NSC LMK03001CISQX

LMK03000 Family
Precision Clock Conditioner with Integrated VCO
General Description
Features
The LMK03000 family of precision clock conditioners combine the functions of jitter cleaning/reconditioning, multiplication, and distribution of a reference clock. The devices
integrate a Voltage Controlled Oscillator (VCO), a high performance Integer-N Phase Locked Loop (PLL), a partially
integrated loop filter, and up to eight outputs in various LVDS
and LVPECL combinations.
The VCO output is optionally accessible on the Fout port. Internally, the VCO output goes through a VCO Divider to feed
the various clock distribution blocks.
Each clock distribution block includes a programmable divider, a phase synchronization circuit, a programmable delay,
a clock output mux, and an LVDS or LVPECL output buffer.
This allows multiple integer-related and phase-adjusted
copies of the reference to be distributed to eight system components.
The clock conditioners come in a 48-pin LLP package and are
footprint compatible with other clocking devices in the same
family.
■
■
■
■
■
■
■
■
■
phase noise contribution of -224 dBc/Hz
VCO divider values of 2 to 8 (all divides)
Channel divider values of 1, 2 to 510 (even divides)
3 LVDS and 5 LVPECL clock outputs
Partially integrated loop filter
Dedicated divider and delay blocks on each clock output
Pin compatible family of clocking devices
3.15 to 3.45 V operation
Package: 48 pin LLP (7.0 x 7.0 x 0.8 mm)
200 fs RMS Clock generator performance (10 Hz to 20
MHz) with a clean input clock
Part
Data Converter Clocking
Networking, SONET/SDH, DSLAM
Wireless Infrastructure
Medical
Test and Measurement
Military / Aerospace
VCO Frequency
Range (MHz)
RMS Jitter (fs)
LMK03000C
LMK03000
Target Applications
■
■
■
■
■
■
■ Integrated VCO with very low phase noise floor
■ Integrated Integer-N PLL with outstanding normalized
400
1185 - 1296
800
LMK03000D
1200
LMK03001C
400
LMK03001
LMK03001D
1470 - 1570
800
1200
System Diagram
20211440
TRI-STATE® is a registered trademark of National Semiconductor Corporation.
© 2008 National Semiconductor Corporation
202114
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LMK03000 Family Precision Clock Conditioner with Integrated VCO
March 26, 2008
LMK03000 Family
Functional Block Diagram
20211401
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LMK03000 Family
Connection Diagram
48-Pin LLP Package
20211402
3
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LMK03000 Family
Pin Descriptions
Pin #
Pin Name
I/O
1, 25
GND
-
Ground
2
Fout
O
Internal VCO Frequency Output
-
Power Supply
3, 8, 13, 16, 19, 22,
Vcc1, Vcc2, Vcc3, Vcc4, Vcc5, Vcc6, Vcc7, Vcc8, Vcc9, Vcc10,
26, 30, 31, 33, 37,
Vcc11, Vcc12, Vcc13, Vcc14
40, 43, 46
Description
4
CLKuWire
I
MICROWIRE Clock Input
5
DATAuWire
I
MICROWIRE Data Input
6
LEuWire
I
MICROWIRE Latch Enable Input
7, 34, 35
NC
-
No Connection to these pins
9, 10
LDObyp1, LDObyp2
-
LDO Bypass
11
GOE
I
Global Output Enable
12
LD
O
Lock Detect and Test Output
14, 15
CLKout0, CLKout0*
O
LVDS Clock Output 0
17, 18
CLKout1, CLKout1*
O
LVDS Clock Output 1
20, 21
CLKout2, CLKout2*
O
LVDS Clock Output 2
23, 24
CLKout3, CLKout3*
O
LVPECL Clock Output 3
27
SYNC*
I
Global Clock Output Synchronization
28, 29
OSCin, OSCin*
I
Oscillator Clock Input; Should be AC
coupled
32
CPout
O
Charge Pump Output
36
Bias
I
Bias Bypass
38, 39
CLKout4, CLKout4*
O
LVPECL Clock Output 4
41, 42
CLKout5, CLKout5*
O
LVPECL Clock Output 5
44, 45
CLKout6, CLKout6*
O
LVPECL Clock Output 6
47, 48
CLKout7, CLKout7*
O
LVPECL Clock Output 7
DAP
DAP
-
Die Attach Pad is Ground
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If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors
for availability and specifications.
Parameter
Symbol
VCC
Ratings
Units
-0.3 to 3.6
V
VIN
-0.3 to (VCC + 0.3)
V
TSTG
-65 to 150
°C
Lead Temperature (solder 4 s)
TL
+260
°C
Junction Temperature
TJ
125
°C
Power Supply Voltage
Input Voltage
Storage Temperature Range
Recommended Operating Conditions
Symbol
TA
Min
Typ
Max
Units
Ambient Temperature
Parameter
-40
25
85
°C
Power Supply Voltage
VCC
3.15
3.3
3.45
V
Note 1: "Absolute Maximum Ratings" indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability
and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in
the Recommended Operating Conditions is not implied. The Recommended Operating Conditions indicate conditions at which the device is functional and the
device should not be operated beyond such conditions.
Note 2: This device is a high performance integrated circuit with ESD handling precautions. Handling of this device should only be done at ESD protected work
stations. The device is rated to a HBM-ESD of > 2 kV, a MM-ESD of > 200 V, and a CDM-ESD of > 1.2 kV.
Package Thermal Resistance
Package
θJA
θJ-PAD (Thermal Pad)
48-Lead LLP (Note 3)
27.4° C/W
5.8° C/W
Note 3: Specification assumes 16 thermal vias connect the die attach pad to the embedded copper plane on the 4-layer JEDEC board. These vias play a key
role in improving the thermal performance of the LLP. It is recommended that the maximum number of vias be used in the board layout.
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LMK03000 Family
Absolute Maximum Ratings (Notes 1, 2)
LMK03000 Family
Electrical Characteristics
(Note 4)
(3.15 V ≤ Vcc ≤ 3.45 V, -40 °C ≤ TA ≤ 85 °C, Differential Inputs/Outputs; Vboost=0; except as specified. Typical values represent
most likely parametric norms at Vcc = 3.3 V, TA = 25 °C, and at the Recommended Operation Conditions at the time of product
characterization and are not guaranteed).
Symbol
Parameter
Conditions
Min
Typ
Max
Units
Current Consumption
ICC
ICCPD
Entire device; CLKout0 & CLKout4
enabled; no divide; no delay.
Power Supply Current
(Note 5)
Power Down Current
161.8
mA
Entire device; All Outputs Off (no
emitter resistors placed)
86
POWERDOWN = 1
1
mA
Reference Oscillator
Reference Oscillator Input Frequency
fOSCinsquare
Range for Square Wave
VOSCinsquare
Square Wave Input Voltage for OSCin and
OSCin*
1
200
MHz
0.2
1.6
Vpp
40
MHz
AC coupled; Differential (VOD)
PLL
fCOMP
Phase Detector Frequency
VCPout = Vcc/2, PLL_CP_GAIN = 1x
ISRCECPout
Charge Pump Source Current
100
VCPout = Vcc/2, PLL_CP_GAIN = 4x
400
VCPout = Vcc/2, PLL_CP_GAIN = 16x
1600
VCPout = Vcc/2, PLL_CP_GAIN = 32x
3200
µA
PLL (Continued)
VCPout = Vcc/2, PLL_CP_GAIN = 1x
-100
VCPout = Vcc/2, PLL_CP_GAIN = 4x
-400
VCPout = Vcc/2, PLL_CP_GAIN = 16x
-1600
VCPout = Vcc/2, PLL_CP_GAIN = 32x
-3200
μA
ISINKCPout
Charge Pump Sink Current
ICPoutTRI
Charge Pump TRI-STATE® Current
0.5 V < VCPout < Vcc - 0.5 V
2
ICPout%MIS
Magnitude of Charge Pump
Sink vs. Source Current Mismatch
VCPout = Vcc / 2
TA = 25°C
3
%
0.5 V < VCPout < Vcc - 0.5 V
TA = 25°C
4
%
4
%
Magnitude of Charge Pump
ICPoutVTUNE Current vs. Charge Pump Voltage
Variation
ICPoutTEMP
Magnitude of Charge Pump Current vs.
