NSC DS90C402

DS90C402
Dual Low Voltage Differential Signaling (LVDS) Receiver
General Description
Features
The DS90C402 is a dual receiver device optimized for high
data rate and low power applications. This device along with
the DS90C401 provides a pair chip solution for a dual high
speed point-to-point interface. The device is in a PCB space
saving 8 lead small outline package. The receiver offers
± 100 mV threshold sensitivity, in addition to common-mode
noise protection.
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Ultra Low Power Dissipation
Operates above 155.5 Mbps
Standard TIA/EIA-644
8 Lead SOIC Package saves PCB space
VCM ± 1V center around 1.2V
± 100 mV Receiver Sensitivity
Connection Diagram
DS100006-1
Order Number DS90C402M
See NS Package Number M08A
Functional Diagram
DS100006-2
TRI-STATE ® is a registered trademark of National Semiconductor Corporation.
© 1998 National Semiconductor Corporation
DS100006
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DS90C402 Dual Low Voltage Differential Signaling (LVDS) Receiver
June 1998
Absolute Maximum Ratings (Note 1)
Maximum Junction Temperature
ESD Rating (Note 4)
(HBM, 1.5 kΩ, 100 pF)
(EIAJ, 0 Ω, 200 pF)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (VCC)
−0.3V to +6V
−0.3V to (VCC + 0.3V)
Input Voltage (RIN+, RIN−)
−0.3V to (VCC + 0.3V)
Output Voltage (ROUT)
Maximum Package Power Dissipation @ +25˚C
M Package
1025 mW
Derate M Package
8.2 mW/˚C above +25˚C
Storage Temperature Range
−65˚C to +150˚C
Lead Temperature Range
Soldering (4 sec.)
+260˚C
+150˚C
≥ 3,500V
≥ 250V
Recommended Operating
Conditions
Supply Voltage (VCC)
Receiver Input Voltage
Operating Free Air
Temperature (TA)
Min
+4.5
GND
Typ
+5.0
Max
+5.5
2.4
Units
V
V
−40
+25
+85
˚C
Min
Typ
Max
Units
+100
mV
Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified. (Note 2)
Symbol
Parameter
Conditions
VTH
Differential Input High Threshold
VTL
Differential Input Low Threshold
IIN
Input Current
Pin
VCM = + 1.2V
RIN+,
RIN−
Output High Voltage
mV
−10
±1
±1
3.8
4.9
V
IOH = −0.4mA, Inputs terminated
3.8
4.9
V
IOH = −0.4mA, Inputs Open
3.8
4.9
V
VIN = +2.4V
VCC = 5.5V
−10
VIN = 0V
VOH
−100
IOH = −0.4 mA, VID = +200 mV
ROUT
+10
µA
+10
µA
IOH = −0.4mA, Inputs Shorted
4.9
0.07
0.3
V
−60
−100
mA
3.5
10
mA
VOL
Output Low Voltage
IOL = 2 mA, VID = −200 mV
IOS
Output Short Circuit Current
VOUT = 0V (Note 8)
ICC
No Load Supply Current
Inputs Open
−15
VCC
V
Switching Characteristics
VCC = +5.0V ± 10%, TA = −40˚C to +85˚C (Notes 3, 4, 5, 6, 9)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
CL = 5 pF,
VID = 200 mV
(Figure 1 and Figure 2)
1.0
3.40
6.0
ns
1.0
3.48
6.0
ns
0
0.08
1.2
ns
0
0.6
1.5
ns
5.0
ns
Rise Time
0.5
2.5
ns
Fall Time
0.5
2.5
ns
tPHLD
Differential Propagation Delay High to Low
tPLHD
Differential Propagation Delay Low to High
tSKD
Differential Skew |tPHLD − tPLHD|
tSK1
Channel-to-Channel Skew (Note 5)
tSK2
Chip to Chip Skew (Note 6)
tTLH
tTHL
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Parameter Measurement Information
DS100006-4
FIGURE 1. Receiver Propagation Delay and Transition Time Test Circuit
DS100006-5
FIGURE 2. Receiver Propagation Delay and Transition Time Waveforms
Typical Application
DS100006-8
FIGURE 3. Point-to-Point Application
ceiver input pins should honor their specified operating input
voltage range of 0V to +2.4V (measured from each pin to
ground), exceeding these limits may turn on the ESD protection circuitry which will clamp the bus voltages.
Fail-Safe Feature:
The LVDS receiver is a high gain, high speed device that
amplifies a small differential signal (20mV) to CMOS logic
levels. Due to the high gain and tight threshold of the receiver, care should be taken to prevent noise from appearing
as a valid signal.
Applications Information
LVDS drivers and receivers are intended to be primarily used
in an uncomplicated point-to-point configuration as is shown
in Figure 3. This configuration provides a clean signaling environment for the quick edge rates of the drivers. The receiver is connected to the driver through a balanced media
which may be a standard twisted pair cable, a parallel pair
cable, or simply PCB traces. Typically the characteristic impedance of the media is in the range of 100Ω. A termination
resistor of 100Ω should be selected to match the media, and
is located as close to the receiver input pins as possible. The
termination resistor converts the current sourced by the
driver into a voltage that is detected by the receiver. Other
configurations are possible such as a multi-receiver configuration, but the effects of a mid-stream connector(s), cable
stub(s), and other impedance discontinuities as well as
ground shifting, noise margin limits, and total termination
loading must be taken into account.
