05 COM-45SP COM Express Type 2 CPU Module With Intel® Core™ 2 Duo/ Celeron® M (Socket-P Based) Processor COM Express CPU Modules Features ■■ Intel® Dual-channel DDR3 SODIMM 2-pin Wafer for RTC Battery μFC-PGA (Socket P) ICH9M Intel® 82567LM Gigabit Ethernet GM45 Core™ 2 Duo/ Celeron® M (Socket-P Based) Processor ■■ Intel® GM45 + ICH9M ■■ Dual-channel DDR3 SODIMM 800/1066 Memory, Max. 8 GB ■■ Gigabit Ethernet ■■ CRT, Up To 24-bit Dual-channel LVDS LCD, DisplayPort™, HDMI, DVI, SDVO ■■ High Definition Audio Interface ■■ SATA 3.0Gb/s x 4 ■■ USB2.0 x 8 ■■ PCI x 4, PCI-Express [x16] x 1, PCI-Express [x1] x 5 ■■ Wide DC Input Range, +8.5V To +19V (Optional) ■■ COM Express Basic Module, Pin-out Type 2, COM.0 Rev. 1.0 Specifications System 05-7 Form Factor COM Express basic module, Pin-out Type 2, COM.0 Rev. 1.0 I/O Processor Intel® Core™ 2 Duo/ Celeron® M (Socket-P based 35mm x 35mm) processor Storage SATA 3.0Gb/s x 4 System Memory 204-pin DDR3 SODIMM x 2, Max. 8 GB (DDR3 800/1066), supports dual-channel function USB USB2.0 x 8 Audio High definition audio Chipset Intel® GM45 + ICH9M GPIO Up to 4 in or 4 out I/O Chipset ICH9M Ethernet Intel® 82567LM, 10/100/1000Base-TX TPM v1.2 BIOS Award BIOS v8.0 SPI type, 2 MB ROM EEPROM Atmel® AT24C02, save BIOS and configuration data (Optional) Wake on LAN Yes Watchdog Timer Fintek F75111 H/W Status Monitoring Supports CPU temperature monitoring Expansion Interface PCI-Express [x16] x 1 (Shared with 2 SDVOs/ 3 DisplayPorts/ 2 HDMIs/ 2 DVIs) ==> Can be configured as PCI-Express [x1]/ [x2]/ [x4]/ [x8] PCI-Express [x1] x 5 32-bit PCI x 4 LPC bus x 1 SMBus x 1 I2C x 1 Power Requirement Wide DC input range, +8.5V to +19V (Optional) Nominal: +12V 2-pin wafer for RTC battery Power Consumption (Typical) Intel® T9400 2.53 GHz, DDR3 1066 2 GB 3.94A @ +12V, 0.38A @ +5V (w/ECD-916M) Board Size 4.92"(L) x 3.74"(W) (125mm x 95mm) Gross Weight 0.66 lb (0.3 Kg) Operating Temperature 32°F ~ 140°F (0°C ~ 60°C) Storage Temperature -40°F ~ 176°F (-40°C ~ 80°C) Operating Humidity 0% ~ 90% relative humidity, non-condensing MTBF (Hours) 85,000 Display Supports CRT/LCD, CRT/DVI, LCD/DVI simultaneous/ dual view displays Chipset Intel® GM45 integrated Integrates hardware MPEG2 decoder Supports WMV9 (VC-1) and H.264 (AVC) Memory Shared system memory up to 512 MB/ DVMT 5.0 Resolution Up to 2048 x 1536 (QXGA) for CRT Up to 1920x 1200 (QXGA) for LCD LCD Interface Up to 24-bit dual-channel LVDS SDVO Supports SDVO x 2 (Shared with PCI-Express [x16]) HDMI Supports HDMI x 2 (Shared with PCI-Express [x16], needs to add a level shifter) DVI Supports DVI x 2 (Shared with PCI-Express [x16], needs to add a level shifter) DisplayPort Supports DisplayPort™ x 3 (Shared with PCI-Express [x16]) Packing List •M2.5 Screw x 5 •Product CD •COM-45SP Note: All specifications are subject to change without notice. COM-45SP Dimension Unit: mm Ordering Information Part Number TF-COM-45SP-A10 COM Express Type 2 (COM.0 Rev.1.0) CPU Intel® Core™ 2 Duo Mobile (Socket P) Memory DDR3 SODIMM x 2 Max.8GB Display LVDS CRT, LVDS, SDVO, HDMI, 24-bit dual DP, DVI channel Storage SATA2 x 4 LAN GbE x 1 USB USB2.0 x 8 URAT — Expansion Slot PCI-E[16] x 1 PCI-E[1] x 5 32-bit PCI x 4 Power 12V Temp 0°C ~ 60°C Optional Accessories •TF-ECB-916M-A10-01 COM Express Carrier Board, microATX, Dual Gigabit Ethernet, 7.1CH Audio, 4 COM, USB, PCI-Express, AT/ATX, Rev. A1.0 •TF-PER-A051 CPU Cooler, For COM-45SP, Socket-type CPU, 12V Fan •TF-PER-A082 Passive Heatsink, For COM-45SP, Socket-type CPU •TF-PER-A072 Heat Spreader Kit, For COM-45SP, Socket-type CPU 05-8