AKM AK8772

Monolithic Hall Effect ICs AK-series
AK8772
Shipped in packet-tape reel(5000pcs/Reel)
AK8772 is ultra-small Hall effect IC of a single silicon chip composed of Hall element and a signal processing IC.
Bipolar Hall
Supply Voltage
Power down
Effect Latch
1.6∼5.5V
Function
Output
Ultra High
Sensitivity
Bop:1.8mT
SON
CMOS
Notice:It is requested to read and accept "IMPORTANT NOTICE" written on the back of the front cover of this catalogue.
●Features
・Precision Bipolar Hall Effect Latch
・Power manageability through "PDN" pin
Current consumption in Power down mode is less than 1μA
・Low current consumption at active mode : less than avg.
[email protected]=3V
・Ultra small SON package : 1.1×1.4×t0.37mm, Halogen free
●Operational Characteristics
Vout
H
VoH
S or N
Package top
Bh
Package bottom
L
VOL
S
N or S
Brp
0
Bop
N
Magnetic flux density
●Functional Block Diagram
1:VDD
Item
3:PDN
Switch
OSC
19
Generates operating clock
Timing logic Generates timing signal requires for Chopper SW, AMP
and COMP
Dynamic
Offset Cancellation
OSC Hall Chopper
&
Element SW
Timing Logic
Function
4:OUT
Hall Element Hall element fabricated by CMOS process
Chopper SW Performs chopping in order to cancel the offset voltage
of Hall sensor
AMP
Schmitt
Trigger
&
Latch
Latch
Logic
Output
Stage
2:VSS
AMP
Reduce offset voltage and amplifies Hall output voltage
Schmitt Trigger Hysteresis comparator
Output Stage CMOS output, During the power down mode, output
is latched in its previous state
AK8772
•Please be aware that our products are not intended for use in life support equipment, devices, or systems. Use of our products in such applications requires the
advance written approval of our sales staff.
Certain applications using semiconductor devices may involve potential risks of personal injury, property damage, or loss of life. In order to minimize these risks,
adequate design and operating safeguards should be provided by the customer to minimize inherent or procedural hazards. Inclusion of our products in such
applications is understood to be fully at the risk of the customer using our devices or systems.
c
●Absolute Maximum Ratings
symbol
Min.
Max.
Power supply voltage
VDD
ー0.3
+6.5
V
Output current
IOUT
ー0.5
+0.5
mA
OUT pin
Item
Unit
+0.3*
Note
Input voltage
VIN
ー0.3
V
PDN pin
Input
IIN
ー10
+10
mA
PDN pin
TSTG
ー55
+125
℃
current
Storage temperature
VDD
*) Less than +6.5V.
Note) Stress beyond these listed values may cause permanent damage to the device.
●Recommended Operating Conditions
Item
symbol
Min.
Typ.
Max.
Unit
Power supply voltage
VDD
1.6
3.0
5.5
V
Operating temperature
Ta
ー30
+85
℃
g
●Electrical Characteristics(Ta=25℃ VDD=3.0V)
Item
symbol
Min.
Note
Typ.
Max.
Unit
1
μA
PDN=0V
60
150
μA
PDN=VDD,Average
1
μA
Current consumption 1
IDD1
Current consumption 2
IDD2
PDN Input current
IIN
ー1
PDN input H voltage
VIH
0.7VDD
PDN input L voltage
VIL
High Level output voltage
VOH
V
Iout=ー0.5mA
Low level output voltage
VOL
0.4
V
Iout=+0.5mA
PDN mode transition time 1
TPD1
(36.6)
μs
*Active→PDN
PDN mode transition time 2
TPD2
100
μs
PDN→Active
Pulse drive period
TPD3
0.5
1.0
1.5
ms
When PDN=VDD
Pulse drive time
TPD4
12.2
24.4
36.6
μs
PDN ‘H’ input pulse width
TW
100
V
0.3
VDDー0.4
V
k
μs
*)This transition time is not guaranteed by inspection because PDN input timing and internal timing are asynchronous
●Magnetic Characteristics①(Ta=25℃ VDD=3.0V)
Item
symbol
Operating point
Bop
Releasing point
Brp
Hysteresis
Bh
Min.
ー4.0
Typ.
Max.
Unit
1.8
4.0
mT
ー1.8
mT
3.6
mT
n
●Magnetic Characteristics②(Ta=−30℃∼85℃ VDD=1.6∼5.5V)
Item
symbol
Operating point
Bop
Releasing point
Brp
Hysteresis
Bh
Min.
Typ.
Max.
Unit
1.8
4.2
mT
ー4.2
ー1.8
mT
3.6
mT
o
p
Note) The specifications in Magnetic Characteristics ② are design targets.
20
AK8772
●Package(Unit:mm)
●Footprint(for reference)
0.80
Pin name
Function
VDD Power supply pin
VSS Ground pin
PDN Power down pin.
H:Device active
L:Device power down
OUT Output pin
No.
1
2
3
4
0.22
!
0.22±0.05
1.70
0.50±0.05
※Note 1) Sensitive area position referenced to
the center of package within φ0.3mm circle.
Note 2) Tolerances of dimension otherwise noted is
±0.05mm.
Note 3) Hatched area is plated.
