CHENDA DSR0.3M

DSR0.3A THRU DSR0.3M
Surface Mount Standard Rectifiers
Reverse Voltage - 50 to 1000 Volts
Forward Current - 0.3 Ampere
Features
Low profile space
Ideal for automated placement
Glass passivated chip junctions
Low forward voltage drop
Low leakage current
High forward surge capability
High temperature soldering:
260℃/10 seconds at terminals
Component in accordance to
RoHS 2002/95/1 and WEEE 2002/96/EC
SOD-123FL
1.8± 0.1
1.0±0.2
Cathode Band
Top View
1.3± 0.15
0.10-0.30
2.8±0.1
0.6±0.25
Mechanical Date
Case: JEDEC SOD-123FL molded plastic
body over glass passivated chip
Terminals: Solder plated, solderable per
J-STD-002B and JESD22-B102D
Polarity: Laser band denotes cathode end
Weight: 0.017gram
3.7±0.2
Dimensions in millimeters
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 C ambient temperature unless otherwise specified.
Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.
SYMBOLS
Maximum repetitive peak reverse voltage
VRRM
Maximum RMS voltage
VRMS
Maximum DC blocking voltage
VDC
Maximum average forward rectified current
I(AV)
at TA=65 C (NOTE 1)
Peak forward surge current
IFSM
8.3ms single half sine-wave superimposed on
rated load (JEDEC Method) TL=25 C
VF
Maximum instantaneous forward voltage at 0.3A
Maximum DC reverse current
TA=25 C
IR
at rated DC blocking voltage
TA=100 C
Typical junction capacitance (NOTE 2)
CJ
Typical thermal resistance (NOTE 3)
RθJA
Operating junction and storage temperature range TJ,TSTG
S03A
S03B
S03D
S03G
S03J
S03K
S03M
UNITS
50
35
50
100
70
100
200
140
200
400
280
400
600
420
600
800
560
800
1000
700
1000
VOLTS
VOLTS
VOLTS
0.3
Amp
15.0
Amps
1.1
Volts
5.0
50.0
µA
4
220
-55 to +150
pF
K/W
C
Note1: Mounted on FR-4 P.C.B. With 0.9x1.5 mm copper pad areas (≈35 μm thick)
MDD ELECTRONIC
RATINGS AND CHARACTERISTIC CURVES DSR0.3A THRU DSR0.3M
Characteristic Curves (TA=25 ℃ unless otherwise noted)
MDD ELECTRONIC