Temperature Variation
PN10kHz
PLL 1/f Noise at 10 kHz Offset (Note 6)
Normalized to 1 GHz Output Frequency
PLL_CP_GAIN = 1x
-117
PLL_CP_GAIN = 32x
-122
PN1Hz
Normalized Phase Noise Contribution
(Note 7)
PLL_CP_GAIN = 1x
-219
PLL_CP_GAIN = 32x
-224
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6
10
nA
dBc/Hz
dBc/Hz
Parameter
Conditions
Min
Typ
Max
LMK03000C/LMK03000/LMK03000D
1185
1296
LMK03001C/LMK03001/LMK03001D
1470
1570
Units
VCO
fFout
VCO Tuning Range
|ΔTCL|
Allowable Temperature Drift for
Continuous Lock
pFout
Output Power to a 50 Ω load driven by Fout
KVtune
Fine Tuning Sensitivity (Note 9)
JRMSFout
Fout RMS Period Jitter
(12 kHz to 20 MHz bandwidth)
After programming R15 for lock, no
changes to output configuration are
permitted to guarantee continuous
lock. (Note 8)
LMK03000C/LMK03000/LMK03000D;
TA = 25 °C
3.3
LMK03001C/LMK03001/LMK03001D;
TA = 25 °C
2.7
LMK03000C/LMK03000/LMK03000D
7 to 9
LMK03001C/LMK03001/LMK03001D
9 to 11
LMK03000C/LMK03001C
800
1200
Fout Single Side Band Phase Noise
LMK03001C
fFout = 1570 MHz
(Note 10)
LMK03001C
fFout = 1470 MHz
(Note 10)
7
MHz/V
400
LMK03000D/LMK03001D
LMK03000C
fFout = 1185 MHz
(Note 10)
°C
dBm
LMK03000/LMK03001
LMK03000C
fFout = 1296 MHz
(Note 10)
L(f)Fout
125
MHz
10 kHz Offset
-91.4
100 kHz Offset
-116.8
1 MHz Offset
-137.8
10 MHz Offset
-156.9
10 kHz Offset
-93.5
100 kHz Offset
-118.5
1 MHz Offset
-139.4
10 MHz Offset
-158.4
10 kHz Offset
-89.6
100 kHz Offset
-115.2
1 MHz Offset
-136.5
10 MHz Offset
-156.0
10 kHz Offset
-91.6
100 kHz Offset
-116.0
1 MHz Offset
-137.9
10 MHz Offset
-156.2
fs
dBc/Hz
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LMK03000 Family
Symbol
LMK03000 Family
Symbol
Parameter
Conditions
Min
Typ
Max
Units
Clock Distribution Section (Note 11) - LVDS Clock Outputs (CLKout0 to CLKout2)
JitterADD
RL = 100 Ω
Distribution Path =
765 MHz
Bandwidth =
12 kHz to 20 MHz
Additive RMS Jitter (Note 11)
CLKoutX_MUX
= Bypass (no
divide or delay)
20
CLKoutX_MUX
= Divided (no
delay)
CLKoutX_DIV =
4
fs
75
tSKEW
CLKoutX to CLKoutY (Note 12)
Equal loading and identical clock
configuration
RL = 100 Ω
-30
±4
30
ps
VOD
Differential Output Voltage
RL = 100 Ω
250
350
450
mV
ΔVOD
Change in magnitude of VOD for
complementary output states
RL = 100 Ω
-50
50
mV
VOS
Output Offset Voltage
RL = 100 Ω
1.070
1.370
V
ΔVOS
Change in magnitude of VOS for
complementary output states
RL = 100 Ω
-35
35
mV
ISA
ISB
Clock Output Short Circuit Current
single-ended
Single-ended outputs shorted to GND
-24
24
mA
ISAB
Clock Output Short Circuit Current
differential
Complementary outputs tied together
-12
12
mA
1.25
Clock Distribution Section (Note 11) - LVPECL Clock Outputs (CLKout3 to CLKout7)
JitterADD
RL = 100 Ω
Distribution Path =
765 MHz
Bandwidth =
12 kHz to 20 MHz
Additive RMS Jitter (Note 11)
tSKEW
CLKoutX to CLKoutY (Note 12)
VOH
Output High Voltage
CLKoutX_MUX
= Bypass (no
divide or delay)
20
CLKoutX_MUX
= Divided (no
delay)
CLKoutX_DIV =
4
Equal loading and identical clock
configuration
Termination = 50 Ω to Vcc - 2 V
fs
75
-30
Termination = 50 Ω to Vcc - 2 V
±3
30
ps
Vcc 0.98
V
Vcc 1.8
V
VOL
Output Low Voltage
VOD
Differential Output Voltage
VIH
High-Level Input Voltage
VIL
Low-Level Input Voltage
0.8
V
IIH
High-Level Input Current
VIH = Vcc
-5.0
5.0
µA
IIL
Low-Level Input Current
VIL = 0
-40.0
5.0
µA
Vcc 0.4
RL = 100 Ω
660
810
965
mV
Vcc
V
Digital LVTTL Interfaces (Note 13)
2.0
VOH
High-Level Output Voltage
IOH = +500 µA
VOL
Low-Level Output Voltage
IOL = -500 µA
VIH
High-Level Input Voltage
VIL
Low-Level Input Voltage
0.4
V
IIH
High-Level Input Current
VIH = Vcc
-5.0
5.0
µA
IIL
Low-Level Input Current
VIL = 0
-5.0
5.0
µA
V
0.4
V
Vcc
V
Digital MICROWIRE Interfaces (Note 14)
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1.6
8
Parameter
Conditions
Min
Typ
Max
Units
MICROWIRE Timing
tCS
Data to Clock Set Up Time
See Data Input Timing
tCH
Data to Clock Hold Time
tCWH
Clock Pulse Width High
tCWL
tES
25
ns
See Data Input Timing
8
ns
See Data Input Timing
25
ns
Clock Pulse Width Low
See Data Input Timing
25
ns
Clock to Enable Set Up Time
See Data Input Timing
25
ns
tCES
Enable to Clock Set Up Time
See Data Input Timing
25
ns
tEWH
Enable Pulse Width High
See Data Input Timing
25
ns
Note 4: The Electrical Characteristics table lists guaranteed specifications under the listed Recommended Operating Conditions except as otherwise modified
or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not guaranteed.
Note 5: See 3.5 for more current consumption / power dissipation calculation information.
Note 6: A specification in modeling PLL in-band phase noise is the 1/f flicker noise, LPLL_flicker(f), which is dominant close to the carrier. Flicker noise has a 10
dB/decade slope. PN10kHz is normalized to a 10 kHz offset and a 1 GHz carrier frequency. PN10kHz = LPLL_flicker(10 kHz) - 20log(Fout / 1 GHz), where LPLL_flicker
(f) is the single side band phase noise of only the flicker noise's contribution to total noise, L(f). To measure LPLL_flicker(f) it is important to be on the 10 dB/decade
slope close to the carrier. A high compare frequency and a clean crystal are important to isolating this noise source from the total phase noise, L(f). LPLL_flicker(f)
can be masked by the reference oscillator performance if a low power or noisy source is used. The total PLL inband phase noise performance is the sum of
LPLL_flicker(f) and LPLL_flat(f).
