AOSMD AO3416

AO3416
20V N-Channel MOSFET
General Description
Product Summary
The AO3416 uses advanced trench technology to provide
excellent RDS(ON), low gate charge and operation with gate
voltages as low as 1.8V. This device is suitable for use as
a load switch or in PWM applications. It is ESD
protected.
VDS
20V
6.5A
ID (at VGS=4.5V)
RDS(ON) (at VGS=4.5V)
< 22mΩ
RDS(ON) (at VGS = 2.5V)
< 26mΩ
RDS(ON) (at VGS = 1.8V)
< 34mΩ
ESD protected
SOT23
Top View
D
Bottom View
D
D
G
G
S
S
S
G
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
Drain-Source Voltage
VDS
Gate-Source Voltage
VGS
TA=25°C
Continuous Drain
Current
Pulsed Drain Current
C
Power Dissipation B
Junction and Storage Temperature Range
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient A
Maximum Junction-to-Ambient A D
Maximum Junction-to-Lead
Rev 5: July 2010
Steady-State
Steady-State
A
30
W
0.9
TJ, TSTG
Symbol
t ≤ 10s
V
1.4
PD
TA=70°C
±8
5.2
IDM
TA=25°C
Units
V
6.5
ID
TA=70°C
Maximum
20
RθJA
RθJL
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-55 to 150
Typ
70
100
63
°C
Max
90
125
80
Units
°C/W
°C/W
°C/W
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AO3416
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
STATIC PARAMETERS
Drain-Source Breakdown Voltage
BVDSS
IDSS
Zero Gate Voltage Drain Current
Conditions
Min
ID=250µA, VGS=0V
TJ=55°C
Gate-Body leakage current
VDS=0V, VGS= ±8V
VDS=VGS ID=250µA
0.4
ID(ON)
On state drain current
VGS=4.5V, VDS=5V
30
±10
1.1
16
22
22
30
VGS=2.5V, ID=5.5A
18
26
mΩ
VGS=1.8V, ID=5A
21
34
mΩ
50
1
V
2
A
1650
pF
TJ=125°C
gFS
Forward Transconductance
VDS=5V, ID=6.5A
VSD
Diode Forward Voltage
IS=1A,VGS=0V
IS
Maximum Body-Diode Continuous Current
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
Gate Source Charge
Qgd
Gate Drain Charge
A
0.62
1295
VGS=0V, VDS=10V, f=1MHz
mΩ
S
160
pF
87
pF
VGS=0V, VDS=0V, f=1MHz
1.8
KΩ
10
nC
VGS=4.5V, VDS=10V, ID=6.5A
4.2
nC
2.6
nC
SWITCHING PARAMETERS
Qg
Total Gate Charge
Qgs
µA
V
0.7
VGS=4.5V, ID=6.5A
Coss
µA
5
Gate Threshold Voltage
Units
V
1
VGS(th)
Static Drain-Source On-Resistance
Max
20
VDS=20V, VGS=0V
IGSS
RDS(ON)
Typ
tD(on)
Turn-On DelayTime
tr
Turn-On Rise Time
tD(off)
Turn-Off DelayTime
tf
Turn-Off Fall Time
trr
Body Diode Reverse Recovery Time
IF=6.5A, dI/dt=100A/µs
31
Qrr
Body Diode Reverse Recovery Charge IF=6.5A, dI/dt=100A/µs
6.8
VGS=4.5V, VDS=10V, RL=1.54Ω,
RGEN=3Ω
280
ns
328
ns
3.76
us
2.24
us
41
ns
nC
A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The
value in any given application depends on the user's specific board design.
B. The power dissipation PD is based on TJ(MAX)=150°C, using ≤ 10s junction-to-ambient thermal resistance.
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep
initialTJ=25°C.
D. The RθJA is the sum of the thermal impedence from junction to lead RθJL and lead to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-ambient thermal impedence which is measured with the device mounted on 1in2 FR-4 board with
2oz. Copper, assuming a maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse rating.
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Rev 5: July 2010
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Page 2 of 5
AO3416
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
30
25
VDS=5V
2.5V
25
1.8V
20
3.1V
20
4.5V
ID(A)
ID (A)
15
15
10
VGS=1.5V
10
25°C
5
5
0
0
0
1
2
3
4
0
5
0.5
1
1.5
2
2.5
VGS(Volts)
Figure 2: Transfer Characteristics (Note E)
VDS (Volts)
Fig 1: On-Region Characteristics (Note E)
30
VGS=1.8V
20
VGS=2.5V
15
VGS=4.5V
Normalized On-Resistance
1.6
25
RDS(ON) (mΩ
Ω)
125°C
VGS=2.5V
ID=5.5A
1.4
VGS=1.8V
ID=5A
1.2
17
5
2
VGS=4.5V10
1
ID=6.5A
0.8
10
0
2
0
4
6
8
10
ID (A)
Figure 3: On-Resistance vs. Drain Current and Gate
Voltage (Note E)
25
50
75
100
125
150
175
0
Temperature (°C)
Figure 4: On-Resistance vs. Junction
18Temperature
(Note E)
60
1.0E+01
ID=6.5A
1.0E+00
50
40
40
IS (A)
RDS(ON) (mΩ
Ω)
1.0E-01
125°C
1.0E-02
125°C
30
25°C
1.0E-03
20
1.0E-04
25°C
1.0E-05
10
0
4
6
8
VGS (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
(Note E)
Rev 5: July 2010
2
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0.0
0.2
0.4
0.6
0.8
1.0
VSD (Volts)
Figure 6: Body-Diode Characteristics (Note E)
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AO3416
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
5
1800
VDS=10V
ID=6.5A
1600
1400
Capacitance (pF)
VGS (Volts)
4
3
2
Ciss
1200
1000
800
600
400
1
Coss
200
0
Crss
0
0
2
4
6
8
10
Qg (nC)
Figure 7: Gate-Charge Characteristics
12
0
5
10
15
VDS (Volts)
Figure 8: Capacitance Characteristics
10000
100.0
TJ(Max)=150°C
TA=25°C
10µs
1000
RDS(ON)
limited
100µs
Power (W)
10.0
ID (Amps)
20
1ms
1.0
10ms
100
100ms
0.1
TJ(Max)=150°C
TA=25°C
10
10s
DC
1
0.0
0.00001
0.01
0.1
1
VDS (Volts)
10
0.001
0.1
10
1000
100
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-toAmbient (Note F)
Figure 9: Maximum Forward Biased Safe
Operating Area (Note F)
Zθ JA Normalized Transient
Thermal Resistance
10
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
D=Ton/T
TJ,PK=TA+PDM.ZθJA.RθJA
1
RθJA=125°C/W
0.1
PD
0.01
Single Pulse
Ton
T
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)
Rev 5: July 2010
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Page 4 of 5
AO3416
Gate Charge Test Circuit & Waveform
Vgs
Qg
10V
+
+ Vds
VDC
-
Qgs
Qgd
VDC
DUT
-
Vgs
Ig
Charge
R es istiv e S w itch ing T e st C ircu it & W a ve fo rm s
RL
V ds
Vds
DUT
Vgs
90 %
+
Vdd
VDC
-
Rg
1 0%
Vgs
V gs
t d (o n )
tr
t d (o ff)
to n
tf
t o ff
D iode R ecovery T est C ircuit & W aveform s
Q rr = -
V ds +
Idt
DUT
V gs
V ds -
Isd
V gs
Ig
Rev 5: July 2010
L
Isd
+
VD C
-
IF
t rr
dI/dt
I RM
V dd
V dd
V ds
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Page 5 of 5