THINE THC63LVDM83D

THC63LVDM83D _Rev.3.1_E
THC63LVDM83D
REDUCED SWING LVDS 24Bit COLOR HOST-LCD PANEL INTERFACE
General Description
Features
The THC63LVDM83D transmitter is designed to support pixel data transmission between Host and Flat
Panel Display from NTSC up to 1080p(60Hz).
The THC63LVDM83D converts 28bits of CMOS/TTL
data into LVDS(Low Voltage Differential Signaling)
data stream. The transmitter can be programmed for rising edge or falling edge clocks through a dedicated pin.
At a transmit clock frequency of 160MHz, 24bits of
RGB data and 4bits of timing and control data
(HSYNC, VSYNC, CNTL1, CNTL2) are transmitted at
an effective rate of 1120Mbps per LVDS channel.
• Wide dot clock range: 8-160MHz suited for NTSC,
VGA, SVGA, XGA,SXGA and SXGA+
•
•
•
•
•
•
•
•
•
•
PLL requires no external components
Supports spread spectrum clock generator
On chip jitter filtering
Clock edge selectable
Supports reduced swing LVDS for low EMI
Power down mode
Low power single 3.3V CMOS design
Low profile 56 Lead TSSOP Package
1.2 up to 3.3V tolerant data inputs to connect
directly to low power,low voltage application and
graphic processor.
Pin compatible with THC63LVDM83C/83R(24bits)
Block Diagram
THC63LVDM83D
CMOS/TTL
INPUTS
TB0-6
TC0-6
TD0-6
7
7
7
7
TTL PARALLEL TO SERIAL
TA0-6
DATA
(LVDS)
TA +/TB +/TC +/TD +/(56-1120Mbit/On Each
LVDS Channel)
TRANSMITTER
CLKIN
(8 to 160MHz)
TCLK +/-
PLL
CLOCK
(LVDS)
8-160MHz
R/F
/PDWN
RS
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THC63LVDM83D_Rev.3.1_E
Pin Out
THC63LVDM83D
RS
TD1
TA5
TA6
GND
TB0
TB1
TD2
VCC
TD3
TB2
TB3
GND
TB4
TB5
TD4
R/F
TD5
TB6
TC0
GND
TC1
TC2
TC3
TD6
VCC
TC4
TC5
Copyright©2011 THine Electronics, Inc.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
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TA4
TA3
TA2
GND
TA1
TA0
TD0
LVDS GND
TATA+
TBTB+
LVDS VCC
LVDS GND
TCTC+
TCLKTCLK+
TDTD+
LVDS GND
PLL GND
PLL VCC
PLL GND
/PDWN
CLK IN
TC6
GND
THine Electronics, Inc.
THC63LVDM83D_Rev.3.1_E
Pin Description
Pin Name
Pin #
Type
Description
TA+, TA-
47, 48
LVDS OUT
TB+, TB-
45, 46
LVDS OUT
TC+, TC-
41, 42
LVDS OUT
TD+, TD-
37, 38
LVDS OUT
TCLK+,
TCLK-
39, 40
LVDS OUT
TA0 ~ TA6
51, 52, 54, 55, 56, 3, 4
IN
TB0 ~ TB6
6, 7, 11, 12, 14, 15, 19
IN
TC0 ~ TC6
20, 22, 23, 24, 27, 28, 30
IN
TD0 ~ TD6
50, 2, 8, 10, 16, 18, 25
IN
/PDWN
32
IN
LVDS Data Out.
LVDS Clock Out.
Pixel Data Inputs.
H: Normal operation,
L: Power down (all outputs are Hi-Z)
LVDS swing mode, VREF select.See Fig4, 5.
RS
1
IN
RS
LVDS
Swing
Small Swing
Input Support
VCC
350mV
N/A
0.6 ~ 1.4V
350mV
RS=VREFa
GND
200mV
N/A
a. VREF is Input Reference Voltage.
R/F
17
IN
VCC
9, 26
Power
CLKIN
31
IN
GND
5, 13, 21,
29, 53
Input Clock Triggering Edge Select.
