NSC ADC122S625

ADC122S625
Dual 12-Bit, 50 kSPS to 200 kSPS, Simultaneous Sampling
A/D Converter
General Description
Features
The ADC122S625 is a dual 12-bit, 50 kSPS to 200 kSPS simultaneous sampling Analog-to-Digital (A/D) converter. The
analog inputs on both channels are sampled simultaneously
to preserve their relative phase information to each other. The
converter is based on a successive-approximation register
architecture where the differential nature of the analog inputs
is maintained from the internal track-and-hold circuits
throughout the A/D converter to provide excellent commonmode signal rejection. The ADC122S625 features an external
reference that can be varied from 1.0V to VA.
The ADC122S625's serial data output is binary 2's complement and is compatible with several standards, such as
SPI™, QSPI™, MICROWIRE™, and many common DSP serial interfaces. The serial clock (SCLK) and chip select bar
(CS) are shared by both channels.
Operating from a single 5V analog supply and a reference
voltage of 2.5V, the total power consumption while operating
at 200 kSPS is typically 8.6 mW. With the ADC122S625 operating in power-down mode, the power consumption reduces to 2.6 µW. The differential input, low power consumption, and small size make the ADC122S625 ideal for direct
connection to sensors in motor control applications.
Operation is guaranteed over the industrial temperature
range of −40°C to +105°C and clock rates of 1.6 MHz to 6.4
MHz. The ADC122S625 is available in a 10-lead MSOP package.
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True Simultaneous Sampling Differential Inputs
Guaranteed performance from 50 kSPS to 200 kSPS
External Reference
Wide Input Common-Mode Voltage Range
Single High-Speed Serial Data Output
Operating Temperature Range of −40°C to +105°C
SPI™/QSPI™/MICROWIRE™/DSP compatible Serial
Interface
Key Specifications
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Conversion Rate
50 kSPS to 200 kSPS
INL
±1 LSB (max)
DNL
±0.95 LSB (max)
SNR
71 dBc (min)
THD
-72 dBc (min)
ENOB
11.25 bits (min)
Power Consumption at 200 kSPS
8.6 mW (typ)
— Converting, VA = 5V, VREF = 2.5V
2.6 µW (typ)
— Power-Down, VA = 5V, VREF = 2.5V
Applications
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Motor Control
Power Meters/Monitors
Multi-Axis Positioning Systems
Instrumentation and Control Systems
Data Acquisition Systems
Medical Instruments
Direct Sensor Interface
Connection Diagram
30055305
TRI-STATE® is a trademark of National Semiconductor Corporation.
MICROWIRE™ is a trademark of National Semiconductor Corporation.
QSPI™ and SPI™ are trademarks of Motorola, Inc.
© 2008 National Semiconductor Corporation
300553
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ADC122S625 Dual 12-Bit, 50 kSPS to 200 kSPS, Simultaneous Sampling A/D Converter
February 25, 2008
ADC122S625
Ordering Information
Order Code
Temperature Range
Description
Top Mark
ADC122S625CIMM
−40°C to +105°C
10-Lead MSOP Package, 1000 Units Tape & Reel
X35C
ADC122S625CIMMX
−40°C to +105°C
10-Lead MSOP Package, 3500 Units Tape & Reel
X35C
ADC122S625EB
Evaluation Board
Block Diagram
30055302
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2
Pin No.
Symbol
Description
1
VREF
Voltage Reference Input. A voltage reference between 1V and VA must be applied to this
input. VREF must be decoupled to GND with a minimum ceramic capacitor value of 0.1
µF. A bulk capacitor value of 1.0 µF to 10 µF in parallel with the 0.1 µF is recommended
for enhanced performance.
2
CHA+
Non-Inverting Input for Channel A. CHA+ is the positive analog input for the differential
signal applied to Channel A.
3
CHA−
Inverting Input for Channel A. CHA− is the negative analog input for the differential signal
applied to Channel A.
4
CHB−
Inverting Input for Channel B. CHB− is the negative analog input for the differential signal
applied to Channel B.
5
CHB+
Non-Inverting Input for Channel B. CHB+ is the positive analog input for the differential
signal applied to Channel B.
6
GND
Ground. GND is the ground reference point for all signals applied to the ADC122S625.
VA
Analog Power Supply input. A voltage source between 4.5V and 5.5V must be applied to
this input. VA must be decoupled to GND with a minimum ceramic capacitor value of 0.1
µF. A bulk capacitor value of 1.0 µF to 10 µF in parallel with the 0.1 µF is recommended
for enhanced performance.
8
DOUT
Serial Data Output for Channel A and Channel B. The serial data output word is comprised
of 4 null bits, 12 data bits (ChA conversion result), 4 null bits, and 12 data bits (ChB
conversion result). During a conversion, the data is output on the falling edges of SCLK
and is valid on the rising edges.
9
SCLK
Serial Clock. SCLK is used to control data transfer and serves as the conversion clock.
10
CS
Chip Select Bar. CS is active low. The ADC122S625 is actively converting when CS is
LOW and Power-Down Mode when CS is HIGH. A conversion begins on the fall of CS.
