TYSEMI WNM4006-3TR

Product specification
WNM4006
Single N-Channel, 45V, 1.7A, Power MOSFET
VDS (V)
Rds(on) (ȍ)
0.126@ VGS=10V
45
0.142@ VGS=4.5V
0.147@ VGS=4.0V
0.208@ VGS=2.5V
SOT-23
Descriptions
D
3
The WNM4006 is N-Channel enhancement
MOS Field Effect Transistor. Uses advanced trench
technology and design to provide excellent RDS (ON)
with low gate charge. This device is suitable for use
in DC-DC conversion, power switch and charging
1
2
circuit. Standard Product WNM4006 is Pb-free.
G
S
Pin configuration (Top view)
Features
z
Trench Technology
z
Supper high density cell design
z
Excellent ON resistance for higher DC current
z
Extremely Low Threshold Voltage
z
Small package SOT-23
W46*
W46
= Device Code
*
= Month (A~Z)
Applications
Marking
z
Driver for Relay, Solenoid, Motor, LED etc.
z
DC-DC converter circuit
z
Power Switch
z
Load Switch
z
Charging
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Order information
Device
Package
Shipping
WNM4006-3/TR
SOT-23
3000/Reel&Tape
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1 of 3
Product specification
WNM4006
Absolute Maximum ratings
Parameter
Symbol
10 S
Steady State
Drain-Source Voltage
VDS
45
Gate-Source Voltage
VGS
±20
TA=25°C
Continuous Drain Current a
TA=70°C
TA=25°C
Maximum Power Dissipation a
TA=70°C
TA=25°C
Continuous Drain Current b
TA=70°C
TA=25°C
Maximum Power Dissipation b
TA=70°C
ID
PD
ID
PD
Unit
V
1.7
1.5
1.3
1.2
0.8
0.7
0.5
0.4
1.5
1.4
1.2
1.1
0.7
0.6
0.4
0.3
A
W
A
W
Pulsed Drain Current c
IDM
8
A
Operating Junction Temperature
TJ
150
°C
Lead Temperature
TL
260
°C
Storage Temperature Range
Tstg
-55 to 150
°C
Thermal resistance ratings
Parameter
Junction-to-Ambient Thermal Resistance a
Junction-to-Ambient Thermal Resistance b
Junction-to-Case Thermal Resistance
Symbol
t ” 10 s
Steady State
t ” 10 s
Steady State
Steady State
RșJA
RșJA
RșJC
Typical
Maximum
120
145
132
170
145
174
158
202
60
75
a
Surface mounted on FR-4 Board using 1 square inch pad size, 1oz copper
b
Surface mounted on FR-4 board using minimum pad size, 1oz copper
c
Pulse width<380μs, Duty Cycle<2%
d
Maximum junction temperature TJ=150°C.
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Unit
°C/W
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Product specification
WNM4006
o
Electronics Characteristics (Ta=25 C, unless otherwise noted)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Drain-to-Source Breakdown Voltage
BVDSS
VGS = 0 V, ID = 250uA
Zero Gate Voltage Drain Current
IDSS
VDS = 45 V, VGS = 0V
Gate-to-source Leakage Current
IGSS
VDS = 0 V, VGS =±20V
VGS(TH)
VGS = VDS, ID = 250uA
45
V
1
uA
100
nA
1.2
1.5
V
VGS = 10V, ID = 2.0A
126
160
VGS = 4.5V, ID = 2.0A
142
180
VGS = 4.0V, ID = 2.0A
147
185
VGS = 2.5V, ID = 1.5A
208
250
gFS
VDS =10V, ID = 2.0A
3
CISS
VGS = 0 V,
315
Output Capacitance
COSS
f = 1.0 MHz,
18
Reverse Transfer Capacitance
CRSS
VDS = 25 V
15
Total Gate Charge
QG(TOT)
Threshold Gate Charge
QG(TH)
Gate-to-Source Charge
QGS
Gate-to-Drain Charge
QGD
ON CHARACTERISTICS
Gate Threshold Voltage
Drain-to-source On-resistance
b, c
Forward Transconductance
CAPACITANCES,
RDS(on)
0.5
mŸ
S
CHARGES
Input Capacitance
VGS = 4.5 V,
VDS = 25 V,
ID = 2.0A
pF
4.20
0.51
nC
0.76
1.85
SWITCHING CHARACTERISTICS
Turn-On Delay Time
td(ON)
VGS = 10 V,
4.8
Rise Time
tr
VDS =25 V,
3.0
Turn-Off Delay Time
td(OFF)
RL=25Ÿ,
27
Fall Time
tf
RG=6 Ÿ
2.6
VSD
VGS = 0 V, IS = 0.8A
0.8
ns
BODY DIODE CHARACTERISTICS
Forward Voltage
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1.5
V
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