Note 7: A specification in modeling PLL in-band phase noise is the Normalized Phase Noise Contribution, LPLL_flat(f), of the PLL and is defined as PN1Hz =
LPLL_flat(f) – 20log(N) – 10log(fCOMP). LPLL_flat(f) is the single side band phase noise measured at an offset frequency, f, in a 1 Hz Bandwidth and fCOMP is the phase
detector frequency of the synthesizer. LPLL_flat(f) contributes to the total noise, L(f). To measure LPLL_flat(f) the offset frequency, f, must be chosen sufficiently
smaller then the loop bandwidth of the PLL, and yet large enough to avoid a substantial noise contribution from the reference and flicker noise. LPLL_flat(f) can be
masked by the reference oscillator performance if a low power or noisy source is used.
Note 8: Allowable Temperature Drift for Continuous Lock is how far the temperature can drift in either direction and stay in lock from the ambient temperature
and programmed state at which the device was when register R15 was programmed. The action of programming the R15 register, even to the same value,
activates a frequency calibration routine. This implies that the device will work over the entire frequency range, but if the temperature drifts more than the maximum
allowable drift for continuous lock, then it will be necessary to reprogram the R15 register to ensure that the device stays in lock. Regardless of what temperature
the device was initially programmed at, the ambient temperature can never drift outside the range of -40 °C ≤ TA ≤ 85 °C without violating specifications. For
this specification to be valid, the programmed state of the device must not change after R15 is programmed.
Note 9: The lower sensitivity indicates the typical sensitivity at the lower end of the tuning range, the higher sensitivity at the higher end of the tuning range
Note 10: VCO phase noise is measured assuming the VCO is the dominant noise source due to a 75 Hz loop bandwidth. Over frequency, the phase noise typically
varies by 1 to 2 dB, with the worst case performance typically occurring at the highest frequency. Over temperature, the phase noise typically varies by 1 to 2 dB,
assuming the device is not reprogrammed. Reprogramming R15 will run the frequency calibration routine for optimum phase noise.
Note 11: The Clock Distribution Section includes all parts of the device except the PLL and VCO sections. Typical Additive Jitter specifications apply to the clock
distribution section only and this adds in an RMS fashion to the shaped jitter of the PLL and the VCO.
Note 12: Specification is guaranteed by characterization and is not tested in production.
Note 13: Applies to GOE, LD, and SYNC*.
Note 14: Applies to CLKuWire, DATAuWire, and LEuWire.
Serial Data Timing Diagram
20211403
Data bits set on the DATAuWire signal are clocked into a shift register, MSB first, on each rising edge of the CLKuWire signal. On
the rising edge of the LEuWire signal, the data is sent from the shift register to the addressed register determined by the LSB bits.
After the programming is complete the CLKuWire, DATAuWire, and LEuWire signals should be returned to a low state. It is recommended that the slew rate of CLKuWire, DATAuWire, and LEuWire should be at least 30 V/μs.
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LMK03000 Family
Symbol
LMK03000 Family
Charge Pump Current Specification Definitions
20211431
I1 = Charge Pump Sink Current at VCPout = Vcc - ΔV
I2 = Charge Pump Sink Current at VCPout = Vcc/2
I3 = Charge Pump Sink Current at VCPout = ΔV
I4 = Charge Pump Source Current at VCPout = Vcc - ΔV
I5 = Charge Pump Source Current at VCPout = Vcc/2
I6 = Charge Pump Source Current at VCPout = ΔV
ΔV = Voltage offset from the positive and negative supply rails. Defined to be 0.5 V for this device.
Charge Pump Output Current Magnitude Variation vs. Charge Pump Output Voltage
20211432
Charge Pump Sink Current vs. Charge Pump Output Source Current Mismatch
20211433
Charge Pump Output Current Magnitude Variation vs. Temperature
20211434
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LVDS Peak to Peak Voltage (Single-Ended)
LVPECL Peak to Peak Voltage (Differential)
20211407
20211408
LVDS Output Buffer Noise Floor (Note 16)
LVPECL Output Buffer Noise Floor (Note 16)
20211409
20211410
Delay Noise Floor (Notes 16, 17)
20211412
Note 15: These plots show performance at frequencies beyond what the part is guaranteed to operate at to give the user an idea of the capabilities of the part,
but they do not imply any sort of guarantee.
Note 16: To estimate this noise, only the output frequency is required. Divide value and input frequency are not integral.
Note 17: The noise of the delay block is independent of output type and only applies if the delay is enabled. The noise floor due to the distribution section
accounting for the delay nise can be calculated as: Total Output Noise = 10 × log(10Output Buffer Noise/10 + 10Delay Noise Floor/10).
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LMK03000 Family
Typical Performance Characteristics (Note 15)
LMK03000 Family
be disabled simultaneously by pulling the GOE pin low or
programming EN_CLKout_Global to 0.
The duty cycle of the LVDS and LVPECL clock outputs are
shown in the table below.
1.0 Functional Description
The LMK03000 family of precision clock conditioners combine the functions of jitter cleaning/reconditioning, multiplication, and distribution of a reference clock. The devices
integrate a Voltage Controlled Oscillator (VCO), a high performance Integer-N Phase Locked Loop (PLL), a partially
integrated loop filter, three LVDS, and five LVPECL clock output distribution blocks.
The devices include internal 3rd and 4th order poles to simplify loop filter design and improve spurious performance. The
1st and 2nd order poles are off-chip to provide flexibility for
the design of various loop filter bandwidths.
The LMK03000 family has multiple options for VCO frequencies. The VCO output is optionally accessible on the Fout port.
Internally, the VCO output goes through an VCO Divider to
feed the various clock distribution blocks.
Each clock distribution block includes a programmable divider, a phase synchronization circuit, a programmable delay,
a clock output mux, and an LVDS or LVPECL output buffer.
This allows multiple integer-related and phase-adjusted
copies of the reference to be distributed to eight system components.
The clock conditioners come in a 48-pin LLP package and are
footprint compatible with other clocking devices in the same
family.
VCO_DIV
CLKoutX_MUX
Duty
Cycle
Any
Divided, or Divided and Delayed
50%
2, 4, 6, 8
Any
50%
3
Bypassed, or Delayed
33%
5
Bypassed, or Delayed
40%
7
Bypassed, or Delayed
43%
1.7 GLOBAL CLOCK OUTPUT SYNCHRONIZATION
The SYNC* pin synchronizes the clock outputs. When the
SYNC* pin is held in a logic low state, the divided outputs are
also held in a logic low state. The bypassed outputs will continue to operate normally. Shortly after the SYNC* pin goes
high, the divided clock outputs are activated and will all transition to a high state simultaneously. All the outputs, divided
and bypassed, will now be synchronized. Clocks in the bypassed state are not affected by SYNC* and are always
synchronized with the divided outputs.
The SYNC* pin must be held low for greater than one clock
cycle of the output of the VCO Divider, also known as the
distribution path. Once this low event has been registered, the
outputs will not reflect the low state for four more cycles. This
means that the outputs will be low on the fifth rising edge of
the distribution path. Similarly once the SYNC* pin becomes
high, the outputs will not simultaneously transition high until
four more distribution path clock cycles have passed, which
is the fifth rising edge of the distribution path. See the timing
diagram in Figure 1 for further detail. The clocks are programmed as CLKout0_MUX = Bypassed, CLKout1_MUX =
Divided, CLKout1_DIV = 2, CLKout2_MUX = Divided, and
CLKout2_DIV = 4. To synchronize the outputs, after the low
SYNC* event has been registered, it is not required to wait for
the outputs to go low before SYNC* is set high.
1.1 BIAS PIN
To properly use the device, bypass Bias (pin 36) with a low
leakage 1 µF capacitor connected to Vcc. This is important
for low noise performance.
1.2 LDO BYPASS
To properly use the device, bypass LDObyp1 (pin 9) with a
10 µF capacitor and LDObyp2 (pin 10) with a 0.1 µF capacitor.