7
3
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ADC122S625
Pin Descriptions and Equivalent Circuits
ADC122S625
Operating Ratings
Absolute Maximum Ratings (Notes 1, 2)
−40°C ≤ TA ≤ +105°C
Supply Voltage, VA
+4.5V to +5.5V
Reference Voltage, VREF
1.0V to VA
Input Common-Mode Voltage, VCM See Figure 9 (Sect 2.3)
Digital Input Pins Voltage Range
0 to VA
Clock Frequency
1.6 MHz to 6.4 MHz
Differential Analog Input Voltage
−VREF to +VREF
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Analog Supply Voltage VA
Voltage on Any Pin to GND
Input Current at Any Pin (Note 3)
Package Input Current (Note 3)
Power Consumption at TA = 25°C
ESD Susceptibility (Note 5)
Human Body Model
Machine Model
Charge Device Model
Junction Temperature
Storage Temperature
(Notes 1, 2)
Operating Temperature Range
−0.3V to 6.5V
−0.3V to (VA +0.3V)
±10 mA
±50 mA
See (Note 4)
Package Thermal Resistance
2500V
250V
1000V
+150°C
−65°C to +150°C
Package
θJA
10-lead MSOP
240°C / W
Soldering
process
must
comply
with
National
Semiconductor's Reflow Temperature Profile specifications.
Refer to www.national.com/packaging. (Note 6)
ADC122S625 Converter Electrical Characteristics
(Note 7)
The following specifications apply for VA = +4.5V to 5.5V, VREF = 2.5V, fSCLK = 1.6 to 6.4 MHz, fIN = 20 kHz, CL = 25 pF, unless
otherwise noted. Boldface limits apply for TA = TMIN to TMAX; all other limits are at TA = 25°C.
Symbol
Parameter
Conditions
Typical
Limits
Units
12
Bits
±0.5
±1
LSB (max)
±0.95
LSB (max)
STATIC CONVERTER CHARACTERISTICS
Resolution with No Missing Codes
INL
DNL
OE
GE
Integral Non-Linearity
Integral Non-Linearity Matching
0.02
Differential Non-Linearity
±0.4
Differential Non-Linearity Matching
0.02
Offset Error
0.2
Offset Error Matching
0.1
Positive Gain Error
−2
Positive Gain Error Matching
0.2
Negative Gain Error
3
Negative Gain Error Matching
LSB
LSB
±3
LSB (max)
±5
LSB (max)
±8
LSB (max)
LSB
LSB
0.2
LSB
DYNAMIC CONVERTER CHARACTERISTICS
SINAD
Signal-to-Noise Plus Distortion Ratio
fIN = 20 kHz, −0.1 dBFS
72.5
69.5
dBc (min)
SNR
Signal-to-Noise Ratio
fIN = 20 kHz, −0.1 dBFS
73.2
71
dBc (min)
THD
Total Harmonic Distortion
fIN = 20 kHz, −0.1 dBFS
−83
−72
dBc (max)
SFDR
Spurious-Free Dynamic Range
fIN = 20 kHz, −0.1 dBFS
84
72
dBc (min)
ENOB
Effective Number of Bits
fIN = 20 kHz, −0.1 dBFS
11.8
11.25
bits (min)
−3 dB Full Power Bandwidth
Differential
Output at 70.7%FS with Input
FS Input
Single-Ended
Input
FPBW
ISOL
Channel-to-Channel Isolation
fIN < 1 MHz
26
MHz
22
MHz
−90
dBc
ANALOG INPUT CHARACTERISTICS
VIN
Differential Input Range
IDCL
DC Leakage Current
CINA
Input Capacitance
CMRR
Common Mode Rejection Ratio
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−VREF
VIN = VREF or VIN = -VREF
V (min)
+VREF
V (max)
±1
µA (max)
In Track Mode
20
pF
In Hold Mode
3
pF
−90
dB
See the Specification Definitions for the
test condition
4
VREF
Parameter
Conditions
Typical
Reference Voltage Range
Limits
Units
1.0
V (min)
VA
V (max)
DIGITAL INPUT CHARACTERISTICS
VIH
Input High Voltage
2.4
V (min)
VIL
Input Low Voltage
0.8
V (max)
IIN
Input Current
CIND
Input Capacitance
VIN = 0V or VA
±1
µA (max)
2
4
pF (max)
ISOURCE = 200 µA
VA − 0.02
VA − 0.2
V (min)
ISOURCE = 1 mA
VA − 0.09
ISINK = 200 µA
0.01
0.4
V (max)
ISINK = 1 mA
0.08
±1
µA (max)
4
pF (max)
DIGITAL OUTPUT CHARACTERISTICS
VOH
Output High Voltage
VOL
Output Low Voltage
IOZH, IOZL
TRI-STATE Leakage Current
Force 0V or VA
COUT
TRI-STATE Output Capacitance
Force 0V or VA
2
Output Coding
V
V
Binary 2'S Complement
POWER SUPPLY CHARACTERISTICS
4.5
V (min)
5.5
V (max)
1.7
2.45
mA (max)
fSCLK = 6.4 MHz, fS = 200 kSPS, VREF =
2.5V
20
40
µA (max)
Analog Supply Current, Power Down
Mode (CS high)
fSCLK = 6.4 MHz, VA = 5.0V
10
fSCLK = 0, VA = 5.0V (Note 8)
0.5
IVREF (PD)
Reference Current, Power Down Mode
(CS high)
fSCLK = 6.4 MHz, VREF = 2.5V
0.05
fSCLK = 0, VREF = 2.5V (Note 8)
0.05
0.1
µA (max)
PWR
(Conv)
Power Consumption, Continuously
Converting
fSCLK = 6.4 MHz, fS = 200 kSPS, fIN = 20
kHz, VA = 5.0V, VREF = 2.5V
8.6
12.4
mW (max)
PWR
(PD)
Power Consumption, Power Down Mode fSCLK = 6.4 MHz, VA = 5.0V, VREF = 2.5V
