ASB ALE2350T2

plerowTM ALE2350T2
Internally Matched LNA Module
Features
Description
· S21 = 24.8 [email protected] MHz
= 24.2 [email protected] MHz
· NF of 0.75 dB over Frequency
· Unconditionally Stable
· Single 5V Supply
· High [email protected] Current
The plerowTM ALN-series is the compactly designed surface-mount
module for the use of the LNA with or without the following gain blocks in
the infrastructure equipment of the mobile wireless (CDMA, GSM, PCS,
PHS, WCDMA, DMB, WLAN, WiBro, WiMAX), GPS, satellite communication terminals, CATV and so on. It has an exceptional performance of
low noise figure, high gain, high OIP3, and low bias current. The stability
factor is always kept more than unity over the application band in order
to ensure its unconditionally stable implementation to the application
system environment. The surface-mount module package including the
completed matching circuit and other components necessary just in case
allows very simple and convenient implementation onto the system
board in mass production level.
Specifications (in Production)
Typ.@T = 25°C, Vs = 5 V, Freq. = 2350 MHz, Zo.sys = 50 ohms
Parameter
Unit
Frequency Range
Min
MHz
2300
Gain
dB
23.5
Gain Flatness
dB
Noise Figure
dB
Output IP3 (1)
dBm
S11/S22 (2)
Typ
dBm
Switching Time
(3)
Max
2400
24.5
39
±0.3
±0.4
0.75
0.80
More Information
Website: www.asb.co.kr
E-mail: [email protected]
42
dB
Output P1dB
2-stage Single Type
Specifications
Tel: (82) 42-528-7223
Fax: (82) 42-528-7222
-18/-15
23
24
msec
-
Supply Current
mA
200
Supply Voltage
V
5
Impedance
W
50
220
Max. RF Input Power
dBm
C.W 29~31 (before fail)
Package Type & Size
mm
Surface Mount Type, 10Wx10Lx3.8H
Operating temperature is -40°C to +85°C.
1) OIP3 is measured with two tones at an output power of 7 dBm/tone separated by 1 MHz.
2) S11/S22 (max) is the worst value within the frequency band.
3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to VS.
Outline Drawing (Unit: mm)
plerow
ALE2350T2
ASB Inc.
(Top View)
(Bottom View)
Pin Number
Function
2
RF In
5
RF Out
6
Vs
Others
Ground
Note: 1. The number and size of ground via holes in
a circuit board is critical for thermal RF
grounding considerations.
2. We recommend that the ground via holes be
placed on the bottom of all ground pins for
better RF and thermal performance, as
shown in the drawing at the left side.
Solder Stencil Area
(Side View)
Ø0.4 plated thru holes to ground plane
(Recommended Footprint)
1/3
www.asb.co.kr
July 2009
plerowTM ALE2350T2
Internally Matched LNA Module
S-parameters
Typical Performance
(Measured)
2300~2400 MHz
+5 V
Noise Figure
S-parameters & K Factor
OIP3
2/3
P1dB
www.asb.co.kr
July 2009
plerowTM ALE2350T2
Internally Matched LNA Module
Application Circuit
VS
+
-
Tantal or MLC (Multi Layer Ceramic)
Capacitor
C1
C2
ALE
IN
OUT
1)
The tantal or MLC (Multi Layer Ceramic) capacitor is optional and for bypassing the AC noise introduced
from the DC supply. The capacitance value may be determined by customer’s DC supply status. The capacitor should be placed as close as possible to Vs pin and be connected directly to the ground plane for
the best electrical performance.
2)
DC blocking capacitors are always necessarily placed at the input and output port for allowing only the
RF signal to pass and blocking the DC component in the signal. The DC blocking capacitors are included inside the ALE module. Therefore, C1 & C2 capacitors may not be necessary, but can be added just
in case that the customer wants. The value of C1 & C2 is determined by considering the application frequency.
Recommended Soldering Reflow Process
Evaluation Board Layout
Vs
20~40 sec
260°C
Ramp-up
(3˚C/sec)
200°C
Ramp-down
(6°C/sec)
OUT
IN
150°C
60~180 sec
3/3
Size 25x25mm
(for ALE-T Series – 10x10mm)
www.asb.co.kr
July 2009