1.3 OSCILLATOR INPUT PORT (OSCin, OSCin*)
The purpose of OSCin is to provide the PLL with a reference
signal. Due to an internal DC bias the OSCin port should be
AC coupled, refer to the System Level Diagram in the Application Information section. The OSCin port may be driven
single-endedly by AC grounding OSCin* with a 0.1 µF capacitor.
1.4 LOW NOISE, FULLY INTEGRATED VCO
The LMK03000 family of devices contain a fully integrated
VCO. In order for proper operation the VCO uses a frequency
calibration algorithm. The frequency calibration algorithm is
activated any time that the R15 register is programmed. Once
R15 is programmed the temperature may not drift more than
the maximum allowable drift for continuous lock, ΔTCL, or else
the VCO is not guaranteed to stay in lock.
For the frequency calibration algorithm to work properly OSCin must be driven by a valid signal when R15 is programmed.
20211404
FIGURE 1. SYNC* Timing Diagram
1.5 CLKout DELAYS
Each individual clock output includes a delay adjustment.
Clock output delay registers (CLKoutX_DLY) support a 150
ps step size and range from 0 to 2250 ps of total delay.
The SYNC* pin provides an internal pull-up resistor as shown
on the functional block diagram. If the SYNC* pin is not terminated externally the clock outputs will operate normally. If
the SYNC* function is not used, clock output synchronization
is not guaranteed.
1.6 LVDS/LVPECL OUTPUTS
By default all the clock outputs are disabled until programmed.
Each LVDS or LVPECL output may be disabled individually
by programming the CLKoutX_EN bits. All the outputs may
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CLKoutX
_EN bit
EN_CLKout
_Global bit
GOE pin
CLKoutX
Output State
1
1
Low
Low
Don't care
0
Don't care
Off
0
Don't care
Don't care
Off
1
High / No
Connect
Enabled
1
When an LVDS output is in the Off state, the outputs are at a
voltage of approximately 1.5 volts. When an LVPECL output
is in the Off state, the outputs are at a voltage of approximately
1 volt.
1.9 GLOBAL OUTPUT ENABLE AND LOCK DETECT
The GOE pin provides an internal pull-up resistor as shown
on the functional block diagram. If it is not terminated externally, the clock output states are determined by the Clock
Output
Enable
bits
(CLKoutX_EN)
and
the
EN_CLKout_Global bit.
By programming the PLL_MUX register to Digital Lock Detect
Active High, the Lock Detect (LD) pin can be connected to the
GOE pin in which case all outputs are set low automatically if
the synthesizer is not locked.
1.10 POWER ON RESET
When supply voltage to the device increases monotonically
from ground to Vcc, the power on reset circuit sets all registers
to their default values, see the programming section for more
information on default register values. Voltage should be applied to all Vcc pins simultaneously.
1.11 DIGITAL LOCK DETECT
The PLL digital lock detect circuitry compares the difference
between the phase of the inputs of the phase detector to a
RC generated delay of ε. To indicate a locked state the phase
error must be less than the ε RC delay for 5 consecutive reference cycles. Once in lock, the RC delay is changed to
approximately δ. To indicate an out of lock state, the phase
error must become greater δ. The values of ε and δ are shown
in the table below:
ε
10 ns
δ
20 ns
To utilize the digital lock detect feature, PLL_MUX must be
programmed for "Digital Lock Detect (Active High)" or "Digital
Lock Detect (Active Low)." When one of these modes is programmed the state of the LD pin will be set high or low as
determined by the description above as shown in Figure 2.
When the device is in power down mode and the LD pin is
programmed for a digital lock detect function, LD will show a
"no lock detected" condition which is low or high given active
high or active low circuitry respectively.
The accuracy of this circuit degrades at higher comparison
frequencies. To compensate for this, the DIV4 word should
be set to one if the comparison frequency exceeds 20 MHz.
20211405
FIGURE 2. Digital Lock Detect Flowchart
13
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LMK03000 Family
The function of this word is to divide the comparison frequency presented to the lock detect circuit by 4.
1.8 CLKout OUTPUT STATES
Each clock output may be individually enabled with the
CLKoutX_EN bits. Each individual output enable control bit is
gated with the Global Output Enable input pin (GOE) and the
Global Output Enable bit (EN_CLKout_Global).
All clock outputs can be disabled simultaneously if the GOE
pin is pulled low by an external signal or EN_CLKout_Global
is set to 0.
LMK03000 Family
2.0 General Programming
Information
The LMK03000 family of devices are programmed using several 32-bit registers which control the device's operation. The
registers consist of a data field and an address field. The last
4 register bits, ADDR[3:0] form the address field. The remaining 28 bits form the data field DATA[27:0].
During programming, LEuWire is low and serial data is
clocked in on the rising edge of CLKuWire (MSB first). When
LE goes high, data is transferred to the register bank selected
by the address field. Only registers R0 to R7, R11, and R13
to R15 need to be programmed for proper device operation.
For the frequency calibration algorithm to work properly OSCin must be driven by a valid signal when R15 is programmed.
Any changes to the PLL R divider or OSCin require R15 to be
programmed again to activate the frequency calibration routine.
2.1 RECOMMENDED PROGRAMMING SEQUENCE
The recommended programming sequence involves programming R0 with the reset bit set (RESET = 1) to ensure the
device is in a default state. It is not necessary to program R0
again, but if R0 is programmed again, the reset bit is programmed clear (RESET = 0). Registers are programmed in
order with R15 being the last register programmed. An example programming sequence is shown below.
• Program R0 with the reset bit set (RESET = 1). This
ensures the device is in a default state. When the reset bit
is set in R0, the other R0 bits are ignored.
— If R0 is programmed again, the reset bit is programmed
clear (RESET = 0).
• Program R0 to R7 as necessary with desired clocks with
appropriate enable, mux, divider, and delay settings.
• Program R8 for optimum phase noise performance.
• Program R9 with Vboost setting if necessary. Only needed
to set Vboost = 1.
• Program R11 with DIV4 setting if necessary.
• Program R13 with oscillator input frequency and internal
loop filter values
• Program R14 with Fout enable bit, global clock output bit,
power down setting, PLL mux setting, and PLL R divider.
• Program R15 with PLL charge pump gain, VCO divider,
and PLL N divider. Also starts frequency calibration
routine.