(CS high)
fSCLK = 0, VA = 5.0V, VREF = 2.5V
5.8
µW (max)
PSRR
Power Supply Rejection Ratio
VA
Analog Supply Voltage
IVA (Conv)
Analog Supply Current, Continuously
Converting
fSCLK = 6.4 MHz, fS = 200 kSPS, fIN = 20
kHz, VA = 5V
IVREF
(Conv)
Reference Current, Continuously
Converting
IVA (PD)
See the Specification Definitions for the
test condition
µA
1.1
µA
50
2.6
µA (max)
µW
−85
dB
AC ELECTRICAL CHARACTERISTICS
fSCLK
Maximum Clock Frequency
fSCLK
Minimum Clock Frequency
0.8
1.6
MHz (max)
Maximum Sample Rate
625
200
kSPS (min)
Minimum Sample Rate
25
50
kSPS (min)
fS
20
6.4
MHz (min)
tACQ
Track/Hold Acquisition Time
3
SCLK cycles
tCONV
Conversion Time
12
SCLK cycles
tAD
Aperture Delay
6
5
ns
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ADC122S625
Symbol
ADC122S625
ADC122S625 Timing Specifications
(Note 7)
The following specifications apply for VA = +4.5V to 5.5V, VREF = 2.5V, fSCLK = 1.6 MHz to 6.4 MHz, CL = 25 pF, unless otherwise
noted. Boldface limits apply for TA = TMIN to TMAX: all other limits TA = 25°C.
Symbol
tCSSU
Parameter
Conditions
CS Setup Time prior to an SCLK rising edge
Typical
Limits
Units
4
7
ns (min)
1/ fSCLK
1/ fSCLK - 3
ns (max)
tEN
DOUT Enable Time after the falling edge of CS
9
20
ns (max)
tDH
DOUT Hold time after an SCLK Falling edge
9
6
ns (min)
tDA
DOUT Access time after an SCLK Falling edge
20
26
ns (max)
tDIS
DOUT Disable Time after the rising edge of CS
(Note 10)
10
20
ns (max)
tCH
SCLK High Time
25
ns (min)
tCL
SCLK Low Time
25
ns (min)
tr
DOUT Rise Time
7
ns
tf
DOUT Fall Time
7
ns
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed
specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test
conditions. Operation of the device beyond the maximum Operating Ratings is not recommended.
Note 2: All voltages are measured with respect to GND = 0V, unless otherwise specified.
Note 3: When the input voltage at any pin exceeds the power supplies (that is, VIN < GND or VIN > VA), the current at that pin should be limited to 10 mA. The 50
mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 10 mA to five.
Note 4: The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by TJmax, the
junction-to-ambient thermal resistance (θJA), and the ambient temperature (TA), and can be calculated using the formula PDMAX = (TJmax − TA)/θJA. The values
for maximum power dissipation listed above will be reached only when the ADC122S625 is operated in a severe fault condition (e.g. when input or output pins
are driven beyond the power supply voltages, or the power supply polarity is reversed). Such conditions should always be avoided.
Note 5: Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor. Machine model is a 220 pF capacitor discharged through 0 Ω. Charge
device model simulates a pin slowly acquiring charge (such as from a device sliding down the feeder in an automated assembler) then rapidly being discharged.
Note 6: Reflow temperature profiles are different for lead-free packages.
Note 7: Tested limits are guaranteed to National's AOQL (Average Outgoing Quality Level).
Note 8: Guaranteed by design, characterization, or statistical analysis and is not tested at final test.
Note 9: While the maximum sample rate is fSCLK/32, the actual sample rate may be lower than this by having the CS rate slower than fSCLK/32.
Note 10: tDIS is the time for DOUT to change 10%.
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ADC122S625
Timing Diagrams
30055342
FIGURE 1. ADC122S625 Single Conversion Timing Diagram
30055304
FIGURE 2. ADC122S625 Continuous Conversion Timing Diagram
30055306
FIGURE 3. DOUT Rise and Fall Times
30055310
FIGURE 5. Valid CS Assertion Times
30055311
FIGURE 4. DOUT Hold and Access Times
30055312
FIGURE 6. Voltage Waveform for tDIS
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ADC122S625
POSITIVE FULL-SCALE ERROR is the difference between
the differential input voltage at which the output code transitions to positive full scale and VREF minus 1.5 LSB.
POSITIVE GAIN ERROR is the difference between the positive full-scale error and the offset error.
