TGC4402-SM 18 – 26 GHz Packaged Upconverting Mixer Key Features • • • • • • • Measured Performance Bias conditions: Vg = -0.9 V, LO Input @ 19 dBm, IF = 2GHz @ -5 dBm Typical RF Output Frequency Range: 18 - 26 GHz IF Input Frequency Range: 0.5 – 3 GHz Conversion Loss: 9 dB Input TOI: 18 dBm LO Input Power: 19 dBm Bias: Vmxr = -0.9 V Package Dimensions: 4 x 4 x 0.9 mm Primary Applications • • Point-to-Point Radio K Band Sat-Com Product Description The TGC4402-SM upconverting mixer is designed to support a variety of millimeter wave applications including point-to-point digital radio and K band Sat-Com. The TGC4402-SM provides 9 dB nominal conversion loss across 18-26 GHz . Typical LO input drive is 19 dBm across the band. The input IF Frequency is 0.5 – 3 GHz. The TGC4402-SM requires only 2 off-chip components. Each device is 100% DC and RF tested on-wafer to ensure performance compliance. The device is available in chip form. The TGC4402-SM has a protective surface passivation layer providing environmental robustness. Lead-free and RoHS compliant Datasheet subject to change without notice. TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 [email protected] April 2012 © Rev A 1 Table I Absolute Maximum Ratings 1/ Symbol Vmxr Pin 1/ Parameter TGC4402-SM Value Notes Gate Supply Voltage Range -5 - 0 V LO Input Continuous Wave Power 25 dBm These ratings represent the maximum operable values for this device. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device and / or affect device lifetime. These are stress ratings only, and functional operation of the device at these conditions is not implied. Table II Recommended Operating Conditions Symbol Vmxr Parameter Value Gate Voltage -0.9 V Table III RF Characterization Table Bias: Vmxr = -0.9 V, TA= 25 °C + 5°C SYMBOL NOMINAL UNITS RF Output Frequencies 18 - 26 GHz FIF IF Input Frequency 0.5 - 3 GHz FLO LO Input Frequency 16 - 26 GHz PLO LO Input Power f = 16 - 26 GHz 19 dBm Conversion Loss f = 18 - 26 GHz 9 dB Input TOI f = 18 - 26 GHz 18 dBm LO – RF Output Isolation f = 16 - 26 GHz 40 dB Conversion Loss Temperature Coefficient f = 16 - 26 GHz -0.006 dB / °C FOUT ITOI PARAMETER TEST CONDITIONS 2 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 [email protected] April 2012 © Rev A TGC4402-SM Table IV Power Dissipation and Thermal Properties Parameter Test Conditions Value Maximum Power Dissipation Tbaseplate = 70 ºC Pd = 0.45 W Tchannel = 138 ºC Tm = 1.0E+6 Hrs Thermal Resistance, θjc LO input power is 17 dBm θjc = 76 (ºC/W) Tchannel = 121 ºC Tm = >1E+6 Hrs 30 seconds 320 ºC Max Mounting Temperature Storage Temperature 1/ Notes 1/ 2/ -65 to 150 ºC For a median life, Tm, of 1E+6 hours, power dissipation is limited to Pd(max) = (TBD ºC – Tbase ºC)/θjc. 2/ Channel operating temperature will directly affect the device median time to failure (MTTF). For maximum life, it is recommended that channel temperatures be maintained at the lowest possible levels. 3 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 [email protected] April 2012 © Rev A Measured Data TGC4402-SM Bias conditions: Vg = -0.9 V, LO Input @ + 19 dBm, IF = 2 GHz @ -5 dBm Typical 4 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 [email protected] April 2012 © Rev A Measured Data TGC4402-SM Bias conditions: Vg = -0.9 V, LO Input @ 20 GHz @ 19 dBm, IF = -5 dBm Typical 5 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 [email protected] April 2012 © Rev A Measured Data TGC4402-SM Bias conditions: Vg = -0.9 V, LO Input = 19 dBm, LO Freq = 20 GHz 6 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 [email protected] April 2012 © Rev A Measured Data TGC4402-SM Bias conditions: Vg = -0.9 V, IF = 2 GHz @ -5 dBm Typical 7 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 [email protected] April 2012 © Rev A TGC4402-SM Package Pinout PIN #1 IDENTIFICATION PIN #1 DOT 13 15 14 16 12 1 11 2 17 10 3 9 4 8 TOP VIEW 7 6 5 BOTTOM VIEW Pin Description 1, 3, 4, 6, 8, 9, 10, 11, 12, 14, 16 N/C 2 IF Input 5, 13 Vmxr 7 LO Input 15 RF Out 17 GND 8 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 [email protected] April 2012 © Rev A TGC4402-SM Electrical Schematic IF In LO In RF Out TGC4402-SM 100 pF Vmxr Bias Procedures Bias-up Procedure • Vmxr set to -0.9 V • Apply signal to IF input • Apply signal to LO input Bias-down Procedure • Turn off IF and LO signals • Set Vmxr to 0 V 9 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 [email protected] April 2012 © Rev A Mechanical Drawing Units: Millimeters TGC4402-SM GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test. 10 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 [email protected] April 2012 © Rev A TGC4402-SM Recommended Assembly Diagram Part Description C1 (optional) 1 uF Capacitor (0402) C2, C3 100 pF Capacitor (0402) R1 0 ohm Resistor (0603) GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test. TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 [email protected] April 2012 © Rev A 11 TGC4402-SM Assembly Notes Recommended Surface Mount Package Assembly • Proper ESD precautions must be followed while handling packages. • Clean the board with acetone. Rinse with alcohol. Allow the circuit to fully dry. • TriQuint recommends using a conductive solder paste for attachment. Follow solder paste and reflow oven vendors’ recommendations when developing a solder reflow profile. Typical solder reflow profiles are listed in the table below. • Hand soldering is not recommended. Solder paste can be applied using a stencil printer or dot placement. The volume of solder paste depends on PCB and component layout and should be well controlled to ensure consistent mechanical and electrical performance. • Clean the assembly with alcohol. Typical Solder Reflow Profiles Reflow Profile SnPb Pb Free Ramp-up Rate 3 °C/sec 3 °C/sec Activation Time and Temperature 60 – 120 sec @ 140 – 160 °C 60 – 180 sec @ 150 – 200 °C Time above Melting Point 60 – 150 sec 60 – 150 sec Max Peak Temperature 240 °C 260 °C Time within 5 °C of Peak Temperature 10 – 20 sec 10 – 20 sec Ramp-down Rate 4 – 6 °C/sec 4 – 6 °C/sec Ordering Information Part Package Style TGC4402-SM QFN 4x4 Surface Mount GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test. 12 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 [email protected] April 2012 © Rev A