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14
15
0
R6
0
0
R5
R7
0
R4
0
R2
0
0
R1
R3
0
R0
0
0
0
0
0
0
0
30
31
Register
0
0
0
0
0
0
0
0
29
0
0
0
0
0
0
0
0
28
0
0
0
0
0
0
0
0
27
2.2 REGISTER MAP
RESET
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0
0
0
0
0
0
0
0
26
0
0
0
0
0
0
0
0
25
0
0
0
0
0
0
0
0
24
0
0
0
0
0
0
0
0
23
0
0
0
0
0
0
0
0
22
0
0
0
0
0
0
0
0
21
0
0
0
0
0
0
0
0
20
0
0
0
0
0
0
0
0
19
17
CLKout7
_MUX
[1:0]
CLKout6
_MUX
[1:0]
CLKout5
_MUX
[1:0]
CLKout4
_MUX
[1:0]
CLKout3
_MUX
[1:0]
CLKout2
_MUX
[1:0]
CLKout1
_MUX
[1:0]
CLKout0
_MUX
[1:0]
Data [27:0]
18
16
15
14
13
11
CLKout7_DIV
[7:0]
CLKout6_DIV
[7:0]
CLKout5_DIV
[7:0]
CLKout4_DIV
[7:0]
CLKout3_DIV
[7:0]
CLKout2_DIV
[7:0]
CLKout1_DIV
[7:0]
CLKout0_DIV
[7:0]
12
10
9
8
7
5
CLKout7_DLY
[3:0]
CLKout6_DLY
[3:0]
CLKout5_DLY
[3:0]
CLKout4_DLY
[3:0]
CLKout3_DLY
[3:0]
CLKout2_DLY
[3:0]
CLKout1_DLY
[3:0]
CLKout0_DLY
[3:0]
6
4
0
0
0
0
0
0
0
1
1
1
1
0
0
0
0
A2
A3
0
2
3
1
1
0
0
1
1
0
0
A1
1
1
0
1
0
1
0
1
0
A0
0
LMK03000 Family
CLKout0_EN CLKout1_EN CLKout2_EN CLKout3_EN CLKout4_EN CLKout5_EN CLKout6_EN CLKout7_EN
1
0
0
0
PLL_
CP_
GAIN
[1:0]
R9
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R11
R13
R14
R15
0
0
0
0
1
0
29
EN_CLKout_Global
EN_Fout
VCO_DIV
[3:0]
0
0
0
1
0
0
1
1
0
0
0
0
0
0
23
24
25
0
0
0
0
26
0
0
0
0
27
POWERDOWN
0
0
0
1
28
0
0
0
21
PLL_MUX
[3:0]
0
0
0
0
22
0
0
0
20
0
0
0
0
0
0
18
1
1
0
17
0
PLL_N
[17:0]
PLL_R
[11:0]
0
1
0
Vbo
ost
0
0
0
13
14
0
15
0
16
OSCin_FREQ
[7:0]
19
DIV4
0
0
0
0
0
Register
R8
30
31
0
16
VCO_
R4_LF
[2:0]
0
0
0
12
0
1
1
11
0
0
0
10
VCO_
R3_LF
[2:0]
0
1
0
9
0
0
1
8
0
0
0
0
0
7
0
0
0
5
0
0
0
0
VCO_
C3_C4_LF
[3:0]
0
0
0
6
0
0
0
0
0
4
1
1
1
1
1
1
3
1
1
1
0
0
0
2
1
1
0
1
0
0
1
1
0
1
1
1
0
0
LMK03000 Family
Default Register Settings after Power on Reset
Bit Name
Default
Bit Value
Bit State
Bit Description
Register
Bit
Location
RESET
0
No reset, normal operation
Reset to power on defaults
CLKoutX_MUX
0
Bypassed
CLKoutX mux mode
CLKoutX_EN
0
Disabled
CLKoutX enable
CLKoutX_DIV
1
Divide by 2
CLKoutX clock divide
CLKoutX_DLY
0
0 ps
CLKoutX clock delay
Vboost
0
Normal Mode
Output Power Control
R9
DIV4
0
PDF ≤ 20 MHz
Phase Detector Frequency
R11
OSCin_FREQ
10
10 MHz OSCin
OSCin Frequency in MHz
VCO_R4_LF
0
Low (~200 Ω)
R4 internal loop filter values
VCO_R3_LF
0
Low (~600 Ω)
R3 internal loop filter values
VCO_C3_C4_LF
0
C3 = 0 pF, C4 = 10 pF
C3 and C4 internal loop filter values
7:4
EN_Fout
0
Fout disabled
Fout enable
28
EN_CLKout_Global
1
Normal - CLKouts normal
Global clock output enable
27
POWERDOWN
0
Normal - Device active
Device power down
PLL_MUX
0
Disabled
Multiplexer control for LD pin
PLL_R
10
R divider = 10
PLL R divide value
19:8
PLL_CP_GAIN
0
100 µA
Charge pump current
31:30
2
Divide by 2
VCO divide value
N divider = 760
PLL N divide value
VCO_DIV
PLL_N
760
2.3.1 RESET bit -- R0 only
This bit is only in register R0. The use of this bit is optional
and it should be set to '0' if not used. Setting this bit to a '1'
forces all registers to their power on reset condition and therefore automatically clears this bit. If this bit is set, all other R0
bits are ignored and R0 needs to be programmed again if
used with its proper values and RESET = 0.
Mode
31
18:17
R0 to R7
16
15:8
7:4
16
15
21:14
R13
13:11
10:8
R14
26
23:20
R15
29:26
25:8
2.3.3 CLKoutX_DIV[7:0] -- Clock Output Dividers
These bits control the clock output divider value. In order for
these dividers to be active, the respective CLKoutX_MUX bit
must be set to either "Divided" or "Divided and Delayed"
mode. After all the dividers are programed, the SYNC* pin
must be used to ensure that all edges of the clock outputs are
aligned. The Clock Output Dividers follow the VCO Divider so
the final clock divide for an output is VCO Divider × Clock
Output Divider. By adding the divider block to the output path
a fixed delay of approximately 100 ps is incurred.
The actual Clock Output Divide value is twice the binary value
programmed as listed in the table below.
2.3.2 CLKoutX_MUX[1:0] -- Clock Output Multiplexers
These bits control the Clock Output Multiplexer for each clock
output. Changing between the different modes changes the
blocks in the signal path and therefore incurs a delay relative
to the bypass mode. The different MUX modes and associated delays are listed below.
CLKoutX_MUX
[1:0]
R0
Clock Output
Divider value
CLKoutX_DIV[7:0]
Added Delay Relative
to Bypass Mode
0
0
0
0
0
0
0
0
Invalid
0
0
0
0
0
0
0
1
2 (default)
0
Bypassed
(default)
0 ps
0
0
0
0
0
0
1
0
4
1
Divided
100 ps
0
0
0
0
0
0
1
1
6
0
0
0
0
1
0
0
8
Delayed
400 ps
(In addition to the
programmed delay)
0
0
0
0
0
0
1
0
1
10
.
.
.
.
.
.
.
.
...
Divided and
Delayed
500 ps
(In addition to the
programmed delay)
1
1
1
1
1
1
1
1
510
2
3
17
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LMK03000 Family
Aside from this, the functions of these bits are identical. The
X in CLKoutX_MUX, CLKoutX_DIV, CLKoutX_DLY, and
CLKoutX_EN denote the actual clock output which may be
from 0 to 7.
2.3 REGISTER R0 to R7
Registers R0 through R7 control the eight clock outputs. Register R0 controls CLKout0, Register R1 controls CLKout1, and
so on. There is one additional bit in register R0 called RESET.
LMK03000 Family
2.5.1 DIV4 -- High Phase Detector Frequencies and Lock
Detect
This bit divides the frequency presented to the digital lock detect circuitry by 4. It is necessary to get a reliable output from
the digital lock detect output in the case of a phase detector
frequency frequency greater than 20 MHz.
2.3.4 CLKoutX_DLY[3:0] -- Clock Output Delays
These bits control the delay stages for each clock output. In
order for these delays to be active, the respective
CLKoutX_MUX bit must be set to either "Delayed" or "Divided
and Delayed" mode. By adding the delay block to the output
path a fixed delay of approximately 400 ps is incurred in addition to the delay shown in the table below.
DIV4
Digital Lock Detect Circuitry Mode
0
Phase Detector Frequency ≤ 20 MHz (default)
CLKoutX_DLY[3:0]
Delay (ps)
0
0 (default)
1
150
2
300
3
450
4
600
2.6 REGISTER R13
5
750
6
900
7
1050
8
1200
2.6.1 VCO_C3_C4_LF[3:0] -- Value for Internal Loop Filter
Capacitors C3 and C4
These bits control the capacitor values for C3 and C4 in the
internal loop filter.
9
1350
Loop Filter Capacitors
VCO_C3_C4_LF[3:0]
C3 (pF)
C4 (pF)
0
0 (default)
10 (default)
1
0
60
2
50
10
3
0
110
4
50
110
5
100
110
6
0
160
7
50
160
8
100
10
9
100
60
CLKoutX
State
10
150
110
11
150
Disabled
(default)
12 to 15
1500
11
1650
1800
13
1950
14
2100
15
2250
2.3.5 CLKoutX_EN bit -- Clock Output Enables
These bits control whether an individual clock output is enabled or not. If the EN_CLKout_Global bit is set to zero or if
GOE pin is held low, all CLKoutX_EN bit states will be ignored
and all clock outputs will be disabled.