POWER SUPPLY REJECTION RATIO (PSRR) is a measure
of how well a change in supply voltage is rejected. PSRR is
calculated from the ratio of the change in offset error for a
given change in supply voltage, expressed in dB. For the ADC122S625, VA is changed from 4.5V to 5.5V.
Specification Definitions
APERTURE DELAY is the time between the fourth falling
edge of SCLK and the time when the input signal is acquired
or held for conversion.
COMMON MODE REJECTION RATIO (CMRR) is a measure
of how well in-phase signals common to both input pins are
rejected.
To calculate CMRR, the change in output offset is measured
while the common mode input voltage is changed from 2V to
3V.
PSRR = 20 LOG (ΔOffset / ΔVA)
CMRR = 20 LOG ( Δ Output Offset / Δ Common Input)
SIGNAL TO NOISE RATIO (SNR) is the ratio, expressed in
dB, of the rms value of the input signal to the rms value of the
sum of all other spectral components below one-half the sampling frequency, not including harmonics or d.c.
SIGNAL TO NOISE PLUS DISTORTION (S/N+D or
SINAD) Is the ratio, expressed in dB, of the rms value of the
input signal to the rms value of all of the other spectral components below half the clock frequency, including harmonics
but excluding d.c.
SPURIOUS FREE DYNAMIC RANGE (SFDR) is the difference, expressed in dB, between the desired signal amplitude
to the amplitude of the peak spurious spectral component,
where a spurious spectral component is any signal present in
the output spectrum that is not present at the input and may
or may not be a harmonic.
TOTAL HARMONIC DISTORTION (THD) is the ratio of the
rms total of the first five harmonic components at the output
to the rms level of the input signal frequency as seen at the
output, expressed in dB. THD is calculated as
CONVERSION TIME is the time required, after the input voltage is acquired, for the ADC to convert the input voltage to a
digital word.
DIFFERENTIAL NON-LINEARITY (DNL) is the measure of
the maximum deviation from the ideal step size of 1 LSB.
DUTY CYCLE is the ratio of the time that a repetitive digital
waveform is high to the total time of one period. The specification here refers to the SCLK.
EFFECTIVE NUMBER OF BITS (ENOB, or EFFECTIVE
BITS) is another method of specifying Signal-to-Noise and
Distortion or SINAD. ENOB is defined as (SINAD − 1.76) /
6.02 and says that the converter is equivalent to a perfect
ADC of this (ENOB) number of bits.
FULL POWER BANDWIDTH is a measure of the frequency
at which the reconstructed output fundamental drops 3 dB
below its low frequency value for a full scale input.
INTEGRAL NON-LINEARITY (INL) is a measure of the deviation of each individual code from a line drawn from negative
full scale (½ LSB below the first code transition) through positive full scale (½ LSB above the last code transition). The
deviation of any given code from this straight line is measured
from the center of that code value.
MISSING CODES are those output codes that will never appear at the ADC outputs. The ADC122S625 is guaranteed not
to have any missing codes.
NEGATIVE FULL-SCALE ERROR is the difference between
the differential input voltage at which the output code transitions from negative full scale to the next code and −VREF + 0.5
LSB.
NEGATIVE GAIN ERROR is the difference between the negative full-scale error and the offset error.
OFFSET ERROR is the difference between the differential
input voltage at which the output code transitions from code
000h to 001h and 1/2 LSB.
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where Af1 is the RMS power of the input frequency at the output and Af2 through Af6 are the RMS power in the first 5
harmonic frequencies.
THROUGHPUT TIME is the minimum time required between
the start of two successive conversion.
