ALM-11236 1710 MHz – 1850 MHz Low Noise, High Linearity Amplifier Module with Fail-Safe Bypass Feature Data Sheet Description Features Avago Technologies’ ALM-11236 is an easy-to-use GaAs MMIC Tower Mount Amplifier (TMA) LNA Module with low IL bypass path. The module has low noise and high linearity achieved through the use of Avago Technologies’ proprietary 0.25 mm GaAs Enhancement-mode pHEMT process. All matching components are fully integrated within the module and the 50 ohm RF input and output pins are already internally AC-coupled. This makes the ALM-11236 extremely easy to use as the only external parts are DC supply bypass capacitors. For optimum performance at other bands, ALM-11036 (776-870 MHz), ALM-11136 (870-915 MHz) and ALM-11336 (1850-1980) are recommended. All ALM-11x36 share the same package and pin out configuration. • Very Low Noise Figure Pin Configuration and Package Marking 25 24 23 22 21 20 AVAGO 11236 WWYY XXXX 2 3 4 5 6 7 8 27 28 29 30 31 32 33 34 35 36 9 10 11 12 13 14 15 16 17 18 19 • Fail-safe Bypass mode • High linearity performance • High isolation @LNA mode • Flat gain • GaAs E-pHEMT Technology • Single 5 V power supply • Compact MCOB package 7.0 x 10.0 x 1.5 mm3 • MSL2a 1785 MHz; 5 V, 99 mA (Typical) 36 35 34 33 32 31 30 29 28 27 26 • Good Return Loss Specifications 7.0 x 10.0 x 1.5 mm3 36-lead MCOB 1 • Low Bypass IL • 15.9 dB Gain • ≥ 18 dB RL • 0.67 dB Noise Figure • 17.3 dBm IIP3 • 3.5 dBm Input Power at 1dB gain compression Pin Connection 4 RF_IN • 0.75 dB Bypass IL • ≥ 18 dB Bypass RL 1 23 RF_OUT • ≥ 50 dB isolation @LNA mode 25 24 23 22 21 20 2 3 4 5 6 7 28 EXT_P2 30 EXT_P1 Applications 33 Vdd Others GND 19 8 18 17 16 15 14 13 12 11 10 9 26 Note: Package marking provides orientation and identification “11236” =Device Part Number “WWYY”= Work week and Year of manufacture “XXXX” =Last 4 digit of Lot number • Tower Mount Amplifier (TMA) • Cellular Infrastructure Attention: Observe precautions for handling electrostatic sensitive devices. ESD Machine Model = 300 V ESD Human Body Model = 2000 V Refer to Avago Application Note A004R: Electrostatic Discharge, Damage and Control. Absolute Maximum Rating [1] TA = 25° C Symbol Parameter Units Absolute Max. Vdd Device Voltage, RF output to ground V 5.5 Pin,max CW RF Input Power (Vdd = 5.0 V, Idd = 100 mA) dBm +15 Pdiss Total Power Dissipation [3] W 0.715 Tj Junction Temperature °C 150 TSTG Storage Temperature °C -65 to 150 Thermal Resistance [2] (Vdd = 5.0 V, Idd = 100 mA) θjc = 56.2 °C/W Notes: 1.Operation of this device in excess of any of these limits may cause permanent damage. 2. Thermal resistance measured using Infra-Red Measurement Technique. 3. Power dissipation with unit turned on. Board temperature Tc is 25° C. Derate at 17.8 mW/°C for Tc > 109.8 ° C. Electrical Specifications [1, 4] RF performance at TA = 25° C, Vdd = 5 V, 1785 MHz, measured on demo board in Figure 1 with component listed in Table1 for DC bypass. Symbol Parameter and Test Condition Idd Drain Current Gain Gain IRL Input Return Loss, 50 Ω source ORL Output Return Loss, 50 Ω load NF [2] Noise Figure IIP3 [3] IP1dB Bypass IL Bypass Insertion Loss, 50 Ω load