NSC 54FCT273FMQB

54FCT273
Octal D-Type Flip-Flop
General Description
Features
The ’FCT273 has eight edge-triggered D-type flip-flops with
individual D inputs and Q outputs. The common buffered
Clock (CP) and Master Reset (MR) inputs load and reset
(clear) all flip-flops simultaneously.
The register is fully edge-triggered. The state of each D input, one setup time before the LOW-to-HIGH clock transition, is transferred to the corresponding flip-flop’s Q output.
All outputs will be forced LOW independently of Clock or
Data inputs by a LOW voltage level on the MR input. The device is useful for applications where the true output only is required and the Clock and Master Reset are common to all
storage elements.
n
n
n
n
n
n
n
Eight edge-triggered D flip-flops
Buffered common clock
Buffered, asynchronous Master Reset
See ’FCT377 for clock enable version
See ’FCT373 for transparent latch version
See ’FCT374 for TRI-STATE ® version
Output sink capability of 32 mA, source capability of
12 mA
n TTL input and output level compatible
n CMOS power consumption
n Standard Microcircuit Drawing (SMD) 5962-8765601
Ordering Code
Military
Package
Package Description
Number
54FCT273DMQB
J20A
20-Lead Ceramic Dual-In-Line
54FCT273FMQB
W20A
20-Lead Cerpack
54FCT273LMQB
E20A
20-Lead Ceramic Leadless Chip Carrier, Type C
Connection Diagrams
Pin Assignment for DIP
and Flatpack
Pin Assignment
for LCC
DS100956-2
DS100956-1
Pin
Description
Names
D0–D7
Data Inputs
MR
Master Reset
CP
Clock Pulse Input
Q0–Q7
Data Outputs
(Active LOW)
(Active Rising Edge)
TRI-STATE ® is a registered trademark of National Semiconductor Corporation.
© 1998 National Semiconductor Corporation
DS100956
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54FCT273 Octal D-Type Flip-Flop
August 1998
Truth Table
H = HIGH Voltage Level steady state
h = HIGH Voltage Level one setup time prior to the LOW-to-HIGH clock transition
L = LOW Voltage Level steady state
I = LOW Voltage Level one setup time prior to the LOW-to-HIGH clock transition
X = Immaterial
N = LOW-to-HIGH clock transition
Mode Select-Function Table
Operating Mode
Inputs
Output
MR
CP
Dn
Reset (Clear)
L
X
X
L
Load “1”
H
N
h
H
Load “0”
H
N
l
L
Qn
Logic Diagram
DS100956-3
Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.
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2
Absolute Maximum Ratings (Note 1)
Current Applied to Output
in LOW State (Max)
twice the rated IOL (mA)
DC Latchup Source Current
−500 mA
(Across Comm Operating Range)
Over Voltage Latchup
VCC + 4.5V
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Storage Temperature
Ambient Temperature under Bias
Junction Temperature under Bias
Ceramic
VCC Pin Potential to
Ground Pin
Input Voltage (Note 2)
Input Current (Note 2)
Voltage Applied to Any Output
in the Disabled or
Power-Off State
in the HIGH State
−65˚C to +150˚C
−55˚C to +125˚C
Recommended Operating
Conditions
−55˚C to +175˚C
Free Air Ambient Temperature
Military
Supply Voltage
Military
−0.5V to +7.0V
−0.5V to +7.0V
−30 mA to +5.0 mA
−55˚C to +125˚C
+4.5V to +5.5V
Note 1: Absolute maximum ratings are values beyond which the device may
be damaged or have its useful life impaired. Functional operation under these
conditions is not implied.
−0.5V to +4.75V
−0.5V to VCC
Note 2: Either voltage limit or current limit is sufficient to protect inputs.