H: Rising edge, L: Falling edge
Power Supply Pins for TTL inputs and digital
circuitry.
Clock in.
Ground
Ground Pins for TTL inputs and digital circuitry.
LVDS VCC
44
Power
Power Supply Pins for LVDS Outputs.
LVDS GND
36, 43, 49
Ground
Ground Pins for LVDS Outputs.
PLL VCC
34
Power
Power Supply Pin for PLL circuitry.
PLL GND
33, 35
Ground
Ground Pins for PLL circuitry.
Copyright©2011 THine Electronics, Inc.
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THine Electronics, Inc.
THC63LVDM83D _Rev.3.1_E
Absolute Maximum Ratings 1
Supply Voltage (VCC)
-0.3V ~ +4.0V
CMOS/TTL Input Voltage
-0.3V ~ (VCC + 0.3V)
CMOS/TTL Output Voltage
-0.3V ~ (VCC + 0.3V)
LVDS Transmitter Output Voltage
-0.3V ~ (VCC + 0.3V)
Output Current
continuous
Junction Temperature
+125 °C
Storage Temperature Range
-55 °C ~ +150 °C
Reflow Peak Temperature / Time
+260 °C / 10sec.
Maximum Power Dissipation @+25 °C
1.8W
1. “Absolute Maximum Ratings” are those valued beyond which the safety of the device can not be guaranteed. They
are not meant to imply that the device should be operated at these limits. The tables of “Electrical Characteristics”
specify conditions for device operation.
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THine Electronics, Inc.
THC63LVDM83D_Rev.3.1_E
Electrical Characteristics CMOS/TTL DC Specifications
VCC = 3.0V ~ 3.6V, Ta = 0 °C ~ +70 °C
Symbol
Parameter
VIH
High Level Input Voltage
RS=VCC or GND
2.0
VCC
V
VIL
Low Level Input Voltage
RS=VCC or GND
GND
0.8
V
1.2
2.8
V
VDDQ1
Conditions
Small Swing Voltage
VREF
Input Reference Voltage
Small Swing (RS=VDDQ/2)
VSH2
Small Swing High Level
Input Voltage
VREF = VDDQ/2
VSL2
Small Swing Low Level
Input Voltage
VREF = VDDQ/2
IINC
Input Current
0V ≤ V IN ≤ V CC
Min.
Typ.
Max.
Units
VDDQ/2
VDDQ/2
+100mV
V
VDDQ/2
-100mV
± 10
V
μA
Notes: 1VDDQ voltage defines max voltage of small swing input. It is not an actual input voltage.
2
Small swing signal is applied to TA0-6,TB0-6,TC0-6,TD0-6 and CLKIN.
LVDS Transmitter DC Specifications
VCC = 3.0V ~ 3.6V, Ta = 0 °C ~ +70 °C
Symbol
Parameter
Conditions
Normal
swing
VOD
Differential Output Voltage
Min.
Typ.
Max.
Units
250
350
450
mV
100
200
300
mV
35
mV
RS=VCC
RL=100Ω
Reduced
swing
RS=GND
ΔVOD
VOC
Change in VOD between
complementary output states
Common Mode Voltage
ΔVOC
Change in VOC between
complementary output states
IOS
Output Short Circuit Current
IOZ
Output TRI-STATE Current
Copyright©2011 THine Electronics, Inc.
RL=100Ω
1.125
VOUT=0V, RL=100Ω
/PDWN=0V,
VOUT=0V to VCC
5/12
1.25
1.375
V
35
mV
-24
mA
± 10
μA
THine Electronics, Inc.
THC63LVDM83D_Rev.3.1_E
Supply Current
VCC = 3.0V ~ 3.6V, Ta = 0 °C ~ +70 °C
Symbol
ITCCW
ITCCS
Parameter
Transmitter Supply
Current
Transmitter Power
Down Supply Current
Condition(*)
Typ.
Max.
