TRANSCOM TC1101

TC1101
REV6_20070502
Low Noise and Medium Power GaAs FETs
FEATURES
Low Noise Figure: NF = 0.5 dB Typical at 12 GHz
PHOTO ENLARGEMENT
High Associated Gain: Ga = 12 dB Typical at 12 GHz
High Dynamic Range: 1 dB Compression Power P-1 = 18.5 dBm at 12 GHz
Breakdown Voltage: BVDGO ≥ 9 V
Lg = 0.25 µm, Wg = 160 µm
All-Gold Metallization for High Reliability
Tight Vp ranges control
High RF input power handling capability
100 % DC Tested
DESCRIPTION
The TC1101 is a GaAs Pseudomorphic High Electron Mobility Transistor (PHEMT) chip, which has very low
noise figure, high associated gain and high dynamic range. The device can be used in circuits up to 30 GHz and
suitable for low noise and medium power amplifier applications including a wide range of commercial and
military applications. All devices are 100% DC tested to assure consistent quality. All bond pads are gold plated
for either thermo-compression or thermo-sonic wire bonding.
ELECTRICAL SPECIFICATIONS (TA=25 °C)
Symbol
Conditions
NF
Noise Figure at VDS = 2 V, IDS = 10 mA, f = 12GHz
Ga
Associated Gain at VDS = 2 V, IDS = 10 mA, f = 12GHz
P1dB
MIN
Output Power at 1dB Gain Compression point, f = 12GHz VDS = 6 V, IDS = 25 mA
TYP
MAX
0.5
0.7
UNIT
dB
10
12
dB
17.5
18.5
dBm
GL
Linear Power Gain, f = 12GHz VDS = 6 V, IDS = 25 mA
15
dB
IDSS
Saturated Drain-Source Current at VDS = 2 V, VGS = 0 V
14
48
mA
gm
Transconductance at VDS = 2 V, VGS = 0 V
55
mS
VP
Pinch-off Voltage at VDS = 2 V, ID = 0.32 mA
BVDGO Drain-Gate Breakdown Voltage at IDGO =0.08 mA
Rth
9
Thermal Resistance
-1.0*
Volts
12
Volts
225
°C/W
Note: * For the tight control of the pinch-off voltage . TC1101’s are divided into 3 groups:
(1) TC1101P0710 : Vp = -0.7V to -1.0V (2) TC1101P0811 : Vp = -0.8V to -1.1V (3) TC1101P0912 : Vp = -0.9V to -1.2V
In addition, the customers may specify their requirements.
ABSOLUTE MAXIMUM RATINGS (TA=25 °C) TYPICAL NOISE PARAMETERS (TA=25 °C)
VDS = 2 V, IDS = 10 mA
Symbol
VDS
VGS
IDS
IGS
Pin
PT
TCH
TSTG
Parameter
Drain-Source Voltage
Gate-Source Voltage
Drain Current
Gate Current
RF Input Power, CW
Continuous Dissipation
Channel Temperature
Storage Temperature
Rating
7.0 V
-3.0 V
IDSS
160 µA
18 dBm
250 mW
175 °C
- 65 °C to +175 °C
Frequency
(GHz)
2
4
6
8
10
12
14
16
18
NFopt
(dB)
0.38
0.40
0.42
0.45
0.50
0.55
0.64
0.78
0.95
GA
(dB)
19.8
17.5
15.6
13.9
13.1
12.4
11.7
11.1
10.6
Γopt
MAG
ANG
0.99
4
0.90
9
0.82
18
0.76
29
0.69
43
0.63
55
0.56
65
0.45
76
0.34
90
Rn/50
0.48
0.40
0.37
0.34
0.32
0.30
0.28
0.26
0.24
TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County, Taiwan, R.O.C.
Web-Site: www.transcominc.com.tw
Phone: 886-6-5050086
Fax: 886-6-5051602
1/5
TC1101
REV6_20070502
CHIP DIMENSIONS
290± 12
D
250± 12
S
G
S
Units: Micrometers
Gate Pad: 55 x 50
Chip Thickness: 100
Drain Pad: 55 x 50
Source Pad: 55 x 60
TYPICAL SCATTERING PARAMETERS
6
.
0
8
.
0
0
.
1
0
2.
4.
0
0
3.
0
4. 0
5.
S11
2.0
0
2
.
0
4
.
0
6
.
0
8 0
. .
0 1
Swp Max
18GHz
0
.
2
0 00
. ..
3 45
0.0
1
0
.
0
1
(TA=25 °C)
VDS = 2 V, IDS = 10 mA
Mag Max
0.15
0
9
1
2
0
1
0
5
5
7
0
6
Swp Max
18 GHz
45
13
5
30
15
0
15
165
0
-180
0.012
-0.
0.
0. 540.
3-
.4
-0
6
.
0
-
8
.
