AQ7-IMX6 09 Qseven CPU Module with Onboard Freescale® i.MX6 Solo/Dual/Quad ARM Cortex A9 Processor Qseven CPU Modules Features ■■ Freescale® i.MX6 Solo/Dual/Quad Processor DDR3 800 Memory 1GB (Solo/Dual) ■■ Onboard DDR3 1066 Memory 2GB (Quad) ■■ Gigabit Ethernet x 1 ■■ 24-bit Dual-Channel LVDS LCDs (Optional) ■■ I2S Audio Interface ■■ SATA x 1, eMMC (Optional) ■■ USB2.0 x 5, PCI-Express [x1] x 1 ■■ Qseven Module Size, 70mm x 70mm , Qseven Rev. 2.0 ■■ Onboard DDR3 Memory Chips Micrel® KSZ9021RNI Gigabit Ethernet eMMC Onboard Freescale® i.MX6 Solo/Dual/Quad Processor Specifications System •Product CD •AQ7-IMX6 Form Factor Qseven, Qseven Rev. 2.0 Processor Freescale® i.MX6 Solo 1.0GHz Processor Freescale® i.MX6 Dual 1.0GHz Processor Freescale® i.MX6 Quad 1.0/1.2GHz Processor Ordering Information System Memory Onboard DDR3/1GB, Max. 1 GB (Solo/Dual) Onboard DDR3/1GB, Max. 2 GB (Quad) •TBD Chipset — I/O Chipset — Ethernet Micrel® KSZ9021RNI for 10/1000/1000Base BIOS — Wake On LAN Yes Watchdog Timer Integrated Watch Dog and Timer H/W Status Monitoring Integrate advanced power management Expansion Interface PCI Express [x1] x1 CAN Bus x1 SMBUS x1 UART x1 SDIO x1 Power Requirement +5V DC Power Consumption (Typical) — Board Size 2.75" x 2.75"(70mm x 70mm) Gross Weight 0.44 lb (0.2 Kg) Operation Temperature 32 °F ~ 140 °F (0 °C ~ 60 °C) or -40°F ~ 185°F (-40°C ~ 85°C) for WiTAS 2 Storage Temperature -40°F ~ 185°F (-40°C ~ 85°C) Operation Humidity 0% ~ 90% relative humidity, non-condensing MTBF (Hours) — Display Supports LCD/CRT/HDMI Resolution Up to 1400 x 1050 (SXGA) @ 60Hz for CRT Up to 1366 x 768 or 1280 x 800 (WXGA) @ 60Hz for LCD LCD Interface Up to 24-bit dual channel LVDS (optional) I/O 09-3 Packing List Storage 1 SATA (3GB/s), eMMCx1(optional) Serial Port 1 (Tx/Rx) Parallel Port — USB USB 2.0 x 5(Shared with 1 x USB OTG client) PS/2 Port — I2C 1 Audio I2S GPIO 8-bit Optional Accessories •TBD ECB-970 Qseven Rev. 2.0 Carrier Board for ARM/X86 Solutions Features ■■ Supports Qseven Module ARM/x86 Based ■■ Supports Gigabit Ethernet, RJ-45 ■■ Up to 24-bit Dual Channel LVDS Connector or EDP, DP or HDMI ■■ High Definition Audio or I2S Audio Interface ■■ SATA Port x 2, SDIO x 1 ■■ USB 2.0 x 8, USB 3.0 x 2, USB OTG ■■ LPC Connector x 1 ■■ Qseven 2.0 ■■ 9.65” Form Factor ■■ Support Launching in Q2 Specifications System Form Factor MTX I/O Chipset Winbond W83627DHG-P or Fintek F81866 (optional) Ethernet 10/1000/1000Base-TX, RJ-45 x 1 (From CPU module) Expansion Interface PCI Express [x4] x 1, LPC Connector x 1 (For Super I/O Card only) Power Requirement +5V DC Power Consumption (Typical) — Board Size 9.65" x 9.65" (243.84mm x 243.84mm) Gross Weight 1.32 lb (0.6 Kg) Operation Temperature 32°F ~ 140°F (0°C ~ 60°C) Storage Temperature -40°F ~ 185°F (-40°C ~ 85°C) Operation Humidity 0% ~ 90% relative humidity, non-condensing MTBF (Hours) — Display LVDS or EDP, DP or HDMI LCD Interface Up to 24-bit dual channel LVDS I/O — Storage SATA x 2, SDIO x 1 Serial Port RS-232 x 1, RS-232/422/485 x 1 Parallel Port — USB USB 2.0 x 8, USB3.0 x 2, USB OTG PS/2 Port — I2C 1 Audio Audio Jack, supports Line-in, Line-out, Microphone, Headphone (ARM base only) Debug LED — Packing List •Product CD •ECB-970 09-4