8
VA = 5.0V, VREF = 2.5V, TA = +25°C, fSAMPLE = 200 kSPS, fSCLK =
DNL - 200 kSPS
INL - 200 kSPS
30055321
30055322
DNL vs. VA
INL vs. VA
30055323
30055324
DNL vs. VREF
INL vs. VREF
30055318
30055319
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ADC122S625
Typical Performance Characteristics
6.4 MHz, fIN = 20 kHz unless otherwise stated.
ADC122S625
Typical Performance Characteristics
VA = 5.0V, VREF = 2.5V, TA = +25°C, fSAMPLE = 200 kSPS, fSCLK =
6.4 MHz, fIN = 20 kHz unless otherwise stated.
DNL vs. SCLK FREQUENCY
INL vs. SCLK FREQUENCY
30055325
30055326
DNL vs. TEMPERATURE
INL vs. TEMPERATURE
30055329
30055330
SINAD vs. VA
THD vs. VA
30055333
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30055332
10
VA = 5.0V, VREF = 2.5V, TA = +25°C, fSAMPLE = 200 kSPS, fSCLK =
SINAD vs. VREF
THD vs. VREF
30055337
30055336
SINAD vs. SCLK FREQUENCY
THD vs. SCLK FREQUENCY
30055341
30055340
SINAD vs. INPUT FREQUENCY
THD vs. INPUT FREQUENCY
30055349
30055348
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ADC122S625
Typical Performance Characteristics
6.4 MHz, fIN = 20 kHz unless otherwise stated.
ADC122S625
Typical Performance Characteristics
VA = 5.0V, VREF = 2.5V, TA = +25°C, fSAMPLE = 200 kSPS, fSCLK =
6.4 MHz, fIN = 20 kHz unless otherwise stated.
SINAD vs. TEMPERATURE
THD vs. TEMPERATURE
30055372
30055371
VA CURRENT vs. VA
VA CURRENT vs. SCLK FREQ
30055374
30055355
VA CURRENT vs. TEMPERATURE
VREF CURRENT vs. SCLK FREQ
30055354
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30055352
12
VA = 5.0V, VREF = 2.5V, TA = +25°C, fSAMPLE = 200 kSPS, fSCLK =
VREF CURRENT vs. TEMP
CMRR vs. CM RIPPLE FREQ
30055373
30055351
SPECTRAL RESPONSE - 200 kSPS
30055314
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ADC122S625
Typical Performance Characteristics
6.4 MHz, fIN = 20 kHz unless otherwise stated.
ADC122S625
crease. Since the noise is Gaussian in nature, the effects of
this noise can be reduced by averaging the results of a number of consecutive conversions.
Additionally, since offset and gain errors are specified in LSB,
any offset and/or gain errors inherent in the A/D converter will
increase in terms of LSB size as the reference voltage is reduced.
The reference input and the analog inputs are connected to
the capacitor array through a switch matrix when the input is
sampled. Hence, the current requirements at the reference
and at the analog inputs are a series of transient spikes that
occur at a frequency dependent on the operating sample rate
of the ADC122S625.
The reference current changes only slightly with temperature.
See the curves, “Reference Current vs. SCLK Frequency”
and “Reference Current vs. Temperature” in the Typical Performance Curves section for additional details.
Functional Description
The ADC122S625 is a dual 12-bit, simultaneous sampling
Analog-to-Digital (A/D) converter. The converter is based on
a successive-approximation register (SAR) architecture
where the differential nature of the analog inputs is maintained from the internal track-and-hold circuits throughout the
A/D converter. The analog inputs on both channels are sampled simultaneously to preserve their relative phase information to each other. The architecture and process allow the
ADC122S625 to acquire and convert dual analog signals at
sample rates up to 200 kSPS while consuming very little power.
The ADC122S625 requires an external reference, external
clock, and an analog power supply. The analog supply (VA)
can range from 4.5V to 5.5V and the external reference can
be any voltage between 1V and VA. The value of the reference
voltage determines the range of the analog input, while the
reference input current depends upon the conversion rate.
Analog inputs are presented at the inputs of Channel A and
Channel B. Upon initiation of a conversion, the differential input at these pins is sampled on the internal capacitor array.
The analog input signals are disconnected from the external
circuitry while a conversion is in progress.
The external clock can take on values as indicated in the
Electrical Characteristics Table. The duty cycle of the clock is
essentially unimportant, provided the minimum clock high and
low times are met. The minimum clock frequency is set by
internal capacitor leakage. Each conversion requires thirytwo clock cycles to complete.
The ADC122S625 offers a high-speed serial data output that
is binary 2's complement and compatible with several standards, such as SPI™, QSPI™, MICROWIRE™, and many
common DSP serial interfaces. The digital conversion result
of Channel A and Channel B is clocked out on the falling
edges of the SCLK input and is provided serially at DOUT, most
significant bit first. The result of Channel A is output before
the result of Channel B, with four zeros in between the two
results. The digital data provided on DOUT is that of the conversion currently in progress. With CS held low after the result
of Channel B is output, the ADC122S625 will continuously
convert the analog inputs until CS is de-asserted (brought
high). Having a single, serial DOUT makes the ADC122S625
an excellent replacement for two independent ADCs that are
part of a daisy chain configuration and allows a system designer to save valuable board space and power.
2.0 ANALOG SIGNAL INPUTS
The ADC122S625 has dual differential inputs where the effective input voltage that is digitized is CHA+ minus CHA−
(DIFFINA) and CHB+ minus CHB− (DIFFINB). As is the case
with all differential input A/D converters, operation with a fully
differential input signal or voltage will provide better performance than with a single-ended input. However, the
ADC122S625 can be presented with a single-ended input as
shown in Section 2.2 and the Application Circuits.
The current required to recharge the input sampling capacitor
will cause voltage spikes at the + and − inputs. Do not try to
filter out these noise spikes. Rather, ensure that the noise
spikes settle out during the acquisition period (three SCLK
cycles after the fall of CS). This is true for both Channel A and
Channel B since both channels are converted simultaneously
on the fourth falling edge of SCLK after CS is asserted.
2.1 Differential Input Operation
With a fully differential input voltage or signal, a positive full
scale output code (0111 1111 1111b or 7FFh) will be obtained
when DIFFINA or DIFFINB is greater than or equal to VREF −
1.5 LSB. A negative full scale code (1000 0000 0000b or
800h) will be obtained when DIFFINA or DIFFINB is greater
than or equal to −VREF + 0.5 LSB. This ignores gain, offset
and linearity errors, which will affect the exact differential input
voltage that will determine any given output code. Figure 7
shows the ADC122S625 being driven by a full-scale differential source.
1.0 REFERENCE INPUT
The externally supplied reference voltage sets the analog input range. The ADC122S625 will operate with a reference
voltage in the range of 1V to VA.