Units
RL=100Ω,CL=5pF
f=85MHz
61
67
mA
VCC=3.3V, RS=VCC
f=135MHz
77
83
mA
Worst Case Pattern
f=160MHz
84
92
mA
RL=100Ω,CL=5pF
f=85MHz
50
56
mA
VCC=3.3V, RS=GND
f=135MHz
65
71
mA
Worst Case Pattern
f=160MHz
73
80
mA
/PDWN = L, All Inputs = L or H
10
μA
Worst Case Pattern
CLKIN
Tx0
Tx1
Tx2
Tx3
Tx4
Tx5
Tx6
x= A, B, C, D
Fig1. Worst Case Pattern
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THine Electronics, Inc.
THC63LVDM83D_Rev.3.1_E
Switching Characteristics
VCC = 3.0V ~ 3.6V, Ta = 0°C ~ +70 °C
Symbol
Parameter
tTCIT
CLK IN Transition time
tTCP
CLK IN Period
tTCH
Min.
Typ.
Max.
Units
5.0
ns
6.25
T
125
ns
CLK IN High Time
0.35T
0.5T
0.65T
ns
tTCL
CLK IN Low Time
0.35T
0.5T
0.65T
ns
tTCD
CLK IN to TCLK+/- Delay
tTS
TTL Data Setup to CLK IN
2.0
ns
tTH
TTL Data Hold from CLK IN
0.0
ns
tLVT
LVDS Transition Time
3T
ns
0.6
1.5
ns
0.0
+0.15
ns
tTOP1
Output Data Position0 (T=6.25ns~20ns)
-0.15
tTOP0
Output Data Position1 (T=6.25ns~20ns)
T
--- – 0.15
7
T
--7
T
--- + 0.15
7
ns
tTOP6
Output Data Position2 (T=6.25ns~20ns)
T
2 --- – 0.15
7
T
2 --7
T
2 --- + 0.15
7
ns
tTOP5
Output Data Position3(T=6.25ns~20ns)
T
3 --- – 0.15
7
T
3 --7
T
3 --- + 0.15
7
ns
tTOP4
Output Data Position4 (T=6.25ns~20ns)
T
4 --- – 0.15
7
T
4 --7
T
4 --- + 0.15
7
ns
tTOP3
Output Data Position5 (T=6.25ns~20ns)
T
5 --- – 0.15
7
T
5 --7
T
5 --- + 0.15
7
ns
tTOP2
Output Data Position6 (T=6.25ns~20ns)
T
6 --- – 0.15
7
T
6 --7
T
6 --- + 0.15
7
ns
tTPLL
Phase Lock Loop Set
10.0
ms
AC Timing Diagrams
TTL Input
90%
90%
CLK IN
10%
10%
tTCIT
tTCIT
Fig2. CLKIN Transition Time
LVDS Output
Vdiff=(TA+)-(TA-)
TA+
Vdiff
5pF
80%
80%
20%
20%
100Ω
TAtLVT
LVDS Output Load
tLVT
Fig3. LVDS Output Load and Transition Time
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THC63LVDM83D_Rev.3.1_E
AC Timing Diagrams
RS pin
tTCP
TTL Inputs
VOD
VCC
0.6~1.4V
tTCH
GND
350mV
200mV
VCC
CLK IN
VCC/2
VCC/2
VCC/2
GND
tTCL
tTS
tTH
VCC
Tx0-Tx6
VCC/2
VCC/2
GND
tTCD
TCLK+
VOD
VOC
TCLKNote:
CLK IN: for R/F=GND, denote as solid line,
for R/F=VCC, denote as dashed line.
Fig4. CLKIN Period, High/Low Time, Setup/Hold Timing
Small Swing Inputs
tTCP
tTCH
RS pin
VREF
VCC
VCC/2
0.6~1.4V
Input Voltage of RS pin
GND
VCC/2
VDDQ
CLK IN
VDDQ/2
VREF
GND
VDDQ/2
VDDQ/2
tTCL
tTS
tTH
VDDQ
Tx0-Tx6
VDDQ/2
VDDQ/2
VREF
GND
tTCD
TCLK+
VOC
TCLK-
Note:
CLK IN: for R/F=GND, denote as solid line,
for R/F=VCC, denote as dashed line.