Vdd = 0 V Bypass IRL Frequency (MHz) Units Min. Typ. Max. mA 81 99 117 dB – 14.5 16 15.9 – 17.5 dB – 30 – dB – 28 – dB – – 0.75 0.67 – 0.85 Input Third Order Intercept Point dBm 14 17.3 – Input Power at 1 dB Gain Compression dBm 2.55 3.5 – dB – 0.75 1.1 Input Return Loss, 50 Ω source Vdd = 0 V dB – 19 – Bypass ORL Output Return Loss, 50 Ω load Vdd = 0 V dB – 23 – ISOL Bypass Isolation @LNA ON Vdd = 5 V dB – 56 – 1710 1785 1710 1785 1785 Notes: 1. Measurements at 1785 MHz obtained using demo board described in Figure 1. 2. For NF data, board losses of the input have not been de-embedded. 3. IIP3 test condition: FRF1 = 1785 MHz, FRF2 = 1786 MHz with input power of -15 dBm per tone. 4. Use proper bias, heatsink and derating to ensure maximum channel temperature is not exceeded. See absolute maximum ratings and application note for more details. 2 Product Consistency Distribution Charts[1, 2] LSL 80 USL 85 90 95 100 105 110 115 Figure 1. Idd, LSL = 81 mA , nominal = 99 mA, USL = 117 mA 15 0.7 0.8 Figure 3. NF, nominal = 0.67 dB, USL = 0.85 dB 16 17 Figure 2. Gain, LSL = 14.5 dB, nominal = 15.9 dB, USL = 17.5 dB LSL USL 0.6 USL LSL 13 14 15 16 17 18 19 20 21 22 23 Figure 4. IIP3, LSL = 14 dBm, nominal = 17.3 dBm LSL LSL 3 Figure 5. IP1dB, LSL = 2.55 dBm, nominal = 3.5 dBm 4 -1.1 -1 -0.9 -0.8 -0.7 -0.6 Figure 6. Bypass IL, LSL = 1.1 dB, nominal = 0.75 dB Notes: 1. Distribution data sample size is 1500 samples taken from 3 different wafer lots. Future wafers allocated to this product may have nominal values anywhere between the upper and lower limits. 2. Circuit trace losses have not been de-embedded from measurements above. 3 Vsupply GND Demo Board Layout Avago Technologies Z1 C1 Z2 27 Gnd 28 EXT_P2 30 EXT_P1 31 Gnd 32 Gnd 34 Gnd 33 Vdd 35 Gnd 36 Gnd C3 29 Gnd C2 ALM- 17 18 Gnd Gnd 19 Gnd 16 8 Gnd 20 Gnd Gnd 15 7 Gnd 21 Gnd Gnd 14 6 13 22 Gnd Gnd Gnd 5 Gnd 23 RF_OUT Gnd 12 4 Gnd 24 Gnd RF_IN 11 25 Gnd 3 10 2 Gnd Gnd Gnd Gnd 26 Gnd 9 1 Gnd Gnd rev1gi March'10 Low T.M. MILS W 21.89 G 14.57 H 10 S 60 Figure 7. Demo Board Layout Diagram – Recommended PCB material is 10 mils Rogers RO4350. – Suggested component values may vary according to layout and PCB material. – Copper trace between the 2 pads is removed before Z2 0(ohm) is placed. 4 Demo Board Schematic Vdd (5 V) Z1 Z2 C1 C2 27,29,31,32,34,35,36 EXT_P1 33 EXT_P2 28 30 1,2,3 24,25,26 BIAS 5V 4 50 Ω TL RFin 5V RFout 0V 19,20,21,22 5,6,7,8 9,10,11,12,13,14,15,16,17,18 Module Outline, 7 mm x 10 mm Truth Table Vdd (V) LNA Mode 5 Bypass Mode 0 Fail-safe Mode NC Bypass and Fail-safe mode have similar performance Figure 8. Demo Board Schematic Diagram Table 1. DC component list for 1710-1850 MHz Part Size Value Detail Part Number C1 0805 2.2 mF (Murata) GRM21BR61E225KA12L C2 0402 NU NU Z1 0805 0 Ω (Kamaya) RMC1/8-JPTP Z2 0603 0 Ω (Kamaya) RMC1/16-JPTP Notes: C1 is a DC bypass capacitor. Z1 is 0 Ω resistor or fuse. Z2 is a 0 Ω resistor if an external function block is not used. 5 23 Typical Performance RF performance at TA = 25° C, Vdd = 5 V for LNA mode, Vdd = 0 V for Bypass mode, measured on demo board in Figure 7. Signal = CW unless stated otherwise. Application Test