ZMD-Standard April 2002 Package PQ4-LQFP44 (10 x 10) MDS 750 Supersedes Edition 11.97 Dimensions in millimetres Based on JEDEC: MS-026 Detail Z 1 Dimensions 0,2 M G bottom view E e HE b top view LP c 0,1 A1 A A2 Z Heat sink 1 D HD Dimensions of Sub-Group B1 Dimensions of Sub-Group C1 enom 0,80 Amin Amax 1,60 A1min 0,05 bPmin 0,30 A1max 0,15 bPmax 0,45 A2min 1,35 HEmin 11,85 A2max 1,45 HEmax 12,15 cmin 0,09 HDmin 11,85 cmax 0,20 HDmax 12,15 Dmin 9,75 LPmin 0,45 Dmax 10,25 - 2 Weight £ 0,5 g Emin 9,75 3 Package Body Material Low Stress Epoxy Emax 10,25 4 Lead Material FeNi-Alloy or Cu-Alloy qmin 0° 5 Lead Finish solder plating qmax 7° 6 Lead Form Z-bends Zentrum Mikroelektronik Dresden AG Editor: signed Schoder Date: 30.04.2002 Check: signed Marx Quality: signed Gersdorf Doc-No. QS-000750-HD-02