DC Electrical Characteristics
Symbol
Parameter
FCT240
Min
Max
Units
VCC
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
VCD
Input Clamp Diode Voltage
VOH
Output HIGH
Voltage
54FCT
4.3
V
Min
54FCT
2.4
V
Min
Output LOW
Voltage
54FCT
0.2
V
Min
54FCT
0.5
V
Min
5
µA
Max
VOL
2.0
Conditions
V
Recognized HIGH Signal
0.8
V
−1.2
V
Recognized LOW Signal
IIN = −18 mA
Min
IOH = −300 uA
IOH = −12 mA
IOL = 300 µA
IOL = 32 mA
VIN = 5.5V
IIH
Input HIGH Current
IIL
Input LOW Current
−5
µA
Max
IOS
Output Short-Circuit Current
−60
mA
Max
VIN = 0.0V
VOUT = 0.0V
ICCQ
Power Supply Current
1.5
mA
Max
VIN = 0.2V or VIN = 5.3V
∆ICC
Power Supply Current
2.0
mA
Max
ICCT
Total Power Supply Current
6.0
mA
Max
4.0
mA
Max
VIN = 3.4V
VIN = 3.4V or VIN = GND, OE =
GND, fI = 10Mhz, outputs open,
one bit toggling - 50% duty cycle
VIN = 5.3V or VIN = 0.2V,OE =
GND, fI = 10Mhz, outputs open,
one bit toggling - 50% duty cycle
Outputs Open,OE = GND, One Bit
Toggling, 50% Duty Cycle
ICCD
Dynamic ICC
0.25 mA/MHz
Max
AC Electrical Characteristics
Symbol
Parameter
54FCT
TA = −55˚C to +125˚C
VCC = 4.5V to 5.5V
Units
Fig. No.
ns
Figures 2, 5
ns
Figures 2, 5
CL = 50 pF
Min
Max
tPLH
Propagation Delay
2.0
15.0
tPHL
CP to On
2.0
15.0
tPHL
Propagation Delay
2.0
15.0
MR to On
3
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AC Operating Requirements
Symbol
54FCT
TA = −55˚C to +125˚C
VCC = 4.5V to 5.5V
Parameter
Units
Fig. No.
ns
Figure 6
ns
Figure 6
ns
Figure 2
CL = 50 pF
Min
Max
ts(H)
Setup Time, HIGH
3.5
ts(L)
or LOW Dn to CP
3.5
th(H)
Hold Time, HIGH
2.5
th(L)
or LOW Dn to CP
2.5
tw(H)
Pulse Width, CP,
7.0
tw(L)
HIGH or LOW
7.0
Master Reset Pulse
7.0
ns
Figure 2
5.0
ns
Figure 6
tw(L)
Width, LOW
tREC
Recovery Time
MR to CP
Capacitance
Symbol
Parameter
Max
Units
CIN
Input Capacitance
10
pF
COUT (Note 3)
Output Capacitance
12
pF
Note 3: COUT is measured at frequency f = 1 MHz, per MIL-STD-833B, Method 3012.
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4
Conditions
TA = 25˚C
VCC = 0V
VCC = 5.0V
AC Loading
DS100956-4
DS100956-6
*Includes jig and probe capacitance
FIGURE 3. VM = 1.5V
Input Pulse Requirements
FIGURE 1. Standard AC Test Load
Amplitude
Rep. Rate
tw
tr
tf
3.0V
1 MHz
500 ns
2.5 ns
2.5 ns
FIGURE 4. Test Input Signal Requirements
DS100956-5
FIGURE 2. Propagation Delay,
Pulse Width Waveforms
DS100956-8
FIGURE 5. Propagation Delay Waveforms for
Inverting and Non-Inverting Functions
DS100956-9
FIGURE 6. Setup Time, Hold Time
and Recovery Time Waveforms
5
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6
Physical Dimensions
inches (millimeters) unless otherwise noted
20-Terminal Ceramic Chip Carrier (L)
NS Package Number E20A
20-Lead Ceramic Dual-In-Line (D)
NS Package Number J20A
7
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54FCT273 Octal D-Type Flip-Flop
Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
20-Lead Ceramic Flatpak (F)
NS Package Number W20A
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