A-POWER AP04N60H-H-HF

AP04N60H-H-HF
Halogen-Free Product
Advanced Power
Electronics Corp.
N-CHANNEL ENHANCEMENT MODE
POWER MOSFET
▼ 100% Avalanche Test
D
▼ Fast Switching Characteristic
▼ Simple Drive Requirement
BVDSS
700V
RDS(ON)
2.8Ω
ID
4A
G
▼ RoHS Compliant & Halogen-Free
S
Description
AP04N60 series are specially designed as main switching devices for
universal 90~265VAC off-line AC/DC converter applications. It provide
high blocking voltage to overcome voltage surge and sag in the
toughest power system with the best combination of fast switching
design and cost-effectiveness.
The TO-252 package is widely preferred for all commercial-industrial
surface mount applications using infrared reflow technique and suited
for high current application due to the low connection resistance.
G
D
S
TO-252(H)
Absolute Maximum Ratings
Symbol
Parameter
Rating
Units
VDS
Drain-Source Voltage
700
V
VGS
Gate-Source Voltage
+30
V
[email protected]=25℃
Continuous Drain Current, V GS @ 10V
4
A
[email protected]=100℃
Continuous Drain Current, V GS @ 10V
2.2
A
15
A
59.5
W
2
W
8
mJ
1
IDM
Pulsed Drain Current
[email protected]=25℃
Total Power Dissipation
[email protected]=25℃
Total Power Dissipation
4
3
EAS
Single Pulse Avalanche Energy
TSTG
Storage Temperature Range
-55 to 150
℃
TJ
Operating Junction Temperature Range
-55 to 150
℃
Thermal Data
Symbol
Rthj-c
Rthj-a
Parameter
Maximum Thermal Resistance, Junction-case
Maximum Thermal Resistance, Junction-ambient (PCB mount)
Data & specifications subject to change without notice
4
Value
Units
2.1
℃/W
62.5
℃/W
1
201301211
AP04N60H-H-HF
o
Electrical [email protected]=25 C(unless otherwise specified)
Symbol
BVDSS
Parameter
Test Conditions
Drain-Source Breakdown Voltage
Min.
Typ.
700
-
-
V
VGS=10V, ID=2A
-
-
2.8
Ω
VGS=0V, ID=250uA
2
Max. Units
RDS(ON)
Static Drain-Source On-Resistance
VGS(th)
Gate Threshold Voltage
VDS=VGS, ID=250uA
2
-
4
V
gfs
Forward Transconductance
VDS=10V, ID=2A
-
3.4
-
S
IDSS
Drain-Source Leakage Current
VDS=480V, VGS=0V
-
-
100
uA
IGSS
Gate-Source Leakage
VGS=+30V, VDS=0V
-
-
+100
nA
Qg
Total Gate Charge
ID=1A
-
19
30
nC
Qgs
Gate-Source Charge
VDS=480V
-
3.5
-
nC
Qgd
Gate-Drain ("Miller") Charge
VGS=10V
-
8
-
nC
td(on)
Turn-on Delay Time
VDD=300V
-
20
-
ns
tr
Rise Time
ID=2A
-
20
-
ns
td(off)
Turn-off Delay Time
RG=50Ω
-
100
-
ns
tf
Fall Time
VGS=10V
-
25
-
ns
Ciss
Input Capacitance
VGS=0V
-
740
1200
pF
Coss
Output Capacitance
VDS=25V
-
70
-
pF
Crss
Reverse Transfer Capacitance
f=1.0MHz
-
10
-
pF
Min.
Typ.
IS=2A, VGS=0V
-
-
1.5
V
Source-Drain Diode
Symbol
Parameter
2
Test Conditions
Max. Units
VSD
Forward On Voltage
trr
Reverse Recovery Time
IS=2A, VGS=0V
-
310
-
ns
Qrr
Reverse Recovery Charge
dI/dt=100A/µs
-
2.9
-
µC
Notes:
1.Pulse width limited by max. junction temperature.
2.Pulse test
o
3.Starting Tj=25 C , VDD=50V , L=1mH , RG=25Ω
4.Surface mounted on 1 in 2 copper pad of FR4 board
THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION.
USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED.
APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED
HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN.
2
AP04N60H-H-HF
8
5
o
o
T C =150 C
10V
8.0V
7.0V
6.0V
6
10V
8.0V
7.0V
6.0V
V G =5.0V
4
ID , Drain Current (A)
ID , Drain Current (A)
T C =25 C
4
3
2
V G =5.0V
2
1
0
0
0
4
8
12
16
20
24
28
0
V DS , Drain-to-Source Voltage (V)
4
8
12
16
20
24
28
V DS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
1.2
3
I D =2A
V G =10V
Normalized RDS(ON)
Normalized BVDSS
1.1
1
2
1
0.9
0.8
0
-50
0
50
100
150
-50
o
0
50
100
150
o
T j , Junction Temperature ( C)
T j , Junction Temperature ( C )
Fig 3. Normalized BVDSS v.s. Junction
Fig 4. Normalized On-Resistance
Temperature
v.s. Junction Temperature
8
1.6
1.4
Normalized VGS(th)
IS (A)
6
T j = 25 o C
o
T j = 150 C
4
1.2
1
0.8
2
0.6
0
0.4
0.1
0.3
0.5
0.7
0.9
1.1
1.3
V SD , Source-to-Drain Voltage (V)
Fig 5. Forward Characteristic of
Reverse Diode
1.5
-50
0
50
100
150
T j , Junction Temperature ( o C)
Fig 6. Gate Threshold Voltage v.s.
Junction Temperature
3
AP04N60H-H-HF
12
f=1.0MHz
1200
1000
V DS =480V
8
800
C (pF)
VGS , Gate to Source Voltage (V)
I D =1A
10
6
C iss
600
4
400
2
200
0
0
0
4
8
12
16
20
24
C oss
C rss
1
5
Q G , Total Gate Charge (nC)
Fig 7. Gate Charge Characteristics
13
17
21
25
29
Fig 8. Typical Capacitance Characteristics
1
10
Operation in this
area limited by
RDS(ON)
100us
1
1ms
10ms
100ms
DC
0.1
o
T C =25 C
Single Pulse
Normalized Thermal Response (Rthjc)
100
ID (A)
9
V DS , Drain-to-Source Voltage (V)
Duty factor=0.5
0.2
0.1
0.1
0.05
PDM
t
0.02
T
0.01
Duty factor = t/T
Peak Tj = PDM x Rthjc + T C
Single Pulse
0.01
0.01
1
10
100
1000
0.00001
0.0001
0.001
0.01
0.1
1
10
V DS , Drain-to-Source Voltage (V)
t , Pulse Width (s)
Fig 9. Maximum Safe Operating Area
Fig 10. Effective Transient Thermal Impedance
VG
VDS
90%
QG
10V
QGS
QGD
10%
VGS
td(on) tr
td(off) t
f
Fig 11. Switching Time Waveform
Charge
Q
Fig 12. Gate Charge Waveform
4