CLKoutX_EN
bit
0
Conditions
EN_CLKout_Global bit = 1
GOE pin = High / No
Connect
1
Divided by 4
Phase Detector Frequency > 20 MHz
1
10
12
Not divided
60
Invalid
2.6.2 VCO_R3_LF[2:0] -- Value for Internal Loop Filter
Resistor R3
These bits control the R3 resistor value in the internal loop
filter. The recommended setting for VCO_R3_LF[2:0] = 0 for
optimum phase noise and jitter.
Enabled
2.4 REGISTER R9
The programming of register R9 is optional. If it is not programmed the the bit Vboost will be defaulted to 0, which is the
test condition for all electrical characteristics.
VCO_R3_LF[2:0]
R3 Value (kΩ)
2.4.1 Vboost -- Voltage Boost
By enabling this bit, the voltage output levels for all clock outputs is increased. Also, the noise floor is improved
0
Low (~600 Ω) (default)
1
10
2
20
Typical LVDS
Voltage Output
(mV)
Typical LVPECL
Voltage Output
(mV)
3
30
0
350
810
1
390
865
Vboost
40
5 to 7
Invalid
2.6.3 VCO_R4_LF[2:0] -- Value for Internal Loop Filter
Resistor R4
These bits control the R4 resistor value in the internal loop
filter. The recommended setting for VCO_R4_LF[2:0] = 0 for
optimum phase noise and jitter.
2.5 REGISTER R11
This register only has one bit and only needs to be programmed in the case that the phase detector frequency is
greater than 20 MHz and digital lock detect is used. Otherwise, it is automatically defaulted to the correct values.
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4
18
R4 Value (kΩ)
PLL_MUX[3:0]
0
Low (~200 Ω) (default)
8
1
10
9
2
20
3
30
10
4
40
11
5 to 7
Invalid
Output Type
Invalid
N Divider Output/2
(50% Duty Cycle)
Push-Pull
Invalid
R Divider Output/2
(50% Duty Cycle)
Push-Pull
12 to 15
2.6.4 OSCin_FREQ[7:0] -- Oscillator Input Calibration
Adjustment
These bits are to be programmed to the OSCin frequency. If
the OSCin frequency is not an integral multiple of 1 MHz, then
round to the closest value.
LD Pin Function
Invalid
2.7.3 POWERDOWN bit -- Device Power Down
This bit can power down the device. Enabling this bit powers
down the entire device and all blocks, regardless of the state
of any of the other bits or pins.
OSCin Frequency
POWERDOWN bit
Mode
1
1 MHz
0
Normal Operation (default)
2
2 MHz
1
Entire Device Powered Down
...
...
10
10 MHz (default)
OSCin_FREQ[7:0]
...
...
200
200 MHz
201 to 255
Invalid
2.7.4 EN_CLKout_Global bit -- Global Clock Output
Enable
This bit overrides the individual CLKoutX_EN bits. When this
bit is set to 0, all clock outputs are disabled, regardless of the
state of any of the other bits or pins.
EN_CLKout_Global bit
Clock Outputs
2.7 REGISTER R14
0
All Off
2.7.1 PLL_R[11:0] -- R Divider Value
These bits program the PLL R Divider and are programmed
in binary fashion. Any changes to PLL_R require R15 to be
programmed again to active the frequency calibration routine.
1
Normal Operation (default)
2.7.5 EN_Fout bit -- Fout port enable
This bit enables the Fout pin.
PLL R Divide
Value
PLL_R[11:0]
0
0
0
0
0
0
0
0
0
0
0
0
Invalid
0
0
0
0
0
0
0
0
0
0
0
1
1
0
0
0
0
0
0
0
0
0
0
1
0
2
.
.
.
.
.
.
.
.
.
.
.
.
...
0
0
0
0
0
0
0
0
1
0
1
0
10 (default)
.
.
.
.
.
.
.
.
.
.
.
.
...
1
1
1
1
1
1
1
1
1
1
1
1
4095
Output Type
LD Pin Function
0
Hi-Z
Disabled (default)
1
Push-Pull
Logic High
2
Push-Pull
Logic Low
Fout Pin Status
0
Disabled (default)
1
Enabled
2.8 REGISTER R15
Programming R15 also activates the frequency calibration
routine.
2.8.1 PLL_N[17:0] -- PLL N Divider
These bits program the divide value for the PLL N Divider.
The PLL N Divider follows the VCO Divider and precedes the
PLL phase detector. Since the VCO Divider is also in the
feedback path from the VCO to the PLL Phase Detector, the
total N divide value, N Total, is also influenced by the VCO Divider value. NTotal = PLL N Divider × VCO Divider. The VCO
frequency is calculated as, fVCO = fOSCin × PLL N Divider ×
VCO Divider / PLL R Divider. Since the PLL N divider is a pure
binary counter there are no illegal divide values for PLL_N
[17:0] except for 0.
2.7.2 PLL_MUX[3:0] -- Multiplexer Control for LD Pin
These bits set the output mode of the LD pin. The table below
lists several different modes.
PLL_MUX[3:0]
EN_Fout bit
PLL N
Divider
Value
3
Push-Pull
Digital Lock Detect
(Active High)
PLL_N[17:0]
Invalid
Push-Pull
Digital Lock Detect
(Active Low)
0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
4
0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1
1
5
Push-Pull
Analog Lock Detect
6
Open Drain
NMOS
Analog Lock Detect
7
Open Drain
PMOS
Analog Lock Detect
19
. . . . . . . . . . . . . . . . . .
...
0 0 0 0 0 0 0 0 1 0 1 1 1 1 1 0 0 0
760
(default)
. . . . . . . . . . . . . . . . . .
...
1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1
262143
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LMK03000 Family
VCO_R4_LF[2:0]
LMK03000 Family
2.8.2 VCO_DIV[3:0] -- VCO Divider
These bits program the divide value for the VCO Divider. The
VCO Divider follows the VCO output and precedes the clock
distribution blocks. Since the VCO Divider is in the feedback
path from the VCO to the PLL phase detector the VCO Divider
contributes to the total N divide value, NTotal. NTotal = PLL N
Divider × VCO Divider. The VCO Divider can not be bypassed. See the programming section on the PLL N Divider
for more information on setting the VCO frequency.
VCO Divider
Value
VCO_DIV[3:0]
VCO Divider
Value
VCO_DIV[3:0]
0
1
1
1
1
0
0
0
7
8
1
0
0
1
Invalid
.
.
.
.
...
1
1
1
1
Invalid
2.8.3 PLL_CP_GAIN[1:0] -- PLL Charge Pump Gain
These bits set the charge pump gain of the PLL.
0
0
0
0
Invalid
PLL_CP_GAIN[1:0]
Charge Pump Gain
0
0
0
1
Invalid
0
1x (default)
0
0
1
0
2 (default)
1
4x
0
0
1
1
3
2
16x
0
1
0
0
4
3
32x
0
1
0
1
5
0
1
1
0
6
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20
LMK03000 Family
3.0 Application Information
3.1 SYSTEM LEVEL DIAGRAM
20211470
FIGURE 3. Typical Application
Figure 3 shows an LMK03000 family device used in a typical
application. In this setup the clock may be multiplied, reconditioned, and redistributed. Both the OSCin/OSCin* and CLKoutX/CLKoutX* pins can be used in a single-ended or a
differential fashion, which is discussed later in this datasheet.
