ABS2 THRU ABS10 SINGLE PHASE GLASS PASSIVATED BRIDGE RECTIFIERS Voltage Range - 200 to 1000 Volts Current - 0.8/1.0 Ampere FEATURES ABS Ideal for printed circuit board Reliable low cost construction utilizing molded plastic technique High temperature soldering guaranteed: 260 /10 seconds at 5 lbs., (2.3kg) tension Small size, simple installation High surge current capability Glass passivated chip junction MECHANICAL DATA Case: Molded plastic body Terminals: Plated leads solderable per MIL-STD-750, Method 2026 Polarity: Polarity symbols marked on case Mounting Position: Any Dimensions in inches and (millimeters) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25 ambient temperature unless otherwise specified. Single phase half-wave 60Hz,resistive or inductive load, for capacitive load derate current by 20%. MDD Catalog Number Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current On glass-epoxy P.C.B.(Note1) On aluminum substrate(Note2) Peak forward surge current, 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) Maximum instantaneous forward voltage drop per leg at 0.4A Maximum DC reverse current TA=25 at rated DC blocking voltage TA=100 Typical thermal resistance(NOTE 3) Operating temperature range storage temperature range SYMBOLS ABS2 ABS4 ABS6 ABS8 ABS10 UNITS VRRM VRMS VDC 200 140 200 400 280 400 600 420 600 800 560 800 1000 700 1000 VOLTS VOLTS VOLTS IF(AV) 0.8 1.0 Amps IFSM 30 Amps VF 0.95 Volts uA uA R JL 5 100 25 R JA 80 IR TJ TSTG /W -55 to +150 -55 to +150 NOTES:1.On glass epoxy P.C.B. mounted on 0.05x0.05''(1.3x1.3mm) pads 2.On aluminum substrate P.C.B. with on area of 0.8''x0.8''(20x20mm) mounted on 0.05X0.05''(1.3X1.3mm) solder pad 3.Thermal resistance form junction to ambient and junction to lead mounted on P.C.B. with 0.2X0.2''(5X5mm) copper pads. MDD ELECTRONIC RATINGS AND CHARACTERISTIC CURVES ABS2 THRU ABS10 Instantaneous Forward Current, (A) FIG.1 TYPICAL FORWARD CHARACTERISTICS FIG.2 FORWARD DERATING CURVE 1.0 1.0 Average Forward Rectified Current, (A) Aluminum Substrate 0.4 0.1 0.75 GLASS EPOXY P.C.B 0.5 0.25 RESISTIVE OR INDUCTIVE LOAD 0.01 0 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 0 Instantaneous Forward Voltage, ( V ) FIG.3 TYPICAL REVERSE CHARACTERISTICS 50 75 100 125 150 Ambient Temperature, (°C ) FIG.4 PEAK FORWARD SURGE CURRENT 35 Peak Forward Surge Current, (A) 100000 Instantaneous Reverse Leakage Current, ( A) 25 10000 1000 TA=100°C 100 TA=25°C 10 30 25 20 15 10 1.0 5 0 0 20 40 60 80 100 120 140 Percent Of Rated Peak Reverse Voltage, % MDD ELECTRONIC 1 10 Number Of Cycles At 60Hz 100