ZMD-Standard February 2000 Package SSOP20 (5,3 mm) MDS 757 Supersedes Edition 11.99 Dimensions in millimetres Based on JEDEC JEP95: MO-150 1 Dimensions A A2 X View X k x 45° 0,1 1 Z bp e 0,15 M D Dimensions of Sub-Group B1 Dimensions of Sub-Group C1 Amax 1,99 Amin 1,73 bPmin 0,25 A1min 0,05 bPmax 0,38 A1max 0,21 enom 0,65 A2min 1,68 HEmin 7,65 A2max 1,78 HEmax 7,90 cmin 0,09 LPmin 0,63 cmax 0,20 Zmax 0,74 Dmin* 7,07 Dmax* 7,33 2 Weight 0,3 g Emin* 5,20 3 Package Body Material Low Stress Epoxy Emax* 5,38 4 Lead Material FeNi-Alloy or Cu-Alloy kmin 0,25 5 Lead Finish solder plating °min 0° 6 Lead Form Z-bends °max 10° * without mold-flash Zentrum Mikroelektronik Dresden AG Editor: signed Schoder Date: 16.02.2000 Check: signed Marx Quality: signed Lorenz Doc-No. QS-000757-HD-02 ° c Lp HE E A1 20