The DS90C402 differential line receiver is capable of detecting signals as low as 100 mV, over a ± 1V common-mode
range centered around +1.2V. This is related to the driver offset voltage which is typically +1.2V. The driven signal is centered around this voltage and may shift ± 1V around this center point. The ± 1V shifting may be the result of a ground
potential difference between the driver’s ground reference
and the receiver’s ground reference, the common-mode effects of coupled noise, or a combination of the two. Both re-
The receiver’s internal fail-safe circuitry is designed to
source/sink a small amount of current, providing fail-safe
protection (a stable known state HIGH output voltage) for
floating, terminated or shorted receiver inputs.
1.
3
Open Input Pins. The DS90C402 is a dual receiver device, and if an application requires only one receiver, the
unused channel(s) inputs should be left OPEN. Do not
tie unused receiver inputs to ground or any other voltages. The input is biased by internal high value pull up
and pull down resistors to set the output to a HIGH state.
This internal circuitry will guarantee a HIGH, stable output state for open inputs.
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Applications Information
Pin Descriptions
(Continued)
2. Terminated Input. If the driver is disconnected (cable
unplugged), or if the driver is in a power-off condition,
the receiver output will again be in a HIGH state, even
with the end of cable 100Ω termination resistor across
the input pins. The unplugged cable can become a floating antenna which can pick up noise. If the cable picks
up more than 10mV of differential noise, the receiver
may see the noise as a valid signal and switch. To insure
that any noise is seen as common-mode and not differential, a balanced interconnect should be used. Twisted
pair cable will offer better balance than flat ribbon cable
3. Shorted Inputs. If a fault condition occurs that shorts
the receiver inputs together, thus resulting in a 0V differential input voltage, the receiver output will remain in a
HIGH state. Shorted input fail-safe is not supported
across the common-mode range of the device (GND to
2.4V). It is only supported with inputs shorted and no external common-mode voltage applied.
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Pin
No.
Name
Description
2, 6
ROUT
Receiver output pin
3, 7
RIN+
Positive receiver input pin
4, 8
RIN-
Negative receiver input pin
5
GND
Ground pin
1
VCC
Positive power supply pin,
+5V ± 10%
Ordering Information
Operating
Temperature
Package Type/
Number
Order Number
−40˚C to +85˚C
SOP/M08A
DS90C402M
RECEIVE MODE
RIN+ − RIN−
ROUT
> +100 mV
< −100 mV
100 mV > & > −100 mV
H
L
X
H = Logic High Level
L = Logic Low level
X = Indeterminant State
Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devices
should be operated at these limits. The table of “Electrical Characteristics” specifies conditions of device operation.
Note 2: Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground unless otherwise specified.
Note 3: All typicals are given for: VCC = +5.0V, TA = +25˚C.
Note 4: Generator waveform for all tests unless otherwise specified: f = 1 MHz, ZO = 50Ω, tr and tf (0%–100%) ≤ 1 ns for RIN.
Note 5: Channel-to-Channel Skew is defined as the difference between the propagation delay of one channel and that of the others on the same chip with an event
on the inputs.
Note 6: Chip to Chip Skew is defined as the difference between the minimum and maximum specified differential propagation delays.
Note 7: ESD Rating:
HBM (1.5 kΩ, 100 pF) ≥ 3,500V
EIAJ (0Ω, 200 pF) ≥ 250V
Note 8: Output short circuit current (IOS) is specified as magnitude only, minus sign indicates direction only. Only one output should be shorted at a time, do not exceed maximum junction temperature specification.
Note 9: CL includes probe and jig capacitance.
Typical Performance Characteristics
Output High Voltage vs
Power Supply Voltage
Output High Voltage vs
Ambient Temperature
DS100006-9
DS100006-10
5
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Typical Performance Characteristics
(Continued)
Output Low Voltage vs
Power Supply Voltage
Output Low Voltage vs
Ambient Temperature
DS100006-11
Output Short Circuit Current
vs Power Supply Voltage
DS100006-12
Output Short Circuit Current
vs Ambient Temperature
DS100006-13
Differential Propagation Delay
vs Power Supply Voltage
DS100006-14
Differential Propagation Delay
vs Ambient Temperature
DS100006-15
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DS100006-16
6
Typical Performance Characteristics
(Continued)
Differential Skew vs
Power Supply Voltage
Differential Skew vs
Ambient Temperature
DS100006-17
Transition Time vs
Power Supply Voltage
DS100006-18
Transition Time vs
Ambient Temperature
DS100006-19
DS100006-20
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DS90C402 Dual Low Voltage Differential Signaling (LVDS) Receiver
Physical Dimensions
inches (millimeters) unless otherwise noted
8-Lead (0.150" Wide) Molded Small Outline Package, JEDEC
Order Number DS90C402M
NS Package Number M08A
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sonably expected to cause the failure of the life support
the body, or (b) support or sustain life, and whose faildevice or system, or to affect its safety or effectiveness.
ure to perform when properly used in accordance
with instructions for use provided in the labeling, can
be reasonably expected to result in a significant injury
to the user.
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