Operation with a reference voltage below 1V is also possible
with slightly diminished performance. As the reference voltage (V REF) is reduced, the range of acceptable analog input
voltages is reduced. Assuming a proper common-mode input
voltage, the differential peak-to-peak input range is limited to
twice VREF. See Section 2.3 for more details. Reducing the
value of VREF also reduces the size of the least significant bit
(LSB). The size of one LSB is equal to twice the reference
voltage divided by 4096. When the LSB size goes below the
noise floor of the ADC122S625, the noise will span an increasing number of codes and overall performance will suffer.
For example, dynamic signals will have their SNR degrade,
while D.C. measurements will have their code uncertainty in-
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30055380
FIGURE 7. Differential Input
14
ADC122S625
2.2 Single-Ended Input Operation
For single-ended operation, the non-inverting inputs of the
ADC122S625 can be driven with a signal that has a maximum
to minimum value range that is equal to or less than twice the
reference voltage. The inverting inputs should be biased at a
stable voltage that is halfway between these maximum and
minimum values. In order to utilize the entire dynamic range
of the ADC122S625, the reference voltage is limited at VA /
2. This allows the non-inverting inputs the maximum swing
range of ground to VA. Figure 8 shows the ADC122S625 being driven by a full-scale single-ended source. Even though
the design of the ADC122S625 is optimized for a differential
input, there is very little performance degradation while operating the ADC122S625 in single-ended fashion.
30055362
FIGURE 10. VCM range for single-ended operation
TABLE 1. Allowable VCM Range
Input Signal
Differential
Single-Ended
30055381
Minimum VCM
Maximum VCM
VREF / 2
VA − VREF / 2
VREF
VA − VREF
3.0 SERIAL DIGITAL INTERFACE
The ADC122S625 communicates via a synchronous serial
interface as shown in the Timing Diagram section. CS, chip
select, initiates conversions and frames the serial data transfers. SCLK (serial clock) controls both the conversion process
and the timing of the serial data. DOUT is the serial data output
pin, where the conversion results of Channel A and Channel
B are sent as a serial data stream, with the result of Channel
A output before the result of Channel B.
A serial frame is initiated on the falling edge of CS and ends
on the rising edge of CS. The ADC122S625's DOUT is in a high
impedance state when CS is high (asserted) and is active
when CS is low (de-asserted); thus CS acts as an output enable. A timing diagram for a single conversion is shown in
Figure 1.
During the first three cycles of SCLK, the ADC122S625 is in
acquisition mode (tACQ), tracking the input voltage on both
Channel A and Channel B. For the next twelve SCLK cycles
(tCONV), the conversion of Channel A and Channel B is accomplished simultaneously and data is presented on DOUT,
one bit at a time. SCLK falling edges one through four clock
out leading zeros while falling edges five through sixteen
clock out the conversion result of Channel A, MSB first. The
process is repeated in order to clock out the result of Channel
B, with SCLK falling edges seventeen through twenty clocking
out four zeros followed by falling edges twenty-one through
thirty-two clokcing out the conversion result of Channel B. If
there is more than one conversion in a frame (continuous
conversion mode), the ADC122S625 will re-enter acquisition
mode on the falling edge of SCLK after the N*32 rising edge
of SCLK and re-enter conversion mode on the N*32+4 falling
edge of SCLK as shown in Figure 2. "N" is an integer value.
The ADC122S625 can enter acquisition mode under three
different conditions. The first condition involves CS going low
(asserted) with SCLK high. In this case, the ADC122S625
enters acquisition mode on the first falling edge of SCLK after
CS is asserted. In the second condition, CS goes low with
SCLK low. Under this condition, the ADC122S625 automatically enters acquisition mode and the falling edge of CS is
FIGURE 8. Single-Ended Input
2.3 Input Common Mode Voltage
The allowable input common mode voltage (VCM) range depends upon the supply and reference voltages used for the
ADC122S625. The ranges of VCM for differential and singleended operation are depicted in Figure 9 and Figure 10.
Equations for calculating the minimum and maximum common mode voltages for differential and single-ended operation are shown in Table 1.
30055361
FIGURE 9. VCM range for Differential Input operation
15
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ADC122S625
seen as the first falling edge of SCLK. In the third condition,
CS and SCLK go low simultaneously and the ADC122S625
immediately enters acquisition mode. While there is no timing
restriction with respect to the falling edges of CS and the
falling edge of SCLK, see Figure 5 for setup and hold time
requirements for the falling edge of CS with respect to the
rising edge of SCLK.
TABLE 2. Ideal Output Code vs. Input Voltage
Analog Input
(+IN) − (−IN)
VREF − 1.5 LSB 0111 1111 1111
3.1 CS Input
The CS (chip select bar) is an active low input that is TTL and
CMOS compatible. The ADC122S625 transitions from acquisition mode, to conversion mode, to power-down mode when
CS is low and is always in power-down mode when CS is high.
The falling edge of CS marks the beginning of a conversion
where the input to Channel A and Channel B are tracked by
the input sampling capacitor. The rising edge of CS marks the
end of a conversion window. As a result, CS frames the conversion window and can be used to control the sample rate of
the ADC122S625. While the SCLK frequency is limited to a
range of 1.6 MHz to 6.4 MHz, the frequency of CS has no
limitation. This allows a system designer to operate the
ADC122S625 at sample rates approaching zero samples per
second if conserving power is very important. See Burst Mode
Operation for more details. Multiple conversions can occur
within a given conversion frame with each conversion requiring thirty-two SCLK cycles. This is referred to as continuous
conversion mode and is shown in Figure 2 of the Timing Diagram section.
