Package Order Number LM759MH, LM759CH or LM759H/883 NS Package Number H08C 13 LM759/LM77000 Power Operational Amplifiers Physical Dimensions inches (millimeters) (Continued) Order Number LM759CP or LM77000CP NS Package Number P04A LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. 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