Circuit is shown in Figure 8 and Table 1. IIP3 test condition: FRF1-FRF2 = 1 MHz with input power of -15 dBm per tone. 110 17.0 16.5 16.0 Gain (dB) Idd (mA) 105 100 95 15.5 15.0 14.5 14.0 85° C 25° C -40° C 13.5 90 -40 -30 -20 -10 0 13.0 1.71 10 20 30 40 50 60 70 80 90 Temperature (°C) Figure 9. Idd vs Temperature 1.83 1.85 -15 -20 -25 -15 -20 -25 -30 -30 -35 -35 1.73 1.75 1.77 1.79 Frequency (GHz) 1.81 1.83 -40 1.71 1.85 1.0 0.9 IIP3 (dBm) 0.8 0.7 0.6 0.5 85° C 25° C -40° C 0.4 1.75 Figure 13. NF vs Frequency 1.73 1.75 1.77 1.79 Frequency (GHz) 1.81 1.83 1.85 Figure 12. S22 vs Frequency 1.1 1.73 85° C 25° C -40° C -10 Figure 11. S11 vs Frequency NF(dB) 1.81 -5 S22 (dB) S11 (dB) -10 6 1.77 1.79 Frequency (GHz) 0 85° C 25° C -40° C -5 0.3 1.71 1.75 Figure 10. Gain vs Frequency 0 -40 1.71 1.73 1.77 1.79 Frequency (GHz) 1.81 1.83 1.85 30 28 26 24 22 20 18 16 14 12 10 1.71 85° C 25° C -40° C 1.73 1.75 Figure 14. IIP3 vs Frequency 1.77 1.79 Frequency (GHz) 1.81 1.83 1.85 8.0 -0.5 85° C 25° C -40° C 7.0 -0.7 5.0 Bypass IL (dB) IP1dB(dBm) 6.0 4.0 3.0 1.0 -1.1 1.73 1.75 1.77 1.79 Frequency (GHz) 1.81 1.83 -1.2 1.71 1.85 1.77 1.79 Frequency (GHz) 1.81 1.83 1.85 85° C 25° C -40° C -5 Bypass S22 (dB) Bypass S11 (dB) -10 -15 -20 -25 -30 -10 -15 -20 -25 -30 1.73 1.75 1.77 1.79 Frequency (GHz) 1.81 1.83 1.85 Figure 17. Bypass S11 vs Frequency 85° C 25° C -40° C -35 -40 -45 -50 -55 -60 -65 1.73 1.75 1.77 1.79 Frequency (GHz) Figure 19. Bypass isolation vs Frequency (LNA mode) -35 1.71 1.73 1.75 1.77 1.79 Frequency (GHz) Figure 18. Bypass S22 vs Frequency -30 -70 1.71 1.75 0 85° C 25° C -40° C -5 -35 1.71 1.73 Figure 16. Bypass IL vs Frequency 0 Isolation (dB) -0.9 -1.0 Figure 15. IP1dB vs Frequency 7 -0.8 2.0 0.0 1.71 85° C 25° C -40° C -0.6 1.81 1.83 1.85 1.81 1.83 1.85 Typical Scattering Parameters, Vdd = 5 V, Idd = 99 mA LNA SPAR (100 MHz – 20 GHz) Freq (GHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang) 0.1 -3.25 -107.27 -23.21 -79.05 -22.71 -83.91 -1.16 -65.01 0.5 -3.00 -169.55 -11.32 -88.29 -10.54 -79.80 -5.26 -170.06 1 -4.24 140.37 -12.52 147.68 -12.20 149.76 -7.02 119.52 1.5 -12.31 48.40 12.40 -37.49 -36.01 -46.99 -10.56 161.54 1.6 -16.97 65.15 15.44 -128.51 -34.00 -136.60 -25.65 11.73 1.7 -24.07 79.01 15.94 162.18 -31.68 157.19 -27.03 -148.51 1.72 -25.53 90.10 15.94 150.13 -31.32 146.21 -26.64 -148.30 1.74 -26.23 104.40 15.92 138.54 -31.04 135.63 -25.93 -144.76 1.76 -26.14 119.48 15.88 127.32 -30.78 125.75 -24.72 -141.40 1.78 -25.51 131.31 15.82 116.42 -30.57 115.93 -23.13 -140.89 1.80 -24.77 139.58 15.77 105.87 -30.40 106.49 -21.62 -142.37 1.82 -24.18 144.53 15.70 95.58 -30.24 97.60 -20.37 -145.83 1.84 -23.71 147.79 15.63 85.55 -30.11 88.69 -19.36 -151.26 1.86 -23.44 151.28 15.55 75.76 -29.98 79.99 -18.62 -157.63 1.88 -23.33 155.76 15.48 66.17 -29.90 71.62 -18.02 -164.51 1.90 -23.41 161.23 15.41 56.71 -29.81 63.13 -17.65 -171.55 1.92 -23.59 167.76 15.34 47.39 -29.71 54.92 -17.59 -178.29 1.94 -23.59 175.53 15.27 38.18 -29.64 46.64 -17.84 175.32 1.96 -23.18 -176.41 15.21 29.02 -29.56 38.56 -18.44 168.54 1.98 -22.22 -168.72 15.14 19.89 -29.48 30.36 -19.45 161.59 2 -20.96 -162.17 15.07 10.72 -29.40 21.97 -20.99 