Fig5. Small Swing Inputs
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THC63LVDM83D_Rev.3.1_E
AC Timing Diagrams
LVDS Output
Vdiff = 0V
Vdiff = 0V
TCLK+/(Differential)
TA+/-
TA6
TA5
TA4
TA3
TA2
TA1
TA0
TB+/-
TB6
TB5
TB4
TB3
TB2
TB1
TB0
TC+/-
TC6
TC5
TC4
TC3
TC2
TC1
TC0
TD+/-
TD6
TD5
TD4
TD3
TD2
TD1
TD0
Previous Cycle
Next Cycle
tTOP1
tTOP0
tTOP6
tTOP5
tTOP4
tTOP3
tTOP2
Fig6. LVDS Output Data Position
Phase Lock Loop Set Time
/PDWN
2.0V
3.6V
VCC
3.0V
tTPLL
CLKIN
Vdiff = 0V
TCLK+/Fig7. PLL Lock Set Time
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THC63LVDM83D_Rev.3.1_E
Note
1)Cable Connection and Disconnection
Don't connect and disconnect the LVDS cable, when the power is supplied to the system.
2)GND Connection
Connect the each GND of the PCB which THC63LVDM83D and LVDS-Rx on it. It is better for EMI reduction to
place GND cable as close to LVDS cable as possible.
3)Multi Drop Connection
Multi drop connection is not recommended.
TCLK+
THC63LVDM83D
LVDS-Rx
TCLKLVDS-Rx
4)Asynchronous use
Asynchronous use such as following systems are not recommended.
CLKOUT
DATA
IC
CLKOUT
DATA
LVDS-Rx
TCLK-
DATA
IC
TCLK+
THC63LVDM83D
DATA
TCLK+
THC63LVDM83D
TCLK-
CLKOUT
DATA
Copyright©2011 THine Electronics, Inc.
DATA
LVDS-Rx
TCLK-
CLKOUT
IC
CLKOUT
TCLK+
THC63LVDM83D
TCLK+
THC63LVDM83D
IC
TCLK-
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THC63LVDM83D_Rev.3.1_E
Package
1
14.00 ± 0.10
8.10 ± 0.10
S
6.10 ± 0.10
0.50 TYP
0.10 S
0.17~0.27
1.20 MAX
0.95 ± 0.05
0.25 GAGE PLANE
0°~8°
0.10 ± 0.05
0.60 ± 0.15
1.00
Detail of Lead End
Unit:mm
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THine Electronics, Inc.
THC63LVDM83D_Rev.3.1_E
Notices and Requests
1. The product specifications described in this material are subject to change without prior notice.
2. The circuit diagrams described in this material are examples of the application which may not
always apply to the customer's design. We are not responsible for possible errors and omissions
in this material. Please note if errors or omissions should be found in this material, we may not
be able to correct them immediately.
3. This material contains our copy right, know-how or other proprietary. Copying or disclosing to
third parties the contents of this material without our prior permission is prohibited.
4. Note that if infringement of any third party's industrial ownership should occur by using this
product, we will be exempted from the responsibility unless it directly relates to the production
process or functions of the product.
5. This product is presumed to be used for general electric equipment, not for the applications
which require very high reliability (including medical equipment directly concerning people's
life, aerospace equipment, or nuclear control equipment). Also, when using this product for the
equipment concerned with the control and safety of the transportation means, the traffic signal
equipment, or various Types of safety equipment, please do it after applying appropriate
measures to the product.
6. Despite our utmost efforts to improve the quality and reliability of the product, faults will occur
with a certain small probability, which is inevitable to a semi-conductor product. Therefore, you
are encouraged to have sufficiently redundant or error preventive design applied to the use of the
product so as not to have our product cause any social or public damage.
7. Please note that this product is not designed to be radiation-proof.
8. Customers are asked, if required, to judge by themselves if this product falls under the category
of strategic goods under the Foreign Exchange and Foreign Trade Control Law.
THine Electronics, Inc.
E-mail: [email protected]
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