Note 4) Center pad area (TAB) should be tied to the
VSS or floating
(0.23)
(0.125)
0.37
Sensor Center
0.60
1.40
!
1.00
0.35±0.10
"
0.80
1.40
"
0.50
0.60
0.20
1.10
Note
CMOS Input. This pin has to be
tied to“H”level when external
power control is not used.
CMOS Output
●Function Timing Chart
B[mT]
N
Bop
0
Brp
S
VPDN[V]
B[mT]
Bop
0
t
N
S
S
t
0
t
TPD2(<100μs)
VOUT[V]
VOUT[V]
TPD1(<36.6μs) t
TPD2(<100μs)
TPD2(<100μs)
0
Undefined
TPD4(typ.24.4μs)
t
TPD1(<36.6μs)
TPD3(typ.1ms)
t
IDD ON(typ.2.5mA)
IDD[mA]
TPD1(<36.6μs)
IDD OFF
IDD2[μA]
0
0
t
Functional Timing
Note1) During power down mode, output is latched in its
previous state.
Note2) When VDD is supplied, the time from reaching VDD=
1.6V to the update of the output state is equal to TPD2.
21
Brp
VPDN[V]
0
0
N
IDD1(<1μA)
t
Functional timing chart (detail)
When PDN pin set to ‘L’ from ‘H’ during sampling is performing,
the device transits to power down mode after sampling is completed.
And when PDN pin set to ‘L’ from ‘H’ while sampling is not
performing, the device transits to power down mode immediately.
AK8772
●Typical Characteristic Data (for reference)
4
4
Bop
Brp
3
Bop, Brp[mT]
Bop, Brp[mT]
1
0
-1
1
0
-1
-2
-2
-3
-3
0
10
20
30
40
50
60
70
80
-4
-30 -20 -10
90
0
Bop
Brp
3
40
50
60
70
80
90
Bop
Brp
2
Bop, Brp[mT]
Bop, Brp[mT]
30
3
2
1
0
-1
0
-1
-2
-2
-3
-3
0
10
20
30
40
50
60
70
80
g
1
-4
-30 -20 -10
90
0
120
IDD2[μA]
60
20
20
30
40
50
60
50
60
70
80
90
70
80
Ambient Temperature Ta[℃]
IDD2 vs. Ta(in various VDD)
90
k
25℃
85℃
60
40
20
40
0℃
80
40
10
30
-30℃
100
80
0
20
120
VDD=5.5V
VDD=3.0V
VDD=2.0V
VDD=1.6V
100
10
Ambient Temperature Ta[℃]
Bop, Brp vs. Ta(VDD=5.5V)
Ambient Temperature Ta[℃]
Bop, Brp vs. Ta(VDD=2.0V)
IDD2[μA]
20
4
4
0
-30 -20 -10
10
Ambient Temperature Ta[℃]
Bop, Brp vs. Ta(VDD=3.0V)
Ambient Temperature Ta[℃]
Bop, Brp vs. Ta(VDD=1.6V)
-4
-30 -20 -10
c
2
2
-4
-30 -20 -10
Bop
Brp
3
0
1
2
3
4
5
6
VDD[V]
IDD2 vs.VDD Ta(in various Ta)
n
●Application Circuit
o
VDD=3.0V
CMOS Output
VDD
100nF
p
OUT
AK8772
VSS
PDN
GND
CMOS Input
22
IMPORTANT NOTICE
 These products and their specifications are subject to change without notice.
When you consider any use or application of these products, please make
inquiries the sales office of Asahi Kasei Microdevices Corporation (AKM) or
authorized distributors as to current status of the products.
 Descriptions of external circuits, application circuits, software and other related
information contained in this document are provided only to illustrate the
operation and application examples of the semiconductor products. You are
fully responsible for the incorporation of these external circuits, application
circuits, software and other related information in the design of your
equipments. AKM assumes no responsibility for any losses incurred by you or
third parties arising from the use of these information herein. AKM assumes no
liability for infringement of any patent, intellectual property, or other rights in
the application or use of such information contained herein.
 Any export of these products, or devices or systems containing them, may
require an export license or other official approval under the law and
regulations of the country of export pertaining to customs and tariffs, currency
exchange, or strategic materials.
 AKM products are neither intended nor authorized for use as critical
componentsNote1) in any safety, life support, or other hazard related device or
systemNote2), and AKM assumes no responsibility for such use, except for the
use approved with the express written consent by Representative Director of
AKM. As used here:
Note1) A critical component is one whose failure to function or perform
may reasonably be expected to result, whether directly or indirectly, in the
loss of the safety or effectiveness of the device or system containing it,
and which must therefore meet very high standards of performance and
reliability.
Note2) A hazard related device or system is one designed or intended for
life support or maintenance of safety or for applications in medicine,
aerospace, nuclear energy, or other fields, in which its failure to function
or perform may reasonably be expected to result in loss of life or in
significant injury or damage to person or property.
 It is the responsibility of the buyer or distributor of AKM products, who
distributes, disposes of, or otherwise places the product with a third party, to
notify such third party in advance of the above content and conditions, and
the buyer or distributor agrees to assume any and all responsibility and
liability for and hold AKM harmless from any and all claims arising from the
use of said product in the absence of such notification.
April 4, 2012