155.47 2.5 -15.00 162.88 6.07 162.87 -34.37 -156.98 -3.73 114.98 3 -10.85 -154.58 -9.49 22.90 -43.57 128.72 -1.97 -78.44 3.5 -6.81 -166.19 -23.86 -50.01 -47.26 107.79 -1.36 -158.06 4 -5.38 -179.92 -33.62 -105.76 -48.74 93.11 -1.52 149.58 4.5 -5.20 167.33 -42.09 154.80 -39.86 71.68 -1.80 99.28 5 -5.49 151.70 -37.16 0.38 -35.36 -9.63 -2.32 47.18 5.5 -6.50 138.34 -39.64 -74.83 -39.79 -15.82 -2.65 -24.58 6 -9.04 138.64 -36.13 -123.84 -28.33 -59.33 -2.46 -112.48 7 -0.87 133.48 -35.53 82.60 -30.74 56.93 -1.19 138.77 8 -0.72 98.99 -32.61 14.23 -33.29 10.82 -0.91 81.55 9 -1.08 75.89 -42.13 -63.92 -46.94 -78.34 -0.84 24.04 10 -2.94 40.90 -32.76 -28.80 -30.96 -21.81 -1.01 -12.07 11 -8.17 56.49 -31.07 -138.74 -29.87 -166.30 -1.97 -40.53 12 -5.11 5.66 -27.00 95.32 -27.61 92.07 -2.41 -68.06 13 -4.98 -12.88 -22.34 -34.76 -21.84 -29.64 -2.19 -96.12 14 -4.67 -42.69 -27.80 176.43 -27.00 -169.90 -2.02 -124.43 15 -20.78 -13.30 -26.22 -120.01 -27.34 -125.25 -3.33 -164.81 16 -11.64 25.55 -24.57 76.02 -23.99 75.45 -7.91 20.18 17 -6.43 -45.98 -18.99 4.64 -18.62 3.85 -4.86 -95.73 18 -6.65 -74.39 -28.60 -111.22 -27.51 -115.30 -11.29 -153.90 19 -2.22 -90.91 -28.40 -103.98 -28.35 -105.75 -3.64 -129.24 20 -4.95 -112.35 -15.78 168.58 -15.77 168.73 -10.94 -140.02 8 PCB Layout and Stencil Design 9.795 9.765 0.845 (pitch) 0.50 3.65 0.845 (pitch) 6.770 4.50 0.47 1.0375 6.80 5.20 0.50 8.10 0.20 1.0375 Pin 1 0.845 (pitch) Pin 1 0.845 (pitch) 0.47 Stencil Opening Land Pattern 0.845 0.845 (pitch) Pin 1 1.0375 Metal Combination of Land Pattern and Stencil Opening Part Number Ordering Information Part Number No. of Devices Container ALM-11236-TR1G 1000 13” Reel ALM-11236-BLKG 100 antistatic bag 9 Soldermask Open Note : 1. Recommended Land Pattern & Stencil Opening. 2. Stencil thickness is 0.1 mm (4 mils) 3. All dimension are in MM unless otherwise specified MCOB 7 x 10 Package Dimensions Pin1 Identification 10.00±0.10 AVAGO 12236 WWYY XXXX 1.50±0.10 7.00±0.10 1.12 Top View 0.50 Side View 0.845 (pitch) Pin 1 0.50 0.10 0.05 (SM to metal gap) 0.845 (pitch) R0.15 5.20 Bottom SM 8.10 Bottom Metal 1.0375 Notes: 1. All dimensions are in milimeters 2. Dimensions are inclusive of plating 3. Dimensions are exclusive of mold flash and metal burr Bottom View Device Orientation REEL USER FEED DIRECTION CARRIER TAPE AVAGO 11236 WWYY XXXX TOP VIEW USER FEED DIRECTION COVER TAPE 10 AVAGO 11236 WWYY XXXX AVAGO 11236 WWYY XXXX END VIEW Tape Dimensions 12.00 ± 0.10 2.00 ± 0.10 4.00 ± 0.10 1.75 ± 0.10 Ø 1.50 + 0.10 11.50 ± 0.10 24.00 + 0.30 − 0.10 Ø 1.50 + 0.25 0.318 ± 0.02 5° MAX 8° MAX 7.32 ± 0.10 A. 11 10.49 ± 0.10 2.06 ± 0.10 K. B. Reel Dimensions - 13” Reel ESD Label (See Below) Recycle Symbol Detail ‘X’ Embossed Line X2 90.0mm Length Lines 147.0mm away from center point Embossed ‘M’ 5.0mm Height FRONT VIEW Ø20.2 (Min) 25.65±1.75** 25.4±1.0* Recycle Symbol +0.5 Ø13.1 -0.2 2.2±0.5 See Detail ‘X’ FRONT BACK Ø100.0±0.5 Ø331.5 Max Detail ‘X’ 1.0 BACK VIEW Detail ‘Y’ Slot 10.0±0.5(2x) Slot 5.0±0.5***(1x) 4.0 30.4* Max For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2013 Avago Technologies. All rights reserved. AV02-2848EN - June 18, 2013 Detail ‘Y’ (Slot Hole)