AOSMD AOTF7T60

AOS Semiconductor
Product Reliability Report
AOTF7T60,
rev A
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
www.aosmd.com
1
This AOS product reliability report summarizes the qualification result for AOTF7T60. Accelerated
environmental tests are performed on a specific sample size, and then followed by electrical test
at end point. Review of final electrical test result confirms that AOTF7T60 passes AOS quality
and reliability requirements.
Table of Contents:
I.
II.
III.
IV.
V.
Product Description
Package and Die information
Environmental Stress Test Summary and Result
Reliability Evaluation
Appendix: Test data
I. Product Description:
The AOTF7T60 is fabricated using an advanced high voltage MOSFET process that is designed
to deliver high levels of performance and robustness in popular AC-DC applications. By providing
low RDS(on), Ciss and Crss along with guaranteed avalanche capability this parts can be
adopted quickly into new and existing offline power supply designs.
For Halogen Free add "L" suffix to part number:
AOTF7T60L
Details refer to the datasheet.
II. Die / Package Information:
AOTF7T60
Standard sub-micron
600V N-Channel MOSFET
Package Type
TO220F
Lead Frame
Bare Cu
Die Attach
Soft solder
Bonding
Al wire
Mold Material
Epoxy resin with silica filler
Moisture Level
Up to Level 1 *
Note * based on info provided by assembler and mold compound supplier
Process
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III. Result of Reliability Stress for AOTF7T60
Test Item
Test Condition
Time
Point
MSL
Precondition
168hr 85°c
/85%RH +3 cycle
[email protected]°c
Temp = 150°c ,
Vgs=100% of
Vgsmax
-
21 lots
4158pcs
0
JESD22A113
168hrs
500 hrs
1000 hrs
2 lots
3 lots
6 lots
847pcs
0
JESD22A108
Temp = 150°c ,
Vds=80% of
Vdsmax
168hrs
500 hrs
1000 hrs
2 lots
3 lots
6 lots
847pcs
0
JESD22A108
HAST
130°c , 85%RH,
33.3 psi, Vgs =
100% of Vgs max
96 hrs
15 lots
1155pcs
0
JESD22A110
Pressure Pot
121°c , 29.7psi,
RH=100%
96 hrs
(Note A*)
18 lots
77 pcs / lot
1386pcs
0
JESD22A102
(Note A*)
77 pcs / lot
0
JESD22A104
HTGB
HTRB
Temperature
Cycle
-65°c to 150°c ,
air to air,
250 / 500
cycles
Lot
Attribution
21 lots
(Note A*)
Total
Sample size
Number
of
Failures
Reference
Standard
77 pcs / lot
77 pcs / lot
1617pcs
77 pcs / lot
IV. Reliability Evaluation
FIT rate (per billion): 2.92
MTTF = 39075 years
The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in
sample size of the selected product (AOTF7T60). Failure Rate Determination is based on JEDEC
Standard JESD 85. FIT means one failure per billion hours.
2
9
Failure Rate (FIT) = Chi x 10 / [2 (N) (H) (Af)]
9
= 1.83 x 10 / [2x (4x77x168 +6x77x500 +12x77x1000) x259] = 2.92
9
8
MTTF = 10 / FIT = 3.42 x 10 hrs = 39075 years
Chi²= Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from HTRB and HTGB tests
H = Duration of HTRB/HTGB testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
55 deg C
70 deg C
85 deg C
100 deg C
115 deg C
Af
259
87
32
13
5.64
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u =The use junction temperature in degree (Kelvin), K = C+273.16
k = Boltzmann’s constant, 8.617164 x 10-5eV / K
130 deg C
150 deg C
2.59
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