The GOE pin needs to be high for the outputs to operate. One
technique sometimes used is to take the output of the LD
(Lock Detect) pin and use this as an input to the GOE pin. If
this is done, then the outputs will turn off if lock detect circuit
detects that the PLL is out of lock. The loop filter actually con-
sists of seven components, but four of these components that
for the third and fourth poles of the loop filter are integrated in
the chip. The first and second pole of the loop filter are external.
3.2 BIAS PIN
See section 1.1 for bias pin information.
3.3 LDO BYPASS
See section 1.2 for LDO bypass information.
21
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LMK03000 Family
3.4 LOOP FILTER
20211471
FIGURE 4. Loop Filter
The internal charge pump is directly connected to the integrated loop filter components. The first and second pole of the
loop filter are externally attached as shown in Figure 4. When
the loop filter is designed, it must be stable over the entire
frequency band, meaning that the changes in KVtune from the
low to high band specification will not make the loop filter unstable. The design of the loop filter is application specific and
can be rather involved, but is discussed in depth in the the
Clock Conditioner Owner's Manual provided by National
Semiconductor. When designing with the integrated loop filter
of the LMK03000 family, considerations for minimum resistor
thermal noise often lead one to the decision to design for the
minimum value for integrated resistors, R3 and R4. Both the
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integrated loop filter resistors and capacitors (C3 and C4) also
restrict how wide the loop bandwidth the PLL can have. However, these integrated components do have the advantage
that they are closer to the VCO and can therefore filter out
some noise and spurs better than external components. For
this reason, a common strategy is to minimize the internal
loop filter resistors and then design for the largest internal capacitor values that permit a wide enough loop bandwidth. In
some situations where spurs requirements are very stringent
and there is margin on phase noise, it might make sense to
design for a loop filter with integrated resistor values that are
larger than their minimum value.
22
Table 3.5 - Block Current Consumption
Current
Consumption at
3.3 V (mA)
Power
Dissipated in
device (mW)
Power
Dissipated in
LVPECL emitter
resistors (mW)
86.0
283.8
-
Low clock buffer The low clock buffer is enabled anytime one of
(internal)
CLKout0 through CLKout3 are enabled
9
29.7
-
High clock buffer The high clock buffer is enabled anytime one of the
(internal)
CLKout4 through CLKout7 are enabled
9
29.7
-
Fout buffer, EN_Fout = 1
14.5
47.8
-
LVDS output, Bypassed mode
17.8
58.7
-
40
72
60
17.4
38.3
19.1
0
0
-
Block
Condition
Entire device,
core current
All outputs off; No LVPECL emitter resistors connected
Output buffers
LVPECL output, Bypassed mode (includes 120 Ω
emitter resistors)
LVPECL output, disabled mode (includes 120 Ω
emitter resistors)
LVPECL output, disabled mode. No emitter resistors
placed; open outputs
Divide circuitry
per output
Divide enabled, divide = 2
5.3
17.5
-
Divide enabled, divide > 2
8.5
28.0
-
Delay circuitry
per output
Delay enabled, delay < 8
5.8
19.1
-
9.9
32.7
-
Entire device
CLKout0 & CLKout4 enabled in Bypassed mode
161.8
474
60
Delay enabled, delay > 7
From Table 3.5 the current consumption can be calculated in
any configuration. For example, the current for the entire device with 1 LVDS (CLKout0) & 1 LVPECL (CLKout4) output
in Bypassed mode can be calculated by adding up the following blocks: core current, low clock buffer, high clock buffer,
one LVDS output buffer current, and one LVPECL output
buffer current. There will also be one LVPECL output drawing
emitter current, but some of the power from the current draw
is dissipated in the external 120 Ω resistors which doesn't add
to the power dissipation budget for the device. If delays or
divides are switched in, then the additional current for these
stages needs to be added as well.
For power dissipated by the device, the total current entering
the device is multiplied by the voltage at the device minus the
power dissipated in any emitter resistors connected to any of
the LVPECL outputs. If no emitter resistors are connected to
the LVPECL outputs, this power will be 0 watts. For example,
in the case of 1 LVDS (CLKout0) & 1 LVPECL (CLKout4) operating at 3.3 volts, we calculate 3.3 V × (86 + 9 + 9 + 17.8 +
40) mA = 3.3 V × 161.8 mA = 533.9 mW. Because the
LVPECL output (CLKout4) has the emitter resistors hooked
up and the power dissipated by these resistors is 60 mW, the
total device power dissipation is 533.9 mW - 60 mW = 473.9
mW.
When the LVPECL output is active, ~1.9 V is the average
voltage on each output as calculated from the LVPECL Voh
& Vol typical specification. Therefore the power dissipated in
each emitter resistor is approximately (1.9 V)2 / 120 Ω = 30
mW. When the LVPECL output is disabled, the emitter resistor voltage is ~1.07 V. Therefore the power dissipated in each
emitter resistor is approximately (1.07 V)2 / 120 Ω = 9.5 mW.
23
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LMK03000 Family
calculate estimated current consumption of the device. Unless otherwise noted Vcc = 3.3 V, TA = 25 °C.
3.5 CURRENT CONSUMPTION / POWER DISSIPATION
CALCULATIONS
Due to the myriad of possible configurations the following table serves to provide enough information to allow the user to
LMK03000 Family
3.6 THERMAL MANAGEMENT
Power consumption of the LMK03000 family of devices can
be high enough to require attention to thermal management.
For reliability and performance reasons the die temperature
should be limited to a maximum of 125 °C. That is, as an estimate, TA (ambient temperature) plus device power consumption times θJA should not exceed 125 °C.
The package of the device has an exposed pad that provides
the primary heat removal path as well as excellent electrical
grounding to the printed circuit board. To maximize the removal of heat from the package a thermal land pattern including multiple vias to a ground plane must be incorporated
on the PCB within the footprint of the package. The exposed
pad must be soldered down to ensure adequate heat conduction out of the package. A recommended land and via
pattern is shown in Figure 5. More information on soldering
LLP packages can be obtained at www.national.com.
3.7 TERMINATION AND USE OF CLOCK OUTPUTS
(DRIVERS)
When terminating clock drivers keep in mind these guidelines
for optimum phase noise and jitter performance:
• Transmission line theory should be followed for good
impedance matching to prevent reflections.
• Clock drivers should be presented with the proper loads.
For example:
— LVDS drivers are current drivers and require a closed
current loop.
— LVPECL drivers are open emitter and require a DC
path to ground.
• Receivers should be presented with a signal biased to
their specified DC bias level (common mode voltage) for
proper operation. Some receivers have self-biasing inputs
that automatically bias to the proper voltage level. In this
case, the signal should normally be AC coupled.
It is possible to drive a non-LVPECL or non-LVDS receiver
with a LVDS or LVPECL driver as long as the above guidelines are followed. Check the datasheet of the receiver or
input being driven to determine the best termination and coupling method to be sure that the receiver is biased at its
optimum DC voltage (common mode voltage). For example,
when driving the OSCin/OSCin* input of the LMK03000 family, OSCin/OSCin* should be AC coupled because OSCin/
OSCin* biases the signal to the proper DC level, see Figure
3. This is only slightly different from the AC coupled cases
described in 3.7.2 because the DC blocking capacitors are
placed between the termination and the OSCin/OSCin* pins,
but the concept remains the same, which is the receiver (OSCin/OSCin*) set the input to the optimum DC bias voltage
(common mode voltage), not the driver.
20211473
3.7.1 Termination for DC Coupled Differential Operation
For DC coupled operation of an LVDS driver, terminate with
100 Ω as close as possible to the LVDS receiver as shown in
Figure 6. To ensure proper LVDS operation when DC coupling it is recommend to use LVDS receivers without fail-safe
or internal input bias such as DS90LV110T. The LVDS driver
will provide the DC bias level for the LVDS receiver. For operation with LMK03000 family LVDS drivers it is recommend
to use AC coupling with LVDS receivers that have an internal
DC bias voltage. Some fail-safe circuitry will present a DC
bias (common mode voltage) which will prevent the LVDS
driver from working correctly. This precaution does not apply
to the LVPECL drivers.