0
-
0
.
1
-
0.
2-
Swp Min
2GHz
-15
-165
S12
-3
0
50
-1
35
-1
0.075
Per Div
-4
5
0
2
1
-
5
0
1
-
9
0
7
5
60
Swp Min
2 GHz
TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County, Taiwan, R.O.C.
Web-Site: www.transcominc.com.tw
Phone: 886-6-5050086
Fax: 886-6-5051602
2/5
TC1101
REV6_20070502
Mag Max
5
0
9
1
2
0
5
7
1
0
5
Swp Max
18 GHz
0
6
6
.
0
45
13
5
0
.
1
8
.
0
Swp Max
18GHz
0
2.
4.
0
0
3.
0
4. 0
5.
S22
30
15
0
2.0
15
165
0
2
.
0
0
4
.
0
6
.
0
8 0
. .
0 1
0
.
2
0 00
. ..
3 45
0.0
1
0
.
0
1
-180
-15
-1 65
0.01-
S21
-3
0
50
-1
35
-1
1
Per Div
2
-0.
-4
5
0
2
1
-
5
0
1
-
9
0
6
0
7
5
.4
-0
6
.
0
-
Swp Min
2 GHz
FREQUENCY
S11
S21
(GHz)
MAG
ANG
MAG
ANG
2
0.9879
-20.21
4.3485
162.66
3
0.9740
-29.96
4.2452
154.28
4
0.9564
-39.31
4.1126
146.20
5
0.9364
-48.20
3.9594
138.48
6
0.9152
-56.56
3.7943
131.15
7
0.8939
-64.40
3.6242
124.22
8
0.8732
-71.72
3.4546
117.66
9
0.8536
-78.52
3.2894
111.45
10
0.8354
-84.84
3.1312
105.57
11
0.8188
-90.72
2.9813
99.99
12
0.8037
-96.18
2.8406
94.68
13
0.7901
-101.25
2.7092
89.60
14
0.7780
-105.98
2.5868
84.74
15
0.7671
-110.39
2.4731
80.07
16
0.7575
-114.51
2.3676
75.57
17
0.7491
-118.37
2.2697
71.21
18
0.7416
-121.99
2.1788
66.99
* The data does not include gate, drain and source bond wires.
TYPICAL SCATTERING PARAMETERS
6
.
0
8
.
0
0
.
1
.0
2
4.
0
Swp Max
18GHz
S11
0
2
.
0
4
.
0
6
.
0
8 0
. .
0 1
0 00
. ..
3 45
0.
2-
0
.
1
-
Swp Min
2GHz
S22
ANG
77.08
70.91
65.04
59.53
54.40
49.66
45.29
41.27
37.57
34.16
31.00
28.08
25.36
22.82
20.44
18.20
16.08
MAG
0.7367
0.7235
0.7068
0.6877
0.6676
0.6472
0.6276
0.6090
0.5919
0.5764
0.5627
0.5506
0.5402
0.5313
0.5239
0.5179
0.5132
ANG
-11.76
-17.37
-22.68
-27.66
-32.28
-36.54
-40.46
-44.06
-47.37
-50.43
-53.28
-55.93
-58.41
-60.76
-62.99
-65.12
-67.16
(TA=25 °C) VDS = 6 V, IDS = 25 mA
Mag Max
0.1
0
9
1
2
0
1
0
5
5
7
0
6
.0
1
00
.
0
1
Swp Max
18 GHz
45
13
5
0
4. 0
5.
0
.
2
8
.
0
-
S12
MAG
0.0296
0.0434
0.0560
0.0674
0.0774
0.0861
0.0937
0.1002
0.1058
0.1106
0.1148
0.1183
0.1214
0.1241
0.1264
0.1284
0.1302
0
3.
2.0
0.
0. 540.
3-
30
15
0
15
165
0
-180
0.012
-0.
0.
0. 540.
3-
.4
-0
6
.
0
-
8
.
0
-
0
.
1
-
-15
-165
S12
35
-1
0.
2-
Swp Min
2GHz
-3
0
50
-1
0.01
Per Div
-4
5
0
2
1
-
5
0
1
-
9
0
7
5
6
0
Swp Min
2 GHz
TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County, Taiwan, R.O.C.
Web-Site: www.transcominc.com.tw
Phone: 886-6-5050086
Fax: 886-6-5051602
3/5
TC1101
REV6_20070502
Mag Max
6
0
9
1
2
0
5
7
1
0
5
0
6
Swp Max
18 GHz
6
.
0
45
13
5
0
.
1
8
.
0
0
2.
4.
0
0
3.
0
4. 0
5.
S22
30
15
0
2.0
15
Swp Max
18GHz
165
0
2
.
0
0
4
.
0
6
.
0
8 0
. .
0 1
0
.
2
0 00
. ..
3 45
0.0
1
0
.