Proper operation requires that the fall of CS not occur simultaneously with a rising edge of SCLK. If the fall of CS occurs
during the rising edge of SCLK, the data might be clocked out
one bit early. Whether or not the data is clocked out early
depends upon how close the CS transition is to the SCLK
transition, the device temperature, and characteristics of the
individual device. To ensure that the MSB is always clocked
out at a given time (the 5th falling edge of SCLK), it is essential
that the fall of CS always meet the timing requirement specified in the Timing Specification table.
7FF
2047
+ 0.5 LSB
0000 0000 0001
001
1
− 0.5 LSB
0000 0000 0000
000
0
0V − 1.5 LSB
1111 1111 1111
FFF
−1
−VREF + 0.5 LSB 1000 0000 0000
800
−2048
While data is output on the falling edges of SCLK, receiving
systems have the option of capturing the data from the
ADC122S625 on the subsequent rising or falling edge of
SCLK. If a receiving system is going to capture data on the
subsequent falling edges of SCLK, it is important to make sure
that the minimum hold time after an SCLK falling edge (tDH)
is acceptable. See Figure 4 for DOUT hold and access times.
DOUT is enabled on the falling edge of CS and disabled on the
rising edge of CS. If CS is raised prior to the 16th falling edge
of SCLK, the current conversion is aborted and DOUT will go
into its high impedance state. A new conversion will begin
when CS is taken LOW.
Applications Information
OPERATING CONDITIONS
We recommend that the following conditions be observed for
operation of the ADC122S625:
−40°C ≤ TA ≤ +105°C
+4.5V ≤ VA ≤ +5.5V
1V ≤ VREF ≤ VA
1.6 MHz ≤ fSCLK ≤ 6.4 MHz
VCM: See Section 2.3
4.0 POWER CONSUMPTION
The architecture, design, and fabrication process allow the
ADC122S625 to operate at conversion rates up to 200 kSPS
while consuming very little power. The ADC122S625 consumes the least amount of power while operating in power
down mode. For applications where power consumption is
critical, the ADC122S625 should be operated in power down
mode as often as the application will tolerate. To further reduce power consumption, stop the SCLK while CS is high.
3.2 SCLK Input
The SCLK (serial clock) serves two purposes in the
ADC122S625. It is used by the ADC122S625 as the conversion clock and it is used as the serial clock to output the
conversion results. The SCLK input is TTL and CMOS compatible. Internal settling time requirements limit the maximum
clock frequency while internal capacitor leakage limits the
minimum clock frequency. The ADC122S625 offers guaranteed performance with the clock rates indicated in the Electrical Characteristics Table.
4.1 Burst Mode Operation
Normal operation of the ADC122S625 requires the SCLK frequency to be thirty-two times the sample rate and the CS rate
to be the same as the sample rate. However, in order to minimize power consumption in applications requiring sample
rates below 50 kSPS, the ADC122S625 should be run with
an SCLK frequency of 6.4 MHz and a CS rate as slow as the
system requires. When this is accomplished, the
ADC122S625 is operating in burst mode. The ADC122S625
enters into power down mode at the end of each conversion,
minimizing power consumption. This causes the converter to
spend the longest possible time in power down mode. Since
power consumption scales directly with conversion rate, minimizing power consumption requires determining the lowest
conversion rate that will satisfy the requirements of the system.
3.3 Data Output(s)
The conversion result of Channel A and Channel B is output
on DOUT, with the result of Channel A being output before the
result of Channel B. The data output format of the
ADC122S625 is binary, two’s complement, as shown in Table
2. This table indicates the ideal output code for a given input
voltage and does not include the effects of offset, gain error,
linearity errors, or noise. Each data output bit is output on the
falling edges of SCLK.
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2's
2's
2's
Complement
Comp.
Comp.
Binary Output Hex Code Dec Code
16
5.1 Analog Power Supply
Any ADC architecture is sensitive to spikes on the power supply, reference, and ground pins. These spikes may originate
from switching power supplies, digital logic, high power devices, and other sources. Power to the ADC122S625 should
be clean and well bypassed. A 0.1 µF ceramic bypass capacitor and a 1 µF to 10 µF capacitor should be used to
bypass the ADC122S625 supply, with the 0.1 µF capacitor
placed as close to the ADC122S625 package as possible.
Since the ADC122S625 has a separate analog and reference
pin, the user has two options. The first option is to tie the analog and reference supply pins together and power them with
the same power supply. This is the most cost effective way of
powering the ADC122S625 but it is also the least ideal. As
stated previously, noise from the analog supply pin can couple into the reference supply pin and adversely affect performance. The other option involves the user powering the
analog and reference supply pins with separate supply voltages. These supply voltages can have the same amplitude or
they can be different. The only design constraint is that the
reference supply voltage be less than the analog supply voltage.
6.0 APPLICATION CIRCUITS
The following figures are examples of the ADC122S625 in
typical application circuits. These circuits are basic and will
generally require modification for specific circumstances.