FIGURE 5. Recommended Land and Via Pattern
To minimize junction temperature it is recommended that a
simple heat sink be built into the PCB (if the ground plane
layer is not exposed). This is done by including a copper area
of about 2 square inches on the opposite side of the PCB from
the device. This copper area may be plated or solder coated
to prevent corrosion but should not have conformal coating (if
possible), which could provide thermal insulation. The vias
shown in Figure 5 should connect these top and bottom copper layers and to the ground layer. These vias act as “heat
pipes” to carry the thermal energy away from the device side
of the board to where it can be more effectively dissipated.
20211420
FIGURE 6. Differential LVDS Operation, DC Coupling
For DC coupled operation of an LVPECL driver, terminate
with 50 Ω to Vcc - 2 V as shown in Figure 7. Alternatively
terminate with a Thevenin equivalent circuit (120 Ω resistor
connected to Vcc and an 82 Ω resistor connected to ground
with the driver connected to the junction of the 120 Ω and 82
Ω resistors) as shown in Figure 8 for Vcc = 3.3 V.
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24
20211418
FIGURE 7. Differential LVPECL Operation, DC Coupling
20211419
FIGURE 9. Differential LVDS Operation, AC Coupling
LVPECL drivers require a DC path to ground. When AC coupling an LVPECL signal use 120 Ω emitter resistors close to
the LVPECL driver to provide a DC path to ground as shown
in Figure 10. For proper receiver operation, the signal should
be biased to the DC bias level (common mode voltage) specified by the receiver. The typical DC bias voltage (common
mode voltage) for LVPECL receivers is 2 V. A Thevenin
equivalent circuit (82 Ω resistor connected to Vcc and a 120
Ω resistor connected to ground with the driver connected to
the junction of the 82 Ω and 120 Ω resistors) is a valid termination as shown in Figure 10 for Vcc = 3.3 V. Note this
Thevenin circuit is different from the DC coupled example in
Figure 8.
20211421
FIGURE 8. Differential LVPECL Operation, DC Coupling,
Thevenin Equivalent
20211417
FIGURE 10. Differential LVPECL Operation, AC Coupling,
Thevenin Equivalent
25
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LMK03000 Family
3.7.2 Termination for AC Coupled Differential Operation
AC coupling allows for shifting the DC bias level (common
mode voltage) when driving different receiver standards.
Since AC coupling prevents the driver from providing a DC
bias voltage at the receiver it is important to ensure the receiver is biased to its ideal DC level.
When driving LVDS receivers with an LVDS driver, the signal
may be AC coupled by adding DC blocking capacitors, however the proper DC bias point needs to be established at the
receiver. One way to do this is with the termination circuitry in
Figure 9.
LMK03000 Family
When AC coupling an LVPECL driver use a 120 Ω emitter
resistor to provide a DC path to ground and ensure a 50 ohm
termination with the proper DC bias level for the receiver. The
typical DC bias voltage for LVPECL receivers is 2 V (See
3.7.2). If the other driver is not used it should be terminated
with either a proper AC or DC termination. This latter example
of AC coupling a single-ended LVPECL signal can be used to
measure single-ended LVPECL performance using a spectrum analyzer or phase noise analyzer. When using most RF
test equipment no DC bias point (0 V DC) is expected for safe
and proper operation. The internal 50 ohm termination the test
equipment correctly terminates the LVPECL driver being
measured as shown in . When using only one LVPECL driver
of a CLKoutX/CLKoutX* pair, be sure to properly terminated
the unused driver.
3.7.3 Termination for Single-Ended Operation
A balun can be used with either LVDS or LVPECL drivers to
convert the balanced, differential signal into an unbalanced,
single-ended signal.
It is possible to use an LVPECL driver as one or two separate
800 mV p-p signals. When DC coupling one of the LMK03000
family clock LVPECL drivers, the termination should still be
50 ohms to Vcc - 2 V as shown in Figure 11. Again the
Thevenin equivalent circuit (120 Ω resistor connected to Vcc
and an 82 Ω resistor connected to ground with the driver connected to the junction of the 120 Ω and 82 Ω resistors) is a
valid termination as shown in Figure 12 for Vcc = 3.3 V.
20211415
FIGURE 11. Single-Ended LVPECL Operation, DC
Coupling
20211414
FIGURE 13. Single-Ended LVPECL Operation, AC
Coupling
3.7.4 Conversion to LVCMOS Outputs
To drive an LVCMOS input with an LMK03000 family LVDS
or LVPECL output, an LVPECL/LVDS to LVCMOS converter
such
as
National
Semiconductor's
DS90LV018A,
DS90LV028A, DS90LV048A, etc. is required. For best noise
performance, LVPECL provides a higher voltage swing into
input of the converter.
20211416
3.8 OSCin INPUT
In addition to LVDS and LVPECL inputs, OSCin can also be
driven with a sine wave. The OSCin input can be driven single-ended or differentially with sine waves. The configurations
for these are shown in Figure 14 and Figure 15.
FIGURE 12. Single-Ended LVPECL Operation, DC
Coupling, Thevenin Equivalent
20211422
FIGURE 14. Single-Ended Sine Wave Input
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26
20211424
FIGURE 15. Differential Sine Wave Input
20211413
FIGURE 16. Recommended OSCin Power for Operation with a Sine Wave Input
using an LMK03000 device with eight LMK01000 family devices up to 64 clocks may be distributed in many different
LVDS / LVPECL combinations. It's possible to distribute more
than 64 clocks by adding more LMK01000 family devices.
3.9 MORE THAN EIGHT OUTPUTS WITH AN LMK03000
FAMILY DEVICE
The LMK03000 family devices include eight or less outputs.
When more than 8 outputs are required the footprint compatible LMK01000 family may be used for clock distribution. By
27
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LMK03000 Family
Figure 16 shows the recommended power level for sine wave
operation for both differential and single-ended sources over
frequency. The part will operate at power levels below the
recommended power level, but as power decreases the PLL
noise performance will degrade. The VCO noise performance
will remain constant. At the recommended power level the
PLL phase noise degradation from full power operation (8
dBm) is less than 2 dB.
LMK03000 Family
Physical Dimensions inches (millimeters) unless otherwise noted
Leadless Leadframe Package (Bottom View)
48 Pin LLP (SQA48A) Package
Ordering Information
Order Number
VCO Version
LMK03000CISQ
400 fs
LMK03000CISQX
LMK03000ISQ
LMK03000ISQX
Performance Grade
1.24 GHz
800 fs
LMK03000DISQE
1200 fs
LMK03000DISQ
LMK03000DISQX
LMK03001CISQ
400 fs
LMK03001CISQX
LMK03001ISQ
LMK03001ISQX
1.52 GHz
800 fs
LMK03001DISQE
LMK03001DISQ
1200 fs
LMK03001DISQX
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28
Packing
Package Marking
250 Unit Tape and Reel
K3000CI
2500 Unit Tape and Reel
K3000CI
250 Unit Tape and Reel
K3000 I
2500 Unit Tape and Reel
K3000 I
250 Unit Tape and Reel
K3000DI
1000 Unit Tape and Reel
K3000DI
2500 Unit Tape and Reel
K3000DI
250 Unit Tape and Reel
K3001CI
2500 Unit Tape and Reel
K3001CI
250 Unit Tape and Reel
K3001 I
2500 Unit Tape and Reel
K3001 I
250 Unit Tape and Reel
K3001DI
1000 Unit Tape and Reel
K3001DI
2500 Unit Tape and Reel
K3001DI
LMK03000 Family
Notes
29
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LMK03000 Family Precision Clock Conditioner with Integrated VCO
Notes
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