0
1
-180
0.01-
-15
-1 65
S21
-3
0
50
-1
35
-1
2
Per Div
-4
5
0
2
1
-
5
0
1
-
9
0
7
5
6
0
2
-0.
.4
-0
6
.
0
-
Swp Min
2 GHz
FREQUENCY
S11
S21
(GHz)
MAG
ANG
MAG
ANG
2
0.9861
-22.03
5.2729
161.97
3
0.9704
-32.59
5.1264
153.31
4
0.9507
-42.66
4.9406
145.03
5
0.9288
-52.16
4.7291
137.18
6
0.9059
-61.05
4.5045
129.78
7
0.8834
-69.32
4.2765
122.83
8
0.8618
-76.97
4.0524
116.31
9
0.8418
-84.05
3.8370
110.19
10
0.8234
-90.59
3.6330
104.41
11
0.8068
-96.63
3.4418
98.96
12
0.7919
-102.23
3.2639
93.79
13
0.7786
-107.40
3.0990
88.86
14
0.7668
-112.21
2.9466
84.16
15
0.7564
-116.69
2.8058
79.65
16
0.7471
-120.86
2.6758
75.31
17
0.7389
-124.76
2.5557
71.12
18
0.7316
-128.41
2.4446
67.06
*The data does not include gate, drain and source bond wires.
0.
0. 540.
38
.
0
-
0.
20
.
1
-
Swp Min
2GHz
S12
MAG
0.0218
0.0318
0.0408
0.0488
0.0558
0.0618
0.0669
0.0712
0.0749
0.0781
0.0807
0.0830
0.0850
0.0867
0.0882
0.0895
0.0906
S22
ANG
76.68
70.37
64.44
58.94
53.89
49.28
45.10
41.30
37.85
34.72
31.86
29.24
26.83
24.60
22.54
20.62
18.82
MAG
0.7718
0.7586
0.7422
0.7239
0.7050
0.6865
0.6690
0.6530
0.6386
0.6260
0.6150
0.6057
0.5978
0.5913
0.5861
0.5821
0.5790
ANG
-10.24
-15.08
-19.62
-23.82
-27.69
-31.23
-34.49
-37.49
-40.28
-42.90
-45.37
-47.73
-49.99
-52.18
-54.32
-56.41
-58.46
SMALL SIGNAL MODEL, VDS = 2 V, IDS = 10 mA
TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County, Taiwan, R.O.C.
Web-Site: www.transcominc.com.tw
Phone: 886-6-5050086
Fax: 886-6-5051602
4/5
TC1101
REV6_20070502
SCHEMATI
Lg
PARAMETERS
Cgd
Rg
Rd
0.047 nH
Rs
1.290 Ohm
Rg
1.460 Ohm
Ls
0.001 nH
Cgs
0.207 pF
Cds
0.068 pF
3.680 Ohm
Rds
321.5 Ohm
Cgd
0.027 pF
Rd
1.525 Ohm
Gm
54.80 mS
Ld
0.038 nH
T
3.340 psec
Gm
Cgs
Cds
Ri
Lg
Ld
Rds
T
Ri
Rs
Ls
SMALL SIGNAL MODEL, VDS = 6 V, IDS = 25 mA
SCHEMATI
Lg
PARAMETERS
Cgd
Rg
Rd
Gm
Cgs
Cds
Ri
Ld
Rds
T
Rs
Ls
Lg
0.047 nH
Rs
1.250 Ohm
Rg
1.460 Ohm
Ls
0.001 nH
Cgs
0.254 pF
Cds
0.067 pF
Ri
5.910 Ohm
Rds
377.8 Ohm
Cgd
0.019 pF
Rd
1.525 Ohm
Gm
66.00 mS
Ld
0.038 nH
T
3.640 psec
CHIP HANDLING
DIE ATTACHMENT: Conductive epoxy or eutectic die attach is recommended. Eutectic die attach can be
accomplished with Au-Sn (80%Au-20%Sn) perform at stage temperature: 290°C ± 5°C; Handling Tool: Tweezers;
Time: less than 1min.
WIRE BONDING: The recommended wire bond method is thermocompression bonding with 0.7 to 1.0 mil
(0.018 to 0.025 mm) gold wire. Stage temperature: 220°C to 250°C; Bond Tip Temperature: 150°C; Bond Force:
20 to 30 gms depending on size of wire and Bond Tip Temperature.
HANDLING PRECAUTIONS: The user must operate in a clean, dry environment. Care should be exercised
during handling avoid damage to the devices. Electrostatic Discharge (ESD) precautions should be observed at all
stages of storage, handling, assembly, and testing. The static discharge must be less than 300V.
TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County, Taiwan, R.O.C.
Web-Site: www.transcominc.com.tw
Phone: 886-6-5050086
Fax: 886-6-5051602
5/5