YEASHIN UF1GS

DATA SHEET
U F1AS THRU UF1MS
SEMICONDUCTOR
H
SURFACE MOUNT REVERSE VOLTAGE - 50 to 1000 Volts
ULTRA FAST RECTIFIERS FORWARD CURRENT - 1.0 Ampere
: Halogen Free
: Pb Free
SOD-123S
FEATURES
Unit:inch(mm)
0.067(1.70)
0.055(1.40)
• • For surface mounted applications
0.112(2.85)
0.100(2.55)
• • Low forward voltage drop and high current capability
• • Low reverse leakage current
.037(0.94)
TYP
• • Glass passivated chip
• • Ultra fast switching for high efficiency
• • Plastic material has UL flammability classification 94V-0
• • High temperature soldering : 260OC / 10 seconds at terminals
• •
Pb free product at available : 99% Sn above meet RoHS environment
0.006(0.15)
TYP
substance directive request
0.047(1.20)
MAX
MECHANICAL DATA
• • Case : Molded plastic
0.152(3.85)
0.140(3.55)
• • Polarity : Indicated by cathode band
• • Weight : 0 .01 grams
0.014(0.35)
MIN
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25• • ambient temperature unless otherwise specified.
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%
CHARACTERISTICS
SYMBOL
MARKING CODE
UF1AS
UF1BS
UF1DS
UF1GS
UF1KS
UF1MS
U1
U2
U3
U4
UF1JS
U5
U6
U7
UNIT
100
200
400
600
800
1000
V
Maximum Recurrent Peak Reverse V oltage
VRRM
50
Maximum RMS Voltage
VRMS
35
70
140
280
420
560
700
V
VDC
50
100
200
400
600
800
1000
V
Maximum DC Blocking Voltage
Maximum Average Forward
Rectified Current
@TL =75°C
I(AV)
1.0
A
IFSM
30
A
Peak Forward Surge Current
8.3ms single ha lf sine- wave
super imposed on rated load (JEDEC METHOD)
Maxi mum f orward Voltage at 1.0A DC
VF
Maxi mum DC Reverse Cur rent
@TJ =25 °C
at Rated DC Blocking Voltage
@TJ =100°C
Maximum Reverse Recovery Time (Note 1)
Typical Junction
Capacitance (Note 2)
Typical Thermal Resistance (Note 3)
Operating Temperature Range
Storage Temperature Range
1.0
1.3
1.5
1.7
5
IR
V
uA
100
TRR
50
75
ns
CJ
20
10
pF
RθJL
30
TJ
-55 to +150
°C
TSTG
-55 to +150
°C
°C/W
NOTES : 1.Reverse Recovery Test Conditions :IF=0.5A,IR=1.0A,IRR=0.25A.
2.Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
3.Thermal Resistance junction to Lead.
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REV.02 20110725
RATING AND CHARACTERISTIC CURVES
UF1AS THRU UF1MS
trr
+0.5A
0
-0.25
-1.0
NOTE:1.Rise Time = 7ns max.
Input Impedance = 1 megohm. 22pF
2.Rise Time = 10ns max.
1cm
SET TIME
BASE FOR
50 ns/cm
Source Impedance = 50 Ohms
Fig. 1-REVERSE RECOVERY TIME CHARACTERISTIC AND TEST CIRCUIT DIAGRAM
10
PEAK FORWARD SURGE CURRENT,
AMPERES
TJ = 25 O C
TYPICAL
IFM, Apk
UF1AS
1.0
UF1GS
0.1
UF1KS
100
TJ = 25O C
f = 1.0MHz
Vsig = 50m Vp-p
10
1
0.1
1
10
100
.01
0
.2
.4
.6
.8
1.0 1.2
1.4
REVERSE VOLTAGE, VOLTS
AVERAGE FORWARD
CURRENT AMPERES
2.0
Fig. 3- TYPICAL JUNCTION CAPACITANCE
PEAK FORWARD SURGE CURRENT,
AMPERES
Fig. 2-FORWARD CHARACTERISTICS
SINGLE PHASE HALF WAVE
RESISTIVE OR INDUCTIVE
P.C.B MOUNTED ON
0.315×0.315"(8.0×8.0mm)
PAD AREAS
1.0
25
50
75
25
8.3ms SINGLE HALF SINE WAVE
20
JEDEC METHOD
15
10
5
1
100 125 150 175
2
5
10
20
50
NUMBER OF CYCLES AT 60Hz
LEAD TEMPERATURE, OC
Fig. 4- FORWARD CURRENT DERATING CURVE
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30
Fig. 5-PEAK FORWARD SURGE CURRENT
2
REV.02 20110725
100
U F1AS THRU UF1MS
MOUNTING PAD LAYOUT
S
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REV.02 20110725