AOSMD AOW2500

AOS Semiconductor
Product Reliability Report
AOW2500,
rev A
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
www.aosmd.com
1
This AOS product reliability report summarizes the qualification result for AOW2500. Accelerated
environmental tests are performed on a specific sample size, and then followed by electrical test
at end point. Review of final electrical test result confirms that AOW2500 passes AOS quality and
reliability requirements. The released product will be categorized by the process family and be
routine monitored for continuously improving the product quality.
Table of Contents:
I.
II.
III.
IV.
Product Description
Package and Die information
Reliability Stress Test Summary and Results
Reliability Evaluation
I. Product Description:
The AOW2500 uses Trench MOSFET technology that is 150V uniquely optimized to provide the
most efficient high frequency switching performance. Both conduction and switching power losses
are minimized due to an extremely low combination of RDS(ON), Ciss and Coss.
This device is ideal for boost converters and synchronous rectifiers for consumer, telecom,
industrial power supplies and LED backlighting.
Details refer to the datasheet.
II. Die / Package Information:
Process
Package Type
Lead Frame
Die Attach
Bonding
Mold Material
Moisture Level
AOW2500
Standard sub-micron
150V N-Channel MOSFET
TO262
Bare Cu
Soft solder
Al wire
Epoxy resin with silica filler
Up to Level 1
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III. Reliability Stress Test Summary and Results
Test Item
Test Condition
Time
Point
Total
Sample
size*
Number
of
Failures
Reference
Standard
MSL
Precondition
168hr 85°c/85%RH +
3 cycle [email protected]°c
(MSL 1)
-
2772 pcs
0
JESD22-A113
HTGB
Temp = 150°c ,
Vgs=100% of Vgsmax
168 / 500 /
1000 hrs
616 pcs
0
JESD22-A108
HTRB
Temp = 150°c ,
Vds=80% of Vdsmax
168 / 500 /
1000 hrs
616 pcs
0
JESD22-A108
HAST
130 °c , 85%RH,
33.3 psi, Vds = 80% of
Vdsmax before arcing
(typically ≤42V)
96 hrs
924 pcs
0
JESD22-A110
Pressure Pot
121°c , 29.7psi,
RH=100%
96 hrs
924 pcs
0
JESD22-A102
Temperature
Cycle
-65°c to 150°c ,
air to air,
250 / 500
cycles
924 pcs
0
JESD22-A104
*Note: The reliability data presents total of available generic data up to the published date.
IV. Reliability Evaluation
FIT rate (per billion): 3.27
MTTF = 34906 years
The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in
sample size. Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one
failure per billion hours.
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Failure Rate = Chi x 10 / [2 (N) (H) (Af)] = 3.27
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MTTF = 10 / FIT = 34906 years
Chi²= Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from burn-in tests
H = Duration of burn-in testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
Af
55 deg C
70 deg C
85 deg C
100 deg C
115 deg C
130 deg C
150 deg C
259
87
32
13
5.64
2.59
1
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u =The use junction temperature in degree (Kelvin), K = C+273.16
k = Boltzmann’s constant, 8.617164 X 10-5eV / K
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