ES2A THRU ES2M
SURFACE MOUNT SUPER FAST RECTIFIER
Reverse Voltage - 50 to 1000 Volts Forward Current - 2.0 Amperes
DO-214AA
(HSMB) (Round Lead)
FEATURES
Compliant (Note1) ("P"Suffix designates
Free
Finish/Rohs
Lead
Compliant.
See
ordering information)
Case
Material:
Molded Plastic. UL Flammability
H
Cathode Band
Classification Rating 94V-0 and MSL rating 1
Easy Pick And Place
High Temp Soldering: 260°C for 10 Seconds At Terminals
Ultrafast Recovery Times For High Efficiency
J
A
E
C
D
B
F
MECHANICAL DATA
G
DIMENSIONS
INCHES
DIM
A
B
C
D
E
F
G
H
J
MIN
.078
.075
.002
----.035
.065
.205
.160
.130
Case: JEDEC DO-214AA molded plastic body over passivated chip
Terminals: Solder plated, solderable per MIL-STD-750,
Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight :0.005 ounce, 0.138 grams
MM
MAX
.116
.089
.008
.02
.055
.091
.224
.180
.155
MIN
1.98
1.90
.05
----.90
1.65
5.21
4.06
3.30
MAX
2.95
2.25
.20
.51
1.40
2.32
5.69
4.57
3.94
NOTE
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 C ambient temperature unless otherwise specified.
Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.
SYMBOLS
MDD Catalog Number
Maximum repetitive peak reverse voltage
VRRM
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
at TL=55 C
Peak forward surge current
8.3ms single half sine-wave superimposed on
rated load (JEDEC Method)
Maximum instantaneous forward voltage at 2.0A
Maximum DC reverse current
TA=25 C
at rated DC blocking voltage
TA=100 C
Maximum reverse recovery time
(NOTE 1)
Typical junction capacitance (NOTE 2)
VRMS
VDC
Typical thermal resistance (NOTE 3)
Operating junction and storage temperature range
ES2A ES2B ES2C
50
35
50
100
70
100
150
105
150
ES2D ES2E
200
140
200
300
210
300
ES2G
ES2J
ES2K
ES2M
UNITS
400
280
400
600
420
600
800
560
800
1000
700
1000
VOLTS
VOLTS
VOLTS
I(AV)
2.0
Amps
IFSM
50.0
Amps
VF
0.975
IR
trr
1.35
1.7
5.0
150.0
50
CJ
RθJA
TJ T, STG
Note:1.Reverse recovery condition IF=0.5A,IR=1.0A,Irr=0.25A
2.Measured at 1MHz and applied reverse voltage of 4.0V D.C.
3.Pulse test: Pulse width 200 sec, Duty cycle 2%
4.High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
MDD ELECTRONIC
µA
60
25.0
20.0
-50 to +150
Volts
100
ns
pF
C/W
C
RATINGS AND CHARACTERISTIC CURVES ES2A THRU ES2M
Figure 1
Typical Forward Characteristics
20
Figure 2
Forward Derating Curve
ES2G-2J
10
2.4
6
2.2
ES2A-2D
4
ES2K-2M
2.0
1.8
2
Amps
1.6
1
1.4
1.2
.6
Amps
.4
1.0
.2
.6
.8
.4
.1
Single Phase, Half Wave
.2 60Hz Resistive or Inductive Load
.06
0
.04
0
25
50
75
100
125
150
°C
.02
.01
.4
.8
1.2
1.6
Volts
2.0
Average Forward Rectified Current - Amperesversus
Ambient Temperature - °C
2.4
Instantaneous Forward Current - Amperes versus
Instantaneous Forward Voltage - Volts
Figure 3
Junction Capacitance
100
60
40
20
pF
TJ=25°C
10
6
4
2
1
.1
.2
.4
1
Volts
2
4
10
20
40
Junction Capacitance - pFversus
Reverse Voltage - Volts
MDD ELECTRONIC
100
200
400
1000
RATINGS AND CHARACTERISTIC CURVES ES2A THRU ES2M
Figure 4
Peak Forward Surge Current
Figure 5
New SMB Assembly
50
40
30
Amps
20
Round Lead
Process
10
0
1
2
4
6
8 10
20
40
60 80 100
Cycles
Peak Forward Surge Current - Amperesversus
Number Of Cycles At 60Hz - Cycles
Figure 6
Reverse Recovery Time Characteristic And Test Circuit Diagram
50Ω
10Ω
trr
+0.5A
0
Pulse
Generator
Note 2
25Vdc
1Ω
Oscilloscope
Note 1
-0.25
-1.0
1cm
Set Time Base for 20/100ns/cm
Notes:
1. Rise Time = 7ns max.
Input impedance = 1 megohm, 22pF
2. Rise Time = 10ns max.
Source impedance = 50 ohms
3. Resistors are non-inductive
MDD ELECTRONIC