6.1 Data Acquisition
Figure 11 shows a basic low cost, low power data acquisition
circuit. The analog supply pin is powered by the system +5V
supply and the 2.5V reference voltage is generated by the
LM4040-2.5 shunt reference.
5.2 Voltage Reference
The reference source must have a low output impedance and
needs to be bypassed with a minimum capacitor value of 0.1
µF. A larger capacitor value of 1 µF to 10 µF placed in parallel
with the 0.1 µF is preferred. While the ADC122S625 draws
very little current from the reference on average, there are
higher instantaneous current spikes at the reference input.
The reference input of the ADC122S625, like all A/D converters, does not reject noise or voltage variations. Keep this in
mind if the reference voltage is derived from the power supply.
Any noise and/or ripple from the supply that is not rejected by
the external reference circuitry will appear in the digital results. The use of an active reference source is recommended.
The LM4040 and LM4050 shunt reference families and the
LM4132 and LM4140 series reference families are excellent
choices for a reference source.
30055334
FIGURE 11. Low cost, low power Data Acquisition
System
5.3 PCB Layout
Capacitive coupling between the noisy digital circuitry and the
sensitive analog circuitry can lead to poor performance. The
solution is to keep the analog circuitry separated from the
digital circuitry and the clock line as short as possible. Digital
circuits create substantial supply and ground current transients. The logic noise generated could have significant impact upon system noise performance. To avoid performance
degradation of the ADC122S625 due to supply noise, avoid
sharing the power supplies for VA and VREF with other digital
circuity on the board.
Generally, analog and digital lines should cross each other at
90° to avoid crosstalk. However, to maximize accuracy in high
resolution systems, avoid crossing analog and digital lines altogether. It is important to keep clock lines as short as possible and isolated from other lines, including other digital lines.
In addition, the clock line should also be treated as a transmission line and be properly terminated. The analog input
6.2 Current Sensing Application
Figure 12 shows an example of interfacing a pair of current
transducers to the ADC122S625. The current transducers
convert an input current into a voltage that is converted by the
ADC122S625. Since the output voltage of the current transducers are single-ended and centered around a commonmode voltage of 2.5V, the ADC122S625 is configured with the
output of the transducer driving the non-inverting inputs and
the common-mode output voltage of the transducer driving
the inverting input. The output of the transducer has an output
range of ±2V around the common-mode voltage of 2.5V. As
a result, a series reference voltage of 2.0V is connected to the
ADC122S625. This will allow all of the codes of the
ADC122S625 to be available for the application. This configuration of the ADC122S625 is referred to as a single-ended
application of a differential ADC. All of the elements in the
17
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ADC122S625
should be isolated from noisy signal traces to avoid coupling
of spurious signals into the input. Any external component
(e.g., a filter capacitor) connected between the converter's
input pins and ground or to the reference input pin and ground
should be connected to a very clean point in the ground plane.
A single, uniform ground plane and the use of split power
planes are recommended. The power planes should be located within the same board layer. All analog circuitry (input
amplifiers, filters, reference components, etc.) should be
placed over the analog power plane. All digital circuitry and
I/O lines should be placed over the digital power plane. Furthermore, the GND pin on the ADC122S625 and all the
components in the reference circuitry and input signal chain
that are connected to ground should be connected to the
ground plane at a quiet point. Avoid connecting these points
too close to the ground point of a microprocessor, microcontroller, digital signal processor, or other high power digital
device.
5.0 POWER SUPPLY CONSIDERATIONS AND PCB
LAYOUT
For best performance, care should be taken with the physical
layout of the printed circuit board. This is especially true with
a low reference voltage or when the conversion rate is high.
At high clock rates there is less time for settling, so it is important that any noise settles out before the conversion begins.
ADC122S625
application are conveniently powered by the same +5V power
supply, keeping circuit complexity and cost to a minimum.
30055338
FIGURE 12. Interfacing the ADC122S625 to a Current Transducer
other hand, it offers no common-mode rejection of noise coming from the bridge sensors. The application circuit assumes
the bridge sensors are powered from the same +5V power
supply voltage as the analog supply pin on the ADC122S625.
This has the benefit of providing the ideal common-mode input voltage for the ADC122S625 while keeping design complexity and cost to a minimum. The LM4132-4.1, a 4.1V series
reference, is used as the reference voltage in the application.
6.3 Bridge Sensor Application
Figure 13 shows an example of interfacing the ADC122S625
to a pair of bridge sensors. The application assumes that the
bridge sensors require buffering and amplification to fully utilize the dynamic range of the ADC and thus optimize the
performance of the entire signal path. The amplification stage
for each ADC input consists of a pair of opamps from the
LMP7704. The amplification stage offers the benefit of high
input impedance and potentially high amplification. On the
30055335
FIGURE 13. Interfacing the ADC122S625 to Bridge Sensors
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18
ADC122S625
Physical Dimensions inches (millimeters) unless otherwise noted
10-Lead MSOP
Order Number ADC122S625CIMM
NS Package Number MUB10A
19
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ADC122S625 Dual 12-Bit, 50 kSPS to 200 kSPS, Simultaneous Sampling A/D Converter
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