AOSMD AOWF11C60

AOS Semiconductor
Product Reliability Report
AOWF11C60,
rev A
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
www.aosmd.com
1
This AOS product reliability report summarizes the qualification result for AOWF11C60.
Accelerated environmental tests are performed on a specific sample size, and then followed by
electrical test at end point. Review of final electrical test result confirms that AOWF11C60 passes
AOS quality and reliability requirements. The released product will be categorized by the process
family and be routine monitored for continuously improving the product quality.
Table of Contents:
I.
II.
III.
IV.
Product Description
Package and Die information
Reliability Stress Test Summary and Results
Reliability Evaluation
I. Product Description:
• Latest Trench Power AlphaMOS-II technology
• Low RDS(ON)
• Low Ciss and Crss
• High Current Capability
• RoHS and Halogen Free Compliant
• General Lighting for LED and CCFL
• AC/DC Power supplies for Industrial, Consumer, and Telecom
Details refer to the datasheet.
II. Die / Package Information:
Process
Package Type
Lead Frame
Die Attach
Bond
Mold Material
Moisture Level
AOWF11C60
Standard sub-micron
600V N-Channel MOSFET
TO262F
Bare Cu
Soft Solder
Al wire
Epoxy resin with silica filler
Up to Level 1
2
III. Reliability Stress Test Summary and Results
Test Item
Test Condition
Time
Point
Total
Sample
Size*
Number
of
Failures
Reference
Standard
MSL
Precondition
168hr 85°C / 85%RH +
3 cycle [email protected]°C
(MSL 1)
-
4389 pcs
0
JESD22-A113
HTGB
Temp = 150°C ,
Vgs=100% of Vgsmax
168 / 500 /
1000 hours
924 pcs
HTRB
Temp = 150°C ,
Vds=80% of Vdsmax
168 / 500 /
1000 hours
924 pcs
96 hours
924 pcs
0
JESD22-A110
1000 hours
693 pcs
0
JESD22-A101
130°C , 85%RH,
33.3 psi,
Vds = 80% of Vdsmax
up to 42V
85°C , 85%RH,
Vds = 80% of Vdsmax
up to 100V
HAST
H3TRB
0
JESD22-A108
0
JESD22-A108
Autoclave
121°C , 29.7psi,
RH=100%
96 hours
924 pcs
0
JESD22-A102
Temperature
Cycle
-65°C to 150°C ,
air to air,
250 / 500
cycles
924 pcs
0
JESD22-A104
Power
8572
924 pcs
0
AEC Q101
Tj = 100°C
cycles
Cycling
*Note: The reliability data presents total of available generic data up to the published date.
IV. Reliability Evaluation
FIT rate (per billion): 3.05
MTTF = 37419 years
The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in
sample size. Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one
failure per billion hours.
2
9
Failure Rate = Chi x 10 / [2 (N) (H) (Af)] = 3.05
9
MTTF = 10 / FIT = 37419 years
Chi²= Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from burn-in tests
H = Duration of burn-in testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
55 deg C
70 deg C
85 deg C
100 deg C
115 deg C
Af
259
87
32
13
5.64
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u =The use junction temperature in degree (Kelvin), K = C+273.16
k = Boltzmann’s constant, 8.617164 X 10-5eV / K
130 deg C
150 deg C
2.59
1
3