TYSEMI ZXMP10A13FTA

SMD Type
Product specification
ZXMP10A13F
100V P-CHANNEL ENHANCEMENT MODE MOSFET
SUMMARY
V(BR)DSS = - 100V : RDS(on)= 1
; ID = - 0.7A
DESCRIPTION
This new generation of Trench MOSFETs from TYYyY utilizes a unique structure that
combines the benefits of low on-resistance with fast switching speed. This makes
them ideal for high efficiency, low voltage, power management applications.
FEATURES
SOT23
• Low on-resistance
• Fast switching speed
• Low threshold
• Low gate drive
• SOT23 package
APPLICATIONS
• DC-DC Converters
• Power Management functions
• Disconnect switches
• Motor control
PINOUT
ORDERING INFORMATION
DEVICE
REEL
SIZE
TAPE
WIDTH
QUANTITY
PER REEL
ZXMP10A13FTA
7”
8mm
3000 units
ZXMP10A13FTC
13”
8mm
10000units
DEVICE MARKING
• 7P1
http://www.twtysemi.com
[email protected]
4008-318-123
1 of 2
SMD Type
Product specification
ZXMP10A13F
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
LIMIT
UNIT
Drain-Source Voltage
Gate-Source Voltage
V DSS
-100
V
V GS
±20
Continuous Drain Current @ VGS=10V; TA=25°C (b)
@V GS=10V; TA=70°C (b)
V
ID
-0.7
A
-0.5
A
-0.6
A
@ V GS=10V; TA=25°C (a)
Pulsed Drain Current
(c)
I DM
-3.1
A
Continuous Source Current (Body Diode) (b)
IS
-1.1
A
Pulsed Source Current (Body Diode) (c)
I SM
-3.1
A
Power Dissipation at T A =25°C (a)
Linear Derating Factor
PD
625
mW
5
mW/°C
(b)
PD
Power Dissipation at T A =25°C
Linear Derating Factor
Operating and Storage Temperature Range
T j , T stg
806
mW
6.4
mW/°C
-55 to +150
°C
VALUE
UNIT
THERMAL RESISTANCE
PARAMETER
SYMBOL
(a)
R ⍜JA
200
°C/W
Junction to Ambient (b)
R ⍜JA
155
°C/W
Junction to Ambient
NOTES
(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions.
(b) For a device surface mounted on FR4 PCB measured at t ⱕ 5 sec.
(c) Repetitive rating 25mm x 25mm FR4 PCB, D = 0.02, pulse width 300␮s - pulse width limited by maximum junction temperature.
http://www.twtysemi.com
[email protected]
4008-318-123
2 of 2