ECB-970 Qseven Rev. 2.0 Carrier Board for ARM/X86 Solutions Features ■■ Supports Qseven Module ARM/x86 Based ■■ Supports Gigabit Ethernet, RJ-45 ■■ Up to 24-bit Dual Channel LVDS Connector or EDP, DP or HDMI ■■ High Definition Audio or I2S Audio Interface ■■ SATA Port x 2, SDIO x 1 ■■ USB 2.0 x 8, USB 3.0 x 2, USB OTG ■■ LPC Connector x 1 ■■ Qseven 2.0 ■■ 9.65” Form Factor ■■ Support Launching in Q2 Specifications System Form Factor MTX I/O Chipset Winbond W83627DHG-P or Fintek F81866 (optional) Ethernet 10/1000/1000Base-TX, RJ-45 x 1 (From CPU module) Expansion Interface PCI Express [x4] x 1, LPC Connector x 1 (For Super I/O Card only) Power Requirement +5V DC Power Consumption (Typical) — Board Size 9.65" x 9.65" (243.84mm x 243.84mm) Gross Weight 1.32 lb (0.6 Kg) Operation Temperature 32°F ~ 140°F (0°C ~ 60°C) Storage Temperature -40°F ~ 185°F (-40°C ~ 85°C) Operation Humidity 0% ~ 90% relative humidity, non-condensing MTBF (Hours) — Display LVDS or EDP, DP or HDMI LCD Interface Up to 24-bit dual channel LVDS I/O — Storage SATA x 2, SDIO x 1 Serial Port RS-232 x 1, RS-232/422/485 x 1 Parallel Port — USB USB 2.0 x 8, USB3.0 x 2, USB OTG PS/2 Port — I2C 1 Audio Audio Jack, supports Line-in, Line-out, Microphone, Headphone (ARM base only) Debug LED — Packing